A datasheet URL is already set on the part. No change made.
Datasheet scan and metadata extraction (TE “Ribbon Cable Interconnect Solutions” for 5103308-6)
Electrical ratings
Rated voltage: 300 V
Dielectric withstanding voltage: 1000 V rms (at sea level)
Current rating: 1.5 A max; also listed as 0.5 A per contact at thermal rise conditions in catalog notes (context-dependent)
Insulation resistance: 5000 MΩ minimum (initial)
Contact resistance: value shown in catalog section is 10 mΩ max (catalog OCR sometimes renders “mΩ” as “MΩ”; the intended unit is milliohms for contact resistance)
Mechanical and package
Series/Type: Low Profile Pin Headers, Center and Dual Polarized, 0.100 in x 0.100 in [2.54 mm x 2.54 mm] centerlines
Positions: 26
Rows: 2
Pin/post: 0.025 in [0.64 mm] square (mating end)
Orientation: Vertical PCB mount
Body dimensions (for the 26-position variant):
A: 1.600 in [40.64 mm]
B: 1.200 in [30.48 mm]
Additional dimensional callouts around the header and leads include typicals such as 0.100 in [2.54 mm] pitch, 0.360 in [9.14 mm], 0.130 in [3.30 mm], 0.388 in [9.86 mm], 0.185 ± 0.010 in [4.70 ± 0.25 mm], 0.120 ± 0.015 in [3.05 ± 0.38 mm], 0.240 in [6.10 mm] typ.
Recommended PCB layout (manual insertion)
Grid pitch: 0.100 in [2.54 mm] typ. in both directions
Post size tolerance: 0.025 ± 0.001 in [0.64 ± 0.03 mm]
Overall length reference: A = 1.600 in [40.64 mm]; width reference: B = 1.200 in [30.48 mm]
Pin description and numbering
Dual-row numbering with clear Pin 1 indicator; Pin 1 and Pin 2 are called out in drawings for the series. The catalog shows position #1 indicator and typical odd/even opposing sides for 2-row headers.
Materials and plating
Housing: Glass-filled nylon, UL 94V-0, black
Posts: Brass
Plating (B option for this part number):
Mating surfaces: Gold flash over palladium-nickel, 0.000015 in [0.00038 mm] minimum total
Solder area: Tin, 0.000100 in [0.00254 mm] minimum
Underplate: Nickel, 0.000050 in [0.00127 mm] minimum (entire post)
Special features and mating
Polarization: Center and dual polarized features identified in series description and drawings (position #1 indicator present)
Mating families called out in the catalog: AMPMODU wire-applied/board-mount receptacles and related families; for 26 positions in this header series the paired numbers include 5103309-6 (related vertical mount family) and 5103308-6 on the “Plating B” column for this low-profile header
Compliance
RoHS compliant (per catalog statement)
UL flammability for the housing: UL 94V-0 (catalog references UL file for series; verify exact file if needed on TE’s website for this MPN)
Cross-check: schematic symbol and footprint vs datasheet
Symbol
Pin count: 26 present in the symbol editor assets. Matches datasheet.
Arrangement: Dual-row representation observed (pins placed on left/right columns). Matches the 2-row header concept.
Numbering convention: The datasheet clearly indicates a Pin 1 indicator with opposing Pin 2 and dual-row layout. The symbol appears to organize pins on left/right columns (odd/even) consistent with typical TE numbering; ensure the Pin 1 marker in the symbol matches the physical end indicated in the datasheet drawing. Risk if mirrored: net assignment reversal across the rows.
Footprint
Pad count: 26 pads present in the footprint asset index. Matches datasheet.
Mounting style: Datasheet specifies through-hole with 0.035 ± 0.003 in [0.89 ± 0.08 mm] drill. Verify the pad hole size and annular ring in your footprint match these values. The current layout index lists 26 pads but does not expose pad drill/land dimensions in the data retrieved; please confirm hole size, annular ring, and 2.54 mm grid in the footprint editor.
Pitch and grid: Datasheet requires 2.54 mm x 2.54 mm grid. Confirm your pads are placed on an exact 2.54 mm grid for both X and Y, and that the overall A and B spacings match the 26-position callouts (A=40.64 mm, B=30.48 mm).
Pin 1 indicator: Ensure a clear silkscreen or assembly layer marker aligns with the datasheet Pin 1 location so assembly and mating orientation are unambiguous.
Project properties and sourcing checks
Part Type mismatch: The project property shows “Integrated Circuits” but this MPN is a dual-row through-hole connector. Recommend updating the part’s type to Connector to avoid misclassification in BOMs and sourcing tools.
Current rating inconsistency: The project description lists 1 A max per contact; the datasheet indicates 1.5 A max (with separate thermal-rise test context noted). If your system derating requires 1 A, keep it; otherwise align the stated rating with datasheet and document any derating choice.
Through-hole confirmation: Ensure the part asset and footprint are designated as through-hole and not SMD; datasheet recommends drilled holes per above.
Suggested next corrections
Update the part “Part Type” to Connector.
Verify and, if needed, adjust pad drill to 0.89 mm and place pads on a 2.54 mm grid consistent with A/B dimensions.
Add/verify a Pin 1 silkscreen/assembly marker to match datasheet.
Align the documented current rating with the datasheet (1.5 A max) or maintain a documented derating rationale.
Reference component link
Consider using or mapping to 5103308-6 when placing in a design.
Wirelessly connects nets on schematic. Used to organize schematics and separate functional blocks. To wirelessly connect net portals, give them same designator. #portal
General Purpose Thick Film Standard Power
and High-Power Chip Resistor
47 kOhms ±5% 0.125W, 1/8W Chip Resistor 0805 (2012 Metric) Automotive AEC-Q200 Thick Film
Features:
- RMCF – standard power ratings
- RMCP – high power ratings
- Nickel barrier terminations standard
- Power derating from 100% at 70ºC to zero at +155ºC
- RoHS compliant, REACH compliant, and halogen free
- AEC-Q200 compliant