Part Data Review and Updates
2:17
Planning project updates.
Reviewing the bill of materials.
Analyzing the schematic.
Looking for "Manufacturer part number, manufacturer name, product description, package/mechanical style, plating, circuit count, row count, differential pair count, connector height, mounting style, current rating, voltage rating, temperature range, insulation resistance, dielectric withstanding voltage, contact resistance, durability, and any key specifications from the first pages/specification tables." in 2034560003_sd.pdf
Looking for "Complete pin / signal assignment information for the 699-circuit Mirror Mezz connector, including whether the datasheet provides a pin map, contact naming convention, row naming, and any notes needed to verify symbol pin descriptions." in 2034560003_sd.pdf
Looking for "Mechanical package details and footprint-related information: recommended land pattern, BGA attach details, dimensions, pitch, rows, columns, and any package or PCB layout notes needed to verify the footprint." in 2034560003_sd.pdf
Cross-checking design elements.
Searching the project.
Analyzing the PCB layout.
Searching for terminal components.
Searching 3 domains.
Searching 2 domains.
Searching 3 domains.
Evaluating missing pin descriptions.
Assessing pin numbers and descriptions.
Search complete — 926 results across 3 domains.
Clarifying mismatches and designators.
- No web search was needed
- The project already has
Datasheet URLset to the official Molex PDF:https://www.molex.com/pdm_docs/sd/2034560003_sd.pdf
Current project metadata vs datasheet
| Field | In project | In datasheet | Status |
|---|---|---|---|
| Manufacturer Part Number | 203456-0003 | 2034560003 | OK, same part with hyphen formatting difference |
| Manufacturer Name | Molex | Molex Electronic Technologies, LLC | OK, project value is abbreviated but acceptable |
| Part Type | Connectors | Mirror Mezz board-to-board / mezzanine connector | Mostly OK, could be more specific |
| Package or Case Code | BGA | BGA-style solder ball attach, Mirror Mezz 7P x 11R | Too generic |
| Designator Prefix | J | Connector | OK |
| Description | Mirror Mezz Hermaphroditic Connector, 5.50 mm Connector Height, BGA-Attach Mounting, 7 Pair, 11 Row, 699 Circuits, 0.76 µm Gold Plating | Mirror Mezz, 5.5 mm height, 7P x 11R, 699 circuits | Mostly OK, but "7 Pair" is not the same as datasheet's 7P x 11R |
Core specifications
| Parameter | Datasheet value |
|---|---|
| Product family | Mirror Mezz |
| MPN | 2034560003 |
| Height | 5.50 mm |
| Row scheme | 7P x 11R |
| Total circuits | 699 |
| Differential pairs | 77 |
| Contact plating | 30 µin gold on contact area |
| Nickel plating | 50 µin min overall |
| Mounting | Solder ball / surface mount PCB attach |
| Operating temperature | -55°C to +105°C |
| Voltage rating | < 30 V AC RMS / VDC |
| Current rating | 0.75 A/pin on 1 oz Cu, 1.2 A/pin on 2 oz Cu |
| Contact resistance | 30 mΩ max initial |
| Insulation resistance | 1000 MΩ min |
| Dielectric withstand | 500 VAC RMS for 1 minute |
| Durability | 100 cycles |
What matches
| Check | Result |
|---|---|
| Terminal count | 699 terminals present |
| Pin-number population | The sampled terminals all have Pin Number populated |
| Pin naming style | Uses alphanumeric grid IDs like A11, F65, J34, which matches the datasheet convention |
| Ground-style labels | GND_xx labels still map to coordinate-based Pin Number values, which is acceptable if intentional |
Problems flagged
| Issue | Result |
|---|---|
| Pin Type coverage | All sampled terminals are still Pin Type = Unspecified |
| Pin Description coverage | I did not find populated per-pin descriptions in the visible terminal properties |
| Semantic pin descriptions | The datasheet does not provide unique functional names for every contact; it mainly provides coordinate IDs and mirroring, so full semantic pin descriptions cannot be derived directly from this datasheet alone |
| Symbol naming consistency | Some designators are coordinate IDs, while others are GND_xx; that is a mixed labeling style |
- The symbol appears structurally complete because the 699-pin count matches the datasheet.
- The pin identifier scheme is aligned with the datasheet's row/column naming.
- The main symbol-quality issue is metadata completeness, not missing pins:
Pin Typeis not classifiedPin Descriptionappears missing- labeling style is inconsistent between coordinate pins and
GND_xxpins
What matches
| Check | Result |
|---|---|
| Footprint asset exists | Yes, a KiCad footprint asset is present |
| Layout pad count | 699 pads |
| Connector style | BGA/solder-ball style representation is consistent with datasheet |
| Datasheet pad-field expectation | Datasheet calls for 699X pads / mask apertures |
Datasheet footprint details to verify against the asset
| Datasheet item | Value |
|---|---|
| Recommended pad diameter | 0.50 ± 0.05 mm |
| Solder mask aperture | 0.60 ± 0.05 mm |
| Pad style | Non-solder-mask-defined |
| Orientation anchor | Pin A3 explicitly identified |
| Array convention | Rows A, B, C, D, E, F, G, H, J, K, L |
- a footprint exists,
- the PCB representation has 699 pads,
- and that this is directionally consistent with the datasheet.
Confirmed / likely mismatches
| Area | Finding | Severity |
|---|---|---|
| Package field | BGA is too generic for this part | Medium |
| Description text | 7 Pair does not match datasheet 7P x 11R wording | Medium |
| Terminal metadata | Pin Type left as Unspecified | Medium |
| Pin descriptions | Missing or not visible on terminals | Medium |
| Labeling consistency | Mix of coordinate labels and GND_xx labels | Low to Medium |
Not flagged as mismatches
| Area | Finding |
|---|---|
| MPN | Hyphenated vs non-hyphenated form appears acceptable |
| Manufacturer | Molex is acceptable shorthand |
| Pin count | Matches datasheet |
| Footprint existence | Present |
| Pad count | Matches datasheet |
Metadata
| Field | Recommended value |
|---|---|
| Package or Case Code | Mirror Mezz 7P x 11R, 699-circuit, solder-ball attach |
| Part Type | Board-to-board mezzanine connector or Connector |
| Description | Mirror Mezz board-to-board mezzanine connector, 5.5 mm height, 699 circuits, 7P x 11R, solder-ball attach |
Symbol data
| Improvement | Recommendation |
|---|---|
| Pin Type | Classify pins at least into Ground vs Unspecified/Passive where justified |
| Pin Description | Add short descriptions if you have a pin-role source beyond this drawing |
| Label style | Decide whether all visible labels should be coordinate-based, or whether ground contacts should intentionally stay grouped as GND_xx |
- Datasheet URL: already correct, so no update was needed.
- Part metadata: mostly right, but package and description wording should be tightened.
- Symbol: pin count and coordinate naming look structurally correct, but terminal metadata is incomplete.
- Footprint: 699-pad footprint is present and consistent at a high level, but I could not fully prove pad geometry against the drawing from the available layout output.
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