Part Data Review and Updates

flux

Review Summary
I reviewed the current part metadata, the official Molex datasheet, the symbol terminals, and the footprint/layout representation.
Datasheet property
  • No web search was needed
  • The project already has Datasheet URL set to the official Molex PDF:
    • https://www.molex.com/pdm_docs/sd/2034560003_sd.pdf
Part information check Current project metadata vs datasheet

Table

FieldIn projectIn datasheetStatus
Manufacturer Part Number203456-00032034560003OK, same part with hyphen formatting difference
Manufacturer NameMolexMolex Electronic Technologies, LLCOK, project value is abbreviated but acceptable
Part TypeConnectorsMirror Mezz board-to-board / mezzanine connectorMostly OK, could be more specific
Package or Case CodeBGABGA-style solder ball attach, Mirror Mezz 7P x 11RToo generic
Designator PrefixJConnectorOK
DescriptionMirror Mezz Hermaphroditic Connector, 5.50 mm Connector Height, BGA-Attach Mounting, 7 Pair, 11 Row, 699 Circuits, 0.76 µm Gold PlatingMirror Mezz, 5.5 mm height, 7P x 11R, 699 circuitsMostly OK, but "7 Pair" is not the same as datasheet's 7P x 11R
Key specs from datasheet Core specifications

Table

ParameterDatasheet value
Product familyMirror Mezz
MPN2034560003
Height5.50 mm
Row scheme7P x 11R
Total circuits699
Differential pairs77
Contact plating30 µin gold on contact area
Nickel plating50 µin min overall
MountingSolder ball / surface mount PCB attach
Operating temperature-55°C to +105°C
Voltage rating< 30 V AC RMS / VDC
Current rating0.75 A/pin on 1 oz Cu, 1.2 A/pin on 2 oz Cu
Contact resistance30 mΩ max initial
Insulation resistance1000 MΩ min
Dielectric withstand500 VAC RMS for 1 minute
Durability100 cycles
Symbol audit What matches

Table

CheckResult
Terminal count699 terminals present
Pin-number populationThe sampled terminals all have Pin Number populated
Pin naming styleUses alphanumeric grid IDs like A11, F65, J34, which matches the datasheet convention
Ground-style labelsGND_xx labels still map to coordinate-based Pin Number values, which is acceptable if intentional
Problems flagged

Table

IssueResult
Pin Type coverageAll sampled terminals are still Pin Type = Unspecified
Pin Description coverageI did not find populated per-pin descriptions in the visible terminal properties
Semantic pin descriptionsThe datasheet does not provide unique functional names for every contact; it mainly provides coordinate IDs and mirroring, so full semantic pin descriptions cannot be derived directly from this datasheet alone
Symbol naming consistencySome designators are coordinate IDs, while others are GND_xx; that is a mixed labeling style
Interpretation
  • The symbol appears structurally complete because the 699-pin count matches the datasheet.
  • The pin identifier scheme is aligned with the datasheet's row/column naming.
  • The main symbol-quality issue is metadata completeness, not missing pins:
    • Pin Type is not classified
    • Pin Description appears missing
    • labeling style is inconsistent between coordinate pins and GND_xx pins
Footprint audit What matches

Table

CheckResult
Footprint asset existsYes, a KiCad footprint asset is present
Layout pad count699 pads
Connector styleBGA/solder-ball style representation is consistent with datasheet
Datasheet pad-field expectationDatasheet calls for 699X pads / mask apertures
Datasheet footprint details to verify against the asset

Table

Datasheet itemValue
Recommended pad diameter0.50 ± 0.05 mm
Solder mask aperture0.60 ± 0.05 mm
Pad styleNon-solder-mask-defined
Orientation anchorPin A3 explicitly identified
Array conventionRows A, B, C, D, E, F, G, H, J, K, L
Limitation
I could confirm:
  • a footprint exists,
  • the PCB representation has 699 pads,
  • and that this is directionally consistent with the datasheet.
I could not fully numerically verify pad diameters, pitch, and exact row/column geometry from the available project-tool output alone, because the current layout response does not expose the per-pad dimensions/coordinates in a usable way.
Mismatches and concerns Confirmed / likely mismatches

Table

AreaFindingSeverity
Package fieldBGA is too generic for this partMedium
Description text7 Pair does not match datasheet 7P x 11R wordingMedium
Terminal metadataPin Type left as UnspecifiedMedium
Pin descriptionsMissing or not visible on terminalsMedium
Labeling consistencyMix of coordinate labels and GND_xx labelsLow to Medium
Not flagged as mismatches

Table

AreaFinding
MPNHyphenated vs non-hyphenated form appears acceptable
ManufacturerMolex is acceptable shorthand
Pin countMatches datasheet
Footprint existencePresent
Pad countMatches datasheet
Recommended fixes Metadata

Table

FieldRecommended value
Package or Case CodeMirror Mezz 7P x 11R, 699-circuit, solder-ball attach
Part TypeBoard-to-board mezzanine connector or Connector
DescriptionMirror Mezz board-to-board mezzanine connector, 5.5 mm height, 699 circuits, 7P x 11R, solder-ball attach
Symbol data

Table

ImprovementRecommendation
Pin TypeClassify pins at least into Ground vs Unspecified/Passive where justified
Pin DescriptionAdd short descriptions if you have a pin-role source beyond this drawing
Label styleDecide whether all visible labels should be coordinate-based, or whether ground contacts should intentionally stay grouped as GND_xx
Bottom line
  • Datasheet URL: already correct, so no update was needed.
  • Part metadata: mostly right, but package and description wording should be tightened.
  • Symbol: pin count and coordinate naming look structurally correct, but terminal metadata is incomplete.
  • Footprint: 699-pad footprint is present and consistent at a high level, but I could not fully prove pad geometry against the drawing from the available layout output.
If you want, I can now fix the project metadata and terminal properties for this part.
Fix all mismatches
Check missing footprints
Document the audit
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203456-0003

203456-0003 thumbnail
Mirror Mezz Hermaphroditic Connector, 5.50mm Connector Height, BGA-Attach Mounting, 7 Pair, 11 Row, 699 Circuits, 0.76m Gold (Au) Plating The 203456-0003 is a board-to-board mezzanine connector manufactured by Molex. It belongs to a family of high-density, fine-pitch connectors designed to provide reliable electrical and mechanical connections between stacked PCBs.
This connector is typically used in compact electronic designs where space-saving and high pin-count interconnections are required, such as consumer electronics, embedded systems, industrial equipment, and communication devices.
It is engineered to support stable signal transmission, including high-speed signals, while maintaining a low-profile form factor suitable for modern, miniaturized designs. Key Characteristics (General) Connector Type: Board-to-board (mezzanine) Mounting Style: Surface-mount (SMT) High pin density for compact PCB layouts Low profile height (ideal for slim devices) Designed for reliable mating cycles Supports signal integrity for high-speed applications Typical Applications Embedded modules and carrier boards Consumer electronics (tablets, handheld devices) Industrial control systems Communication and networking equipment #CommonPartsLibrary #Connector #Mirror Mezz 203456

Properties

2034560003

Molex

Connectors

molex.com/pdm_docs/sd/2034560003_sd.pdf

J

BGA

creativecommons.org/licenses/by/4.0/

parametric-v1

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