The XIAO RP2350 packs the power of the Raspberry Pi RP2350 (switchable architecture of dual Arm Cortex-M33 cores running at 150MHz with FPU, and dual open-hardware Hazard3 RISC‑V cores, enhanced security and encryption) into the classic XIAO form factor. Measuring just 21x17.5mm, it features 19 multifunction GPIOs, an RGB LED, and a Battery Management System with ultra-low power consumption of 27μA, battery power supply, and direct battery voltage measurement. Thanks to the XIAO ecosystem, the XIAO RP2350 is compatible with a wide range of add-ons, including displays, LED matrix, Grove modules, CAN Bus, Vision AI sensors, and mmWave sensors. With native support for MicroPython, C, and C++, the XIAO RP2350 is perfect for developers of all levels looking to create compact, battery-powered applications for smart control, wearables, DIY keyboards, and more.

Voice Processor IC for far-field voice capture and audio processing, integrating AI, DSP, control, and I/O functions in a single device. It supports up to four PDM microphones, USB and I²S audio interfaces, operates with 3.3 V I/O, and is housed in a 60-pin QFN package, with integrated voice-processing functions including acoustic echo cancellation, beamforming, and post-processing. #XMOS #VoiceProcessor #AudioDSP #FarFieldVoice #PDMMicrophone #USBAudio #I2S #QFN60 #3V3IO #EmbeddedAudio

System On Chip (SOC) IC It integrates multiple processing units including CPUs, DSPs, AI accelerators, and GPU into a single chip to handle vision processing, deep learning, sensor fusion, and real-time control in automotive and industrial systems. • C7x floating point, vector DSP, up to 1.0GHz, 80 GFLOPS, 256 GOPS • Deep-learning matrix multiply accelerator (MMA), up to 8 TOPS (8b) at 1.0GHz • Vision Processing Accelerators (VPAC) with Image Signal Processor (ISP) and multiple vision assist accelerators • Depth and Motion Processing Accelerators (DMPAC) • Dual 64-bit Arm® Cortex®-A72 microprocessor subsystem at up to 2.0GHz – 1MB shared L2 cache per dual-core Cortex®- A72 cluster – 32KB L1 DCache and 48KB L1 ICache per Cortex®-A72 core • Six Arm® Cortex®-R5F MCUs at up to 1.0GHz – 16K I-Cache, 16K D-Cache, 64K L2 TCM – Two Arm® Cortex®-R5F MCUs in isolated MCU subsystem – Four Arm® Cortex®-R5F MCUs in general compute partition • Two C66x floating point DSP, up to 1.35GHz, 40GFLOPS, 160GOPS • 3D GPU PowerVR® Rogue 8XE GE8430, up to 750MHz, 96GFLOPS, 6Gpix/sec • Custom-designed interconnect fabric supporting near max processing entitlement Memory subsystem: • Up to 8MB of on-chip L3 RAM with ECC and coherency – ECC error protection – Shared coherent cache – Supports internal DMA engine • External Memory Interface (EMIF) module with ECC – Supports LPDDR4 memory types – Supports speeds up to 4266MT/s – 32-bit data bus with inline ECC • General-Purpose Memory Controller (GPMC) • 512KB on-chip SRAM in MAIN domain, protected by ECC #CommonPartsLibrary #IntegratedCircuit

RF System on a Chip - SoC Cortex-M55 250MHz, 2.5D GPU, 4MB MRAM, 3.75MB SRAM, BLE5.4, -20 to +70 C, BGA , 1.71 V to 2.2 V -20C ~ 70C ARM® Cortex®-M55 System On Chip (SOC) IC Apollo510B 250MHz The AP510BFA-CBR is an ultra-low-power MCU System-on-Chip (SoC) designed for advanced embedded and edge-AI applications. It belongs to the Apollo510B series and integrates a powerful ARM Cortex-M55 processor optimized for both performance and energy efficiency. It combines processing, memory, and multiple peripherals into a single BGA package, making it suitable for compact and power-sensitive designs. Key Characteristics Core: ARM Cortex-M55 Max CPU Speed: 250 MHz Architecture: MCU / SoC Flash Memory: 4 MB RAM: ~3.75 MB Connectivity: I2C, SPI, UART, USB Wireless Support: Bluetooth 5.4 (variant dependent) Package: 153-BGA (compact high-density package) Key Features Built on Ambiq’s ultra-low-power SPOT technology Designed for battery-powered and energy-sensitive devices High computational performance for edge AI and DSP workloads Integrated peripherals for embedded system development Typical Applications Wearables (smartwatches, fitness bands) Smart home and IoT devices Edge AI / machine learning nodes Industrial sensors and monitoring systems Wireless communication modules #CommonPartsLibrary #IntegratedCircuit #SoC #Apollo510B

The Bosch BME688 is a state-of-the-art digital low power gas, pressure, temperature, and humidity sensor that integrates Artificial Intelligence (AI) capabilities, making it the first of its kind in the market. Housed in a compact 3.0 x 3.0 x 0.9 mm³ metal lid LGA package, it is designed to meet the demands of mobile and connected applications where size and power consumption are critical factors. The sensor is capable of detecting Volatile Organic Compounds (VOCs), volatile sulfur compounds (VSCs), carbon monoxide, and hydrogen in the part per billion (ppb) range. Building on the features of the BME680, the BME688 introduces a gas scanner function that enhances its sensitivity, selectivity, data rate, and power consumption for specific applications. With the help of Bosch AI-Studio tool, customers can train the BME688 gas scanner for their specific needs, making it an ideal choice for a wide range of applications including indoor air quality measurement, detection of bad breath or spoiled food, early odor detection, and smart home devices among others. The BME688 operates within a supply voltage range of 1.71 V to 3.6 V and offers various modes of operation to balance power consumption and measurement responsiveness, catering to both portable and stationary applications.

Edge Compact Fanless Embedded AI System with NVIDIA® Jetson Orin Nano™

PCB silkscreen logo of CyberBrain size 17x20mm #skral #ai #CyberBrain #logo

PCB silkscreen logo of BB eye camera size 17x21mm #skral #ai

Bluetooth, WiFi 802.11b/g/n, Bluetooth v5.0 Transceiver Module 2.4GHz PCB Trace Surface Mount The ESP32-S3-WROOM-1-N8R8 is a high-performance Wi-Fi and Bluetooth Low Energy (BLE) module from Espressif Systems, designed for advanced IoT, edge AI, smart devices, industrial automation, and embedded applications. It is based on the ESP32-S3 SoC featuring a dual-core Xtensa® LX7 processor running up to 240 MHz, integrated wireless connectivity, and enhanced AI acceleration capabilities. The N8R8 variant includes 8 MB Flash memory and 8 MB Octal SPI PSRAM, making it suitable for memory-intensive applications such as machine learning, image processing, graphical user interfaces, and data logging. Key Features Dual-core 32-bit Xtensa LX7 CPU operating up to 240 MHz Integrated 2.4 GHz Wi-Fi (802.11 b/g/n) Bluetooth 5 LE (Low Energy) support 8 MB Flash memory 8 MB Octal SPI PSRAM Vector instructions and hardware acceleration for AI/ML workloads Integrated PCB trace antenna USB OTG and USB Serial/JTAG support Rich peripheral set including: GPIO ADC UART SPI I²C I²S PWM USB Operating voltage: 3.0 V to 3.6 V Wireless data rates up to 150 Mbps RF output power up to 20.5 dBm High receiver sensitivity down to –104.5 dBm Surface-mount 41-pin module package Industrial operating temperature range up to -40°C to +85°C (module-dependent specification) #Module #RF-Transceiver #Esp32

WiFi 802.11a/b/g/n, Bluetooth v5.0 Transceiver Module 2.4GHz PCB Trace The ESP32-S3-WROOM-1-N8R2 is a compact, low-power Wi-Fi and Bluetooth® Low Energy (BLE) module developed by Espressif Systems. It is based on the ESP32-S3 system-on-chip (SoC), which integrates a dual-core Xtensa® LX7 processor optimized for high performance and edge AI processing. This module includes 8 MB of external SPI flash memory and 2 MB of PSRAM, enabling efficient handling of memory-intensive applications such as graphical interfaces, buffering, and embedded machine learning workloads. Designed for flexibility and scalability, the module integrates RF components, power management, and a wide range of peripherals into a surface-mount package suitable for IoT, industrial, and consumer electronics applications. Key Features Dual-core Xtensa® LX7 processor operating up to 240 MHz Integrated 2.4 GHz Wi-Fi (802.11 b/g/n) Bluetooth 5 Low Energy support Embedded 8 MB SPI flash memory Integrated 2 MB PSRAM AI acceleration through vector instruction support USB OTG (full-speed) capability Multiple low-power operating modes Built-in hardware security features Extensive peripheral interface support Functional Overview The module consists of several integrated subsystems, including a dual-core processing unit, memory subsystem (flash and PSRAM), RF subsystem for wireless communication, peripheral interface controllers, power management circuitry, and a hardware-based security engine. Electrical Characteristics Operating voltage range: 3.0 V to 3.6 V (typical 3.3 V) Operating temperature range: -40°C to +85°C RF operating frequency: 2.4 GHz Current consumption varies depending on operating mode, ranging from microamp levels in deep sleep to hundreds of milliamps during active transmission Processor and Memory The module features a dual-core Xtensa® LX7 CPU capable of running at frequencies up to 240 MHz. It includes approximately 512 KB of internal SRAM, supplemented by 8 MB of external flash memory and 2 MB of PSRAM for extended data storage and processing. Wireless Connectivity The ESP32-S3-WROOM-1-N8R2 supports Wi-Fi communication compliant with 802.11 b/g/n standards in the 2.4 GHz band. It also supports Bluetooth 5 Low Energy for short-range wireless communication. The module includes an integrated PCB antenna and supports RF output power up to approximately +20 dBm. Peripheral Interfaces The module provides a wide range of interfaces, including general-purpose input/output (GPIO) pins, SPI, I2C, UART, and I2S for audio applications. It also supports PWM for LED control, a 12-bit analog-to-digital converter (ADC), and USB OTG functionality. Pin functions are multiplexed to maximize flexibility. Power Management Power efficiency is achieved through multiple operating modes, including active mode, modem sleep, light sleep, and deep sleep. The module includes an RTC subsystem for low-power timekeeping and supports dynamic frequency scaling to optimize performance and energy consumption. Security Features The module incorporates several hardware-based security mechanisms, including secure boot, flash encryption, and digital signature verification. It also includes a hardware random number generator and cryptographic accelerators supporting AES, SHA, RSA, and ECC algorithms. Mechanical Characteristics The module is designed for surface-mount integration and measures approximately 18 mm by 25.5 mm. It includes an onboard PCB antenna and is suitable for compact embedded designs. Pin Configuration Overview GPIO pins are multiplexed to support various peripheral functions such as analog inputs, communication interfaces, and control signals. Dedicated pins are provided for power supply, module enable, and boot configuration. Typical Applications Internet of Things (IoT) devices Smart home systems Industrial automation and monitoring Edge AI and machine learning applications Wearable electronics Audio and multimedia systems USB-enabled embedded devices Compliance The module is designed to meet Wi-Fi and Bluetooth standards and is compliant with RoHS requirements. Certification such as FCC or CE may apply depending on the specific module variant and deployment. Ordering Information The ESP32-S3-WROOM-1-N8R2 variant includes 8 MB of flash memory and 2 MB of PSRAM. #commonpartslibrary #integratedcircuit #transceiver #wireless #rf

The ESP32-S3-WROOM-1-N16R8 is a high-performance Wi-Fi and Bluetooth Low Energy (BLE) module from Espressif Systems, built around the ESP32-S3 SoC. It integrates a dual-core Xtensa® LX7 processor running at up to 240 MHz, along with 16 MB Quad SPI Flash and 8 MB Octal SPI PSRAM, making it suitable for memory-intensive embedded, IoT, AIoT, multimedia, and edge AI applications. The module includes an onboard PCB antenna, RF matching circuitry, crystal oscillator, and flash/PSRAM, simplifying hardware design and reducing development time. Key Features Dual-core Xtensa LX7 CPU operating up to 240 MHz 16 MB onboard Flash memory 8 MB onboard Octal PSRAM for large buffers, graphics, and AI workloads 2.4 GHz Wi-Fi (IEEE 802.11 b/g/n) Bluetooth 5.0 Low Energy (BLE) Built-in support for AI acceleration and vector instructions for machine learning and signal processing applications Rich peripheral set including: GPIO UART SPI I²C I²S USB 2.0 OTG PWM ADC Touch sensing SD/MMC interface CAN (TWAI) Integrated USB Serial/JTAG debugging capability Supply voltage range: 3.0 V to 3.6 V Operating temperature: −40°C to +65°C Surface-mount module with integrated PCB antenna Supports secure boot, flash encryption, and hardware cryptographic acceleration for secure IoT devices. Typical Applications Smart home and IoT devices Edge AI and machine learning Voice assistants and speech recognition Industrial automation Human-machine interfaces (HMI) Wireless sensors and gateways Smart displays and touch panels Audio streaming and multimedia devices Robotics and connected products #RF-Transceiver #Module #ESP32

ESP32-S3-WROOM-1-N8 is a high-performance Wi-Fi and Bluetooth Low Energy (BLE) module from Espressif Systems. It is built around the ESP32-S3 SoC, featuring a dual-core Xtensa LX7 processor, integrated 2.4 GHz Wi-Fi and Bluetooth 5 LE connectivity, 8 MB SPI flash memory, and a PCB antenna. The module is optimized for AIoT, edge computing, human-machine interfaces, smart devices, and industrial IoT applications. Key Features Dual-core Xtensa® LX7 CPU running up to 240 MHz for high-performance embedded applications. 8 MB onboard SPI Flash (N8 variant) for firmware and data storage. 2.4 GHz Wi-Fi (802.11 b/g/n) with data rates up to 150 Mbps. Bluetooth 5 LE support including: Long Range mode 2 Mbps PHY Bluetooth Mesh Extended Advertising AI acceleration support through ESP32-S3 vector instructions for machine learning and signal-processing workloads. USB 1.1 OTG and USB Serial/JTAG integrated, simplifying debugging and USB device applications. Up to 45 GPIOs with extensive peripheral support: SPI I²C I²S UART PWM ADC Touch Sensors TWAI® (CAN-compatible) Camera Interface LCD Interface SDIO Host MCPWM Integrated 40 MHz crystal oscillator, RF matching circuitry, and PCB antenna for reduced external component count. Operating voltage range: 3.0 V to 3.6 V. Compact surface-mount module suitable for space-constrained designs. Typical Applications Smart home and home automation devices HMI displays and touchscreen products Voice recognition and audio processing Edge AI and machine learning applications Industrial IoT gateways and sensors Video streaming and camera systems USB-connected embedded devices Smart agriculture and healthcare equipment N8 specifically indicates 8 MB Flash and no PSRAM, making it a good choice for applications requiring substantial program storage but not large external RAM. #RF-transceiver #Module #ESP32

M.2 CONN.P=0.5 6.7mm H conn The 91302-67-067R2M is a 67-position M.2 (NGFF) card-edge connector manufactured by UMAX. It is designed for connecting M.2 SSDs and PCIe-based expansion modules to a host PCB. The connector features an M-Key interface, making it suitable for high-speed PCIe storage applications such as NVMe solid-state drives. It is a surface-mount, right-angle receptacle with a 0.5 mm contact pitch and a 6.7 mm height above the PCB. Key Features M.2 M-Key connector Supports M-Key M.2 modules, commonly used for PCIe/NVMe SSDs. 67 contacts (67P) Standard pin count for M-Key M.2 card-edge connections. 0.5 mm pitch Fine-pitch design suitable for compact, high-density PCB layouts. Surface-mount, right-angle mounting Optimized for automated PCB assembly and low-profile system designs. 6.7 mm connector height Provides compatibility with standard M.2 card installation requirements. Female card-edge receptacle Accepts M.2 modules directly without additional adapters. RoHS compliant Meets environmental requirements for lead-free electronic assemblies. Typical Applications NVMe SSD sockets PCIe M.2 storage devices Embedded computing systems Industrial PCs Networking equipment Edge AI and IoT gateways Single-board computers requiring M.2 expansion #CommonPartsLibrary #Connector

IC RF TxRx + MCU Bluetooth, WiFi 802.11b/g/n, Bluetooth v5.0 2.412GHz ~ 2.484GHz 56-VFQFN Exposed Pad The ESP32-S3R8 is a high-performance wireless microcontroller system-on-chip manufactured by Espressif Systems. This device integrates dual-core processing, Wi-Fi connectivity, Bluetooth Low Energy communication, embedded memory resources, and advanced peripheral interfaces within a compact package optimized for embedded and IoT applications. The microcontroller is based on the Xtensa LX7 architecture and is designed to support edge computing, wireless communication, human-machine interfaces, audio processing, AI acceleration, and low-power connected systems. The ESP32-S3R8 includes integrated flash and RAM resources, advanced security functions, vector instruction acceleration, and extensive GPIO/peripheral capability for modern embedded development. The device is widely used in IoT devices, industrial automation systems, smart home equipment, wearable electronics, wireless sensor nodes, edge AI applications, USB-enabled embedded systems, and portable consumer electronics. Its integrated wireless functionality and high processing performance reduce external component count while simplifying system-level design for connected embedded platforms. Engineering Specification Device Type Wireless microcontroller system-on-chip Processor Architecture Dual-core Xtensa LX7 microcontroller architecture Wireless Connectivity Integrated Wi-Fi and Bluetooth Low Energy communication Processing Features High-performance embedded processing with vector instruction acceleration Memory Resources Integrated RAM and embedded memory architecture Communication Interfaces SPI I2C UART I2S USB PWM ADC GPIO interfaces Wireless Features Secure wireless networking and low-power communication support USB Capability Integrated USB communication and device functionality AI and DSP Features Vector instruction support for AI and digital signal processing workloads Security Features Hardware encryption and secure boot support Power Characteristics Low-power operating modes for battery-powered systems Package Type QFN surface-mount package Mounting Style Surface mount technology Applications IoT devices Wireless embedded systems Industrial automation Smart home electronics Edge AI applications Wearable devices Consumer electronics USB-enabled systems Sensor networks Embedded communication platforms Manufacturer Espressif Systems #commonpartslibrary #esp32 #esp32s3 #wirelessmcu #microcontroller #iot #embeddedhardware #wifi #bluetoothlowenergy #espressif #surfaceountcomponents #electronicsdesign #edgeai #wirelesscommunication #consumerelectronics

Dual-Core Crossover MCU with Arm® Cortex®-M7 and Cortex®-M4 Cores – High-performance crossover microcontroller designed for industrial automation, edge AI, HMI, motor control, robotics, audio processing, IoT gateways, medical devices, and advanced embedded systems. The NXP MIMXRT1173CVM8A integrates an Arm® Cortex®-M7 core running up to 800 MHz and an Arm® Cortex®-M4 core running up to 400 MHz, delivering real-time performance without an external operating system. It features 2 MB on-chip SRAM with support for external program memory, making it suitable for graphics, audio, and complex control applications. The device includes 20-channel 12-bit SAR ADCs, 12-bit DAC, 10/100 Ethernet, USB 2.0 OTG, CAN FD, SD/MMC, I²C, SPI, UART/USART, SAI, SPDIF, LCD interface, camera interface, PWM, DMA, watchdog timers, temperature sensor, and extensive external memory interfaces (SEMC/FlexSPI). It also provides Secure Boot, AES, SHA, TRNG, tamper detection, and other hardware security features for secure embedded applications. Operates from 1.65–1.95 V core and 3.0–3.6 V I/O supplies, over a −40°C to +105°C junction temperature range, and is housed in a 289-ball MAPBGA (14 × 14 mm) package. The MIMXRT1173CVM8A is currently Not Recommended for New Designs (NRND), with MIMXRT1173CVM8B listed as the recommended replacement. #NXP #MIMXRT1173CVM8A #iMXRT1170 #CortexM7 #CortexM4 #DualCoreMCU #CrossoverMCU #IndustrialAutomation #EdgeAI #MotorControl #EmbeddedSystems