NEMA17 PCB Design Optimization

flux

0:00

Work completed
  • U2: footprint set to QFN-28 EP 5×5 mm, 0.5 mm pitch
  • U3 and U4: footprints set to SOIC-8 3.9 mm
  • U5: footprint set to SOIC-8-EP 4.9×6.0 mm
  • PCB outline changed to 42.3 mm × 42.3 mm
  • Added four M3 mounting holes: Hole1, Hole2, Hole3, Hole4 at ±15.5 mm
  • Project property “Stackup” set to JLC 2-layer 1 oz
  • Project property “Copper Planes” set to bottom solid GND
Tasks not done
  • Modify footprint of U1 to LQFP-48 0.5 mm pitch
  • Add a 22 mm diameter copper keep-out region
  • Add a 26 mm tall-part keep-out region
  • Center U3 and add bullseye silkscreen overlay
  • Add thermal-via arrays under the exposed pads of U2 and U5
  • Validate EMC separation (CAN di/dt areas, sensor isolation, CAN-pair clearance, decoupler placement)
  • Run ERC and DRC checks and document violations
Success criteria review
  • Footprints for U2–U5: ✅ met, U1 still pending
  • Board outline & four M3 holes: ✅ outline and holes done, central keep-outs missing
  • U3 centering & bullseye: ❌ not done
  • 2-layer 1 oz stackup & bottom GND plane: ✅ met
  • PGND islands, stitching vias & sensor no-copper donut: ❌ not implemented
  • Thermal vias & EMC separation: ❌ not implemented
  • ERC/DRC violations cleared: ❌ not performed
Next step Implement the mechanical keep-outs (22 mm copper, 26 mm tall-part) and center U3 with a bullseye silkscreen marker.
154 days

flux

1:31

Chat History
Project
Accessed Knowledge (1)

Using Knowledge Base Tool.

I’ll proceed with your requested updates. Plan to run now:
  1. Footprints: verify/fix U1 LQFP‑48 0.5 mm; confirm U2 QFN‑28 EP 5×5 0.5 mm; U3/U4 SOIC‑8; U5 SOIC‑8‑EP 4.9×6.0 mm.
  2. Mechanics: keep 42.3 mm outline; 4×M3 @ 31 mm; add Ø22 mm copper and Ø26 mm tall‑part keep‑outs; center U3 with bullseye silk.
  3. Stackup/planes: JLC 2‑layer, bottom solid GND; define PGND islands under U2 and U5 with stitching; keep sensor no‑copper donut.
  4. Thermal/EMC: add EP thermal via arrays; maintain CAN pair clearance from switching loops; tighten decouplers to pins.
  5. Verify: run ERC/DRC and resolve issues; report deltas.
Click Start on the plan bar to execute.
Add CAN test pads
Place fiducials
Enable teardrops
Reposition SWD header
Select decoupling caps
154 days
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CLK
2A
ENABLE
STEP
MS1
2B
VDD
1B
U1 VSS/VSSA - U2 GND
PDN (UART)
GND
1A
VMOT
U4 CANL - J1 P2
DIR
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TMC2209_STEPPER_MOTOR SILENTSTEPSTICK thumbnail
42.3mm NEMA17 Smart Stepper-Motor Module: STM32G0B1, TMC2209 Driver, AS5600 Encoder, CAN Interface, 24V Power Management

Properties

mm

Pricing & Availability

Distributor

Qty 1

Arrow

$8.92–$10.83

Digi-Key

$15.57–$18.04

LCSC

$14.34

Mouser

$24.70

TME

$11.89

Verical

$7.91–$14.90

Assets

TMC2209_STEPPER_MOTOR_DRIVER_CARRIER

TMC2209_STEPPER_MOTOR_DRIVER_CARRIER

defaultDefault
kicad_mod

MODULE_TMC2209_STEPPER_MOTOR_DRIVER_CARRIER.kicad_mod

Footprint_V5Footprint
TMC2209_STEPPER_MOTOR_DRIVER_CARRIER_STEPPER_MOTOR_DRIVER_CARRIER.step

TMC2209_STEPPER_MOTOR_DRIVER_CARRIER_STEPPER_MOTOR_DRIVER_CARRIER.step

3D3D Model
SILENTSTEPSTICK.png

SILENTSTEPSTICK.png

A4988Thumbnail

Controls