Fixing nRF52840 Footprint

3:07

Project

Help

Determ.

Considering.

Assign.

Creating.

Implement.

Checking if I can make the changes for you.

Reading docs about How to edit a pad in a footprint in Flux: change pad shape to square, set SMD pad size (X and Y), and assign the pad to a specific net (e.g., GND) from the Inspect panel or properties. Include steps to open the footprint from a placed component and save changes back to the project..

Reading docs about How to set a specific pad to use thermal relief when connecting to copper fills/planes in Flux, and where to find this option in the Inspector or object-specific rules for pads..

Reading docs about Where in Flux can I change a pad’s dimensions (X and Y), shape (square/rectangular/circular), and type (SMD) for a selected pad on a footprint? Include exact panel/field names if available..

Draft.

Craft.

I can’t directly modify footprint geometry for you, but here’s exactly what Flux documentation says for configuring pads and thermal relief. Apply these to EP:

Quoted from the Flux docs "Configuring a pad is easy with the toolbar. When a pad is selected on PCB, a toolbar shows up above it on the canvas. From there, you can change its position, size, pad type, pad shape, and hole size.

Configure a Pad using Layout Rules

If you need to get in deeper, you can use layout rules in the inspector. To learn how to add rules to objects, please refer to our documentation on Layout Rules Reference.

Pad Type

Modifies the type of pad to one of the following:

SMD – a surface mount pad with no drill hole.
HOLE – a drill hole with no copper.
STD – a through-hole pad. (STD stands for 'Standard'.)
CONN – a connector pad with no drill hole, often used at the edges of a board."

Source

"Thermal Relief

Defines how a pad connects to a fill. The Relief Connect option separates the pad from the fill and connects them with conductors. The distance of the separation is defined by the Keep Out rule. Useful when soldering a component to a pad. The Direct Connect option is essentially 'no thermal reliefs'. It removes the conductors and prevents Keep Outs from having an effect, allowing the pad and the fill to connect directly.

Related rules include Thermal Relief Conductors, Thermal Relief Conductor Width, and Thermal Relief Conductor Angle."

Source

What to set on EP

Pad type: SMD
Pad shape: Square/rectangular
Pad size: 3.2 mm x 3.2 mm
Net: GND
Thermal connection: Relief Connect (thermal relief)

If you run into anything unclear while applying these settings, tell me what you’re seeing on the Inspector/toolbar and I’ll point you to the exact control.

8 days

s2busy

The EP pad size of 4.85mm is correct per the AQFN-73 footprint spec. The overlapping copper errors between EP and signal pads D+ and P0.15 are because those signal pads are incorrectly positioned. Can you check the positions of pads D+ and P0.15 and move them to their correct positions per the nRF52840-QIAA-R datasheet?

8 days

flux

1:38

Chat History

Project

Analy.

Reading.

Access.

Planning.

Creating.

You want me to verify and correct the locations of D and P0.15 per the nRF52840 AQFN-73 datasheet, so EP overlaps disappear.

Plan:

Compare the footprint to the Nordic pin map/orientation.
Calculate target coordinates from the pin pitch/origin.
Move D+ and P0.15 to the correct locations.
Re-run DRC and confirm no EP overlaps.
Save and summarize changes.

Click Start to run this plan, or tell me what you’d like changed.

Get current pad positions

Run DRC overlap check

Pull datasheet pad map

Confirm footprint rotation

8 days

Ready to start.

Show Plan

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