Part Data Analysis and Verification

flux

1) Available part information (from this part project)

Table

FieldValue
MPNDP83867ERGZR
ManufacturerTexas Instruments
Package / footprint family (project description)RGZ0048B (VQFN)
Pin count (from symbol/footprint in this project)49 terminals (pins 1-48 + exposed pad 49)
Datasheet URL (already set on the project)https://www.ti.com/lit/gpn/dp83867e
2) Datasheet URL check + update
A datasheet URL is already set, so no @web search or property update was required for this step.
(For completeness, the TI direct PDF is: https://www.ti.com/lit/ds/symlink/dp83867e.pdf)
3) Datasheet scan (metadata extracted) Absolute Maximum Ratings (datasheet section 6.1)
  • Supply voltage:
    • VDDA2P5: -0.3 V to 3 V
    • VDDA1P8: -0.3 V to 2.1 V
    • VDD1P0: -0.3 V to 1.3 V
    • VDDIO:
      • 3.3 V option: -0.3 V to 3.8 V
      • 2.5 V option: -0.3 V to 3 V
      • 1.8 V option: -0.3 V to 2.1 V
  • Pins:
    • MDI: -0.3 V to 6.5 V
    • MAC interface / MDIO / MDC / GPIO: -0.3 V to VDDIO + 0.3
    • INT/PWDN, RESET: -0.3 V to VDDIO + 0.3
    • JTAG: -0.3 V to VDDIO + 0.3
    • XI: -0.3 V to 2.1 V
  • Storage temperature: -60 C to 150 C
Recommended Operating Conditions (datasheet section 6.3)
  • VDDA2P5: 2.375 V min, 2.5 V typ, 2.625 V max
  • VDDA1P8: 1.71 V min, 1.8 V typ, 1.89 V max
  • VDD1P0: 0.95 V min, 1.0 V typ, 1.155 V max
  • VDDIO (options):
    • 3.3 V: 3.15 / 3.3 / 3.45 V
    • 2.5 V: 2.375 / 2.5 / 2.625 V
    • 1.8 V: 1.71 / 1.8 / 1.89 V
  • Temperature (DP83867ERGZ “Extended”):
    • Operating junction: -40 C to 125 C
    • Operating free-air: -40 C to 105 C
Pin descriptions (selected, from Table 5-1 excerpts)
  • RBIAS: “A 11 kohm +/-1% resistor can be connected from RBIAS to GND.”
  • VDDA2P5: each pin requires 1 uF + 0.1 uF to GND.
  • VDD1P0: each pin requires 1 uF + 0.1 uF to GND.
  • VDDA1P8: “No external supply is required… When unused, no connections can be made…” (and if externally supplied, each pin requires 1 uF + 0.1 uF to GND).
  • VDDIO: each pin requires 1 uF + 0.1 uF to GND.
  • MDIO: “requires pullup resistor… IEEE specified 1.5 kohm, but 2.2 kohm is acceptable.”
  • MDC: management clock, “maximum clock rate 25 MHz.”
  • RESET_N: must be held low minimum 1 us.
  • INT_PWDN_N: default POWER DOWN; in interrupt mode is open-drain, TI recommends external 2.2 kohm to VDDIO.
  • X_I / X_O: 25 MHz crystal/oscillator interface; XO must float if oscillator used.
Package dimensions / mechanical (RGZ0048B, VQFN, 1 mm max height)
From the package outline excerpt:
  • Body size: 6.85 mm to 7.15 mm (A and B)
  • Pitch: 0.5 mm (lead pitch callout)
  • Exposed thermal pad: 49
  • Note: “The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.”
Special features (example extracted)
  • Wake-on-LAN (WoL) magic packet detection support is described (section 7.3.1 excerpt), including CRC checking and secure-on password support.
Electrical characteristics
I was able to extract Absolute Max / Recommended Operating and multiple pin-function excerpts reliably, but the electrical-characteristics tables (currents, IO levels, etc.) did not return via the PDF scanner in the time available (tool timeouts). If you want, I can continue targeting those tables with narrower queries (e.g., by table number once you tell me the datasheet revision/date you care about).
4) Cross-check: schematic symbol + footprint vs datasheet (mismatch flags) What matches cleanly
  • Pin count alignment looks consistent with the package:
    • Symbol in this project includes pins 1-48 plus exposed pad 49 as PAD.
    • Footprint layout node list includes a pad with terminalId 49 (name “PAD”), consistent with the exposed thermal pad 49 in the package outline.
  • Several direction/type choices appear reasonable:
Potential manufacturing / failure risks to flag
  • Thermal pad naming vs actual net intent:
    • Datasheet explicitly requires the exposed pad be soldered for “thermal and mechanical performance.” In this part project, exposed pad is represented as PAD. If the consuming design doesn’t connect PAD to GND (or whatever the datasheet requires for that EPAD in the full pin table), assembly/thermal performance can suffer.
  • Duplicate power-pin terminal names:
    • The symbol uses repeated designators for rails (multiple VDD1P0 terminals; multiple VDDIO; multiple VDDA2P5; multiple VDDA1P8). That’s functionally OK, but it increases the chance a user connects only one instance and misses the others. The datasheet calls out per-pin decoupling requirements for these supplies.
  • Pin function completeness:
    • The excerpted pin table confirms many pins, but I did not yet extract every row of Table 5-1 (full pin map) reliably via the PDF scanner. That means I cannot 100% confirm there isn’t a swapped pin number/name elsewhere (e.g., any of the GPIO/strap pins) purely from the extracted text so far.
Footprint geometry verification (limits)
  • I can see the footprint pad list (terminalId mapping) but not enough dimensional detail (pad widths/lengths, courtyard, exposed pad solder mask/paste strategy) from the current PCB inspect output to conclusively verify it matches the RGZ0048B land pattern. If you want a strict mechanical cross-check, I can do another pass focused on pad geometry once the footprint’s pad dimensions are exposed via the layout inspector output.
@review check decoupling
Inspect PHY footprint
Pull DP83867 BOM
Check symbol pin map
Sign up to send
RX_D3_SGMII_SON
TX_D3
RX_D1_SGMII_CON
RX_CLK
RX_D0_SGMII_COP
RX_CTRL
TX_D2
GPIO_0
RX_D2_SGMII_SOP
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    jharwinbarrozo
    16.2k
  • Generic Capacitor
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DP83867ERGZR

DP83867ERGZR thumbnail
DP83867ERGZR RGZ0048B RGZ0048B_NV

Properties

DP83867ERGZR

Texas Instruments

Integrated Circuit

ti.com/lit/gpn/dp83867e

U

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