NEMA17 PCB Design Optimization

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Work completed
  • U2: footprint set to QFN-28 EP 5×5 mm, 0.5 mm pitch
  • U3 and U4: footprints set to SOIC-8 3.9 mm
  • U5: footprint set to SOIC-8-EP 4.9×6.0 mm
  • PCB outline changed to 42.3 mm × 42.3 mm
  • Added four M3 mounting holes: Hole1, Hole2, Hole3, Hole4 at ±15.5 mm
  • Project property “Stackup” set to JLC 2-layer 1 oz
  • Project property “Copper Planes” set to bottom solid GND
Tasks not done
  • Modify footprint of U1 to LQFP-48 0.5 mm pitch
  • Add a 22 mm diameter copper keep-out region
  • Add a 26 mm tall-part keep-out region
  • Center U3 and add bullseye silkscreen overlay
  • Add thermal-via arrays under the exposed pads of U2 and U5
  • Validate EMC separation (CAN di/dt areas, sensor isolation, CAN-pair clearance, decoupler placement)
  • Run ERC and DRC checks and document violations
Success criteria review
  • Footprints for U2–U5: ✅ met, U1 still pending
  • Board outline & four M3 holes: ✅ outline and holes done, central keep-outs missing
  • U3 centering & bullseye: ❌ not done
  • 2-layer 1 oz stackup & bottom GND plane: ✅ met
  • PGND islands, stitching vias & sensor no-copper donut: ❌ not implemented
  • Thermal vias & EMC separation: ❌ not implemented
  • ERC/DRC violations cleared: ❌ not performed
Next step Implement the mechanical keep-outs (22 mm copper, 26 mm tall-part) and center U3 with a bullseye silkscreen marker.
96 days

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1:31

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Plan
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I’ll proceed with your requested updates. Plan to run now:
  1. Footprints: verify/fix U1 LQFP‑48 0.5 mm; confirm U2 QFN‑28 EP 5×5 0.5 mm; U3/U4 SOIC‑8; U5 SOIC‑8‑EP 4.9×6.0 mm.
  2. Mechanics: keep 42.3 mm outline; 4×M3 @ 31 mm; add Ø22 mm copper and Ø26 mm tall‑part keep‑outs; center U3 with bullseye silk.
  3. Stackup/planes: JLC 2‑layer, bottom solid GND; define PGND islands under U2 and U5 with stitching; keep sensor no‑copper donut.
  4. Thermal/EMC: add EP thermal via arrays; maintain CAN pair clearance from switching loops; tighten decouplers to pins.
  5. Verify: run ERC/DRC and resolve issues; report deltas.
Click Start on the plan bar to execute.
96 days

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CLK
2A
ENABLE
STEP
MS1
2B
VDD
1B
U1 VSS/VSSA - U2 GND
PDN (UART)
1A
VMOT
U4 CANL - J1 P2
DIR
GND
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Inspect

TMC2209_STEPPER_MOTOR SILENTSTEPSTICK

TMC2209_STEPPER_MOTOR SILENTSTEPSTICK
Description

Created
Last updated by saxonm
1 Contributor(s)
saxonm

Controls

Properties

Part Type
Integrated Circuit
Manufacturer Name
BIGTREETECH
Manufacturer Part Number
BIGTREETECH-TMC2209-V1.2
Designator Prefix
U
Copper Planes
bottom solid GND
Board Outline
42.3 mm x 42.3 mm square mm
System Architecture
graph LR P24[24V Input] -->|VIN| Buck[MP1584EN Buck Converter] Buck -->|3.3V| V3V3[3.3V Rail] V3V3 --> STM32[STM32G0B1CCT6] V3V3 --> CANPHY[SN65HVD230D CAN PHY] V3V3 --> AS5600[AS5600 Sensor] V3V3 --> TMC[TMC2209-LA Driver] STM32 -->|I2C SDA/SCL| AS5600 STM32 -->|UART Single-Wire| TMC STM32 -->|STEP/DIR/ENABLE/MS| TMC STM32 -->|SWD| SWD[SWD Header] STM32 -->|CAN TX/RX| CANPHY -->|CAN Bus| CANBus[CAN Bus] TMC -->|Motor Phases| Motor[Motor Phases Connector]
Stackup
JLC 2-layer 1 oz

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