Verified schematic nets for power + I2C are correct: ^3V3_RAIL, ^GND, ^SDA, ^SCL.
Success criteria review
โ FSR divider schematic connectivity is now correct (each of R1-R5 has one side on its FSRx_ADC net and the other on ^GND).
โ ERC is clean.
โ Cannot complete placement/routing/ground pour/DRC cleanup/export within tool limitations: per platform limitation, I cannot trigger auto-placement/auto-routing, and I cannot manually route traces (routing must be triggered by you in the UI). This is explicitly called out as a current limitation.
โ DRC is not clean yet (airwires present, floating copper, multiple fills) because routing/fill execution is not complete.
Next steps
Please run Flux Auto-Layout (top-layer routing) and enable/refresh the bottom-layer GND pour in the UI; then I can re-run DRC (airwires/floating copper/overlapping fills) and tell you exactly what to tweak to reach zero DRC.
Wirelessly connects nets on schematic. Used to organize schematics and separate functional blocks. To wirelessly connect net portals, give them same designator. #portal
General Purpose Thick Film Standard Power
and High-Power Chip Resistor
47 kOhms ยฑ5% 0.125W, 1/8W Chip Resistor 0805 (2012 Metric) Automotive AEC-Q200 Thick Film
Features:
- RMCF โ standard power ratings
- RMCP โ high power ratings
- Nickel barrier terminations standard
- Power derating from 100% at 70ยบC to zero at +155ยบC
- RoHS compliant, REACH compliant, and halogen free
- AEC-Q200 compliant