Configured the reusable footprint as a 5×5, 25-pad Grid Array with 2.54 mm pitch and the dedicated Footprint stackup. All pads remain on POWER_NODE, with the 12.3 mm direct-connect copper tie enabled.
Open items:
Flux DRC still reports 24 airwires because the part-project checker does not recognize the custom copper polygon as routed pad-to-pad connectivity, although the polygon physically overlaps and connects every pad.
The updated part/version must be used in other projects for the full footprint to replace the old single-dot representation.
Suggested next steps:
Update/reinsert this part in the destination project.
Confirm the destination layout displays all 25 holes.
If needed, publish a new part version before updating existing instances.
I’ll validate the part’s current footprint state, publish a new part version, then confirm the new version is available for updating instances in other projects.
The project is already published as part 5eb4a83f-3622-4e37-b00b-104719ad4822, but I can’t trigger a new library release with the available project tools.
In Flux, open the part project and select Publish → Publish new version. After publishing, update the component version in other projects so they receive the 25-hole footprint.
Wirelessly connects nets on schematic. Used to organize schematics and separate functional blocks. To wirelessly connect net portals, give them same designator. #portal
General Purpose Thick Film Standard Power
and High-Power Chip Resistor
47 kOhms ±5% 0.125W, 1/8W Chip Resistor 0805 (2012 Metric) Automotive AEC-Q200 Thick Film
Features:
- RMCF – standard power ratings
- RMCP – high power ratings
- Nickel barrier terminations standard
- Power derating from 100% at 70ºC to zero at +155ºC
- RoHS compliant, REACH compliant, and halogen free
- AEC-Q200 compliant