NEMA17 PCB Design Optimization
0:00
Work completed
- U2: footprint set to QFN-28 EP 5×5 mm, 0.5 mm pitch
- U3 and U4: footprints set to SOIC-8 3.9 mm
- U5: footprint set to SOIC-8-EP 4.9×6.0 mm
- PCB outline changed to 42.3 mm × 42.3 mm
- Added four M3 mounting holes: Hole1, Hole2, Hole3, Hole4 at ±15.5 mm
- Project property “Stackup” set to JLC 2-layer 1 oz
- Project property “Copper Planes” set to bottom solid GND
Tasks not done
- Modify footprint of U1 to LQFP-48 0.5 mm pitch
- Add a 22 mm diameter copper keep-out region
- Add a 26 mm tall-part keep-out region
- Center U3 and add bullseye silkscreen overlay
- Add thermal-via arrays under the exposed pads of U2 and U5
- Validate EMC separation (CAN di/dt areas, sensor isolation, CAN-pair clearance, decoupler placement)
- Run ERC and DRC checks and document violations
Success criteria review
- Footprints for U2–U5: ✅ met, U1 still pending
- Board outline & four M3 holes: ✅ outline and holes done, central keep-outs missing
- U3 centering & bullseye: ❌ not done
- 2-layer 1 oz stackup & bottom GND plane: ✅ met
- PGND islands, stitching vias & sensor no-copper donut: ❌ not implemented
- Thermal vias & EMC separation: ❌ not implemented
- ERC/DRC violations cleared: ❌ not performed
Next step
Implement the mechanical keep-outs (22 mm copper, 26 mm tall-part) and center U3 with a bullseye silkscreen marker.
184 days
1:31
Accessing knowledge base.
I’ll proceed with your requested updates. Plan to run now:
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Mechanics: keep 42.3 mm outline; 4×M3 @ 31 mm; add Ø22 mm copper and Ø26 mm tall‑part keep‑outs; center U3 with bullseye silk.
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Thermal/EMC: add EP thermal via arrays; maintain CAN pair clearance from switching loops; tighten decouplers to pins.
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Verify: run ERC/DRC and resolve issues; report deltas.
Click Start on the plan bar to execute.
Plan
Goal
- Execute comprehensive layout updates to validate and update footprints for U1–U5, enforce mechanical constraints (42.3 mm board outline, mounting holes, copper and tall-part keep-out zones), and configure the PCB stackup with bottom solid GND plane, PGND islands with stitching vias, thermal via arrays under exposed pads, and specific sensor constraints. Additionally, center the AS5600 (U3) with a bullseye silk marker, verify CAN pair clearance and optimize decoupler placement, and run ERC/DRC to resolve issues.
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Footprint Validation and Updates
- Validate and update the footprints for:
- U1 (STM32G0B1) footprint conversion to LQFP-48 0.5 mm pitch
- U2 (TMC2209-LA) using QFN-28 EP, 5×5 mm dimensions and 0.5 mm pitch pads
- U3 (AS5600-ASOM) and U4 (SN65HVD230D) as SOIC‑8 with 3.9 mm pitch
- U5 (MP1584EN-LF-P) as SOIC‑8‑EP with 4.9×6.0 mm dimensions
- Ensure each updated footprint adheres to design tolerances in the project context.
- Validate and update the footprints for:
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Mechanical and Layout Adjustments
- Set the board outline to a 42.3 mm square.
- Add four M3 mounting holes at a 31 mm offset from the center.
- Incorporate a Ø22 mm copper keep-out zone and a Ø26 mm tall-part keep-out area.
- Center the U3 (AS5600) component and add a bullseye silk marker for alignment.
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Stackup and Ground Plane Configuration
- Configure a JLC 2‑layer PCB stackup with the bottom layer defined as a solid GND plane.
- Create PGND islands under U2 and U5. Add stitching vias between these islands and the bottom GND plane to ensure proper grounding.
- Maintain a no‑copper donut around the sensor footprint (U3) to prevent unwanted copper exposure.
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Thermal and Signal Integrity Adjustments
- Add thermal via arrays under the exposed pads (e.g., TMC2209 and MP1584) to enhance thermal management.
- Verify the clearance of the CAN differential pair from high frequency switching loops.
- Optimize the placement of decouplers to ensure they are tightly coupled to their respective pins.
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Verification and Issue Resolution
- Run ERC (Electrical Rule Check) and DRC (Design Rule Check) on the updated schematic and PCB layout.
- Identify and resolve any violations or issues found during ERC/DRC.
- Footprints for U1–U5 are validated and updated per design specifications.
- PCB outline is correctly set to 42.3 mm with four M3 mounting holes at 31 mm.
- Ø22 mm copper and Ø26 mm tall-part keep-out areas are enforced.
- U3 (AS5600) is centered with an assigned bullseye silk marker.
- The board stackup is configured for a 2-layer design with bottom solid GND, and PGND islands under U2 and U5 are properly stitched.
- Thermal via arrays are present under exposed pads, sensor no-copper donut is maintained, and CAN pair clearance along with decoupler placements meet design guidelines.
- Final ERC and DRC reports show no outstanding issues.
Add CAN test pads
Place fiducials
Enable teardrops
Reposition SWD header
Select decoupling caps
184 days
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