Report-only verification that the Bottom GND polygon exists and behaves correctly. Do not modify the design.
Scope (STRICT, NO EDITS)
Do NOT create, move, or edit any object.
Do NOT start routing or place polygons/zones.
REPORT ONLY.
Tasks
Polygons inventory
List all polygons/fills with:
• Layer
• Net
• Approx. area (if available)
Confirm there is at least one polygon on Bottom layer tied to GND.
Connectivity spot-check (report-only)
For these GND pads, report whether they have thermal/solid connections to the Bottom GND polygon:
• J24V_IN:GND
• D1 (TVS):GND
• U1 (buck): GND pad
• U2 (3.3 V LDO): GND/EP
• J_SDCARD: shield GND
If thermal spokes cannot be programmatically detected, state “unable to auto-detect” and just report whether the GND polygon touches those pads.
Wirelessly connects nets on schematic. Used to organize schematics and separate functional blocks. To wirelessly connect net portals, give them same designator. #portal
General Purpose Thick Film Standard Power
and High-Power Chip Resistor
47 kOhms ±5% 0.125W, 1/8W Chip Resistor 0805 (2012 Metric) Automotive AEC-Q200 Thick Film
Features:
- RMCF – standard power ratings
- RMCP – high power ratings
- Nickel barrier terminations standard
- Power derating from 100% at 70ºC to zero at +155ºC
- RoHS compliant, REACH compliant, and halogen free
- AEC-Q200 compliant