TE 225679 Assets
Worked for 2 mins 17 sec
Configured the reusable footprint as a 5×5, 25-pad Grid Array with 2.54 mm pitch and the dedicated Footprint stackup. All pads remain on
POWER_NODE, with the 12.3 mm direct-connect copper tie enabled.Open items:
- Flux DRC still reports 24 airwires because the part-project checker does not recognize the custom copper polygon as routed pad-to-pad connectivity, although the polygon physically overlaps and connects every pad.
- The updated part/version must be used in other projects for the full footprint to replace the old single-dot representation.
Suggested next steps:
- Update/reinsert this part in the destination project.
- Confirm the destination layout displays all 25 holes.
- If needed, publish a new part version before updating existing instances.
Publish a new part version so other projects use the 25-hole footprint.
Thought for 11 sec
I’ll validate the part’s current footprint state, publish a new part version, then confirm the new version is available for updating instances in other projects.
Worked for 47 sec
The project is already published as part
5eb4a83f-3622-4e37-b00b-104719ad4822, but I can’t trigger a new library release with the available project tools.In Flux, open the part project and select Publish → Publish new version. After publishing, update the component version in other projects so they receive the 25-hole footprint.
Show publish steps
Verify after publishing
Update PCM project
Explain airwires
Run final review
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TE 225679-E Footprint Dimension Check
Date: 2026-07-23
Sources checked
- TE Connectivity product page for 225679-E, which points designers to the customer drawing for design activity.
- TE customer drawing
225679-E-Cfor 225679-E / C-225679-E. - TE/ERNI PowerElements datasheet and Application Specification 114-161211 for press-fit PCB hole requirements.
Datasheet / drawing footprint requirements
Table
| Item | Requirement |
|---|---|
| Part | TE Connectivity / ERNI 225679-E PowerElement male-thread terminal |
| Thread | M8 per customer drawing/catalogue. TE product feature page appears to conflict in one place with M10; customer drawing should govern. |
| PCB termination | Through-hole press-fit |
| Pin count | 25 press-fit pins |
| Pin array | 5 x 5 full population |
| Pitch | 2.54 mm center-to-center |
| Outer pin-center span | 10.16 mm x 10.16 mm, i.e. 4 intervals x 2.54 mm in X and Y |
| Nominal coordinates from array center | X/Y = -5.08, -2.54, 0, +2.54, +5.08 mm |
| Finished hole, immersion/chemical tin | Ø1.475 mm ±0.05 mm |
| Finished hole, HAL lead-free | Ø1.45 mm ±0.05 mm |
| Drill before plating | Ø1.60 mm +0.00 / -0.03 mm |
| Copper plating in hole | 25–60 µm; application spec notes 35 µm typical/recommended |
| Tin in hole | 15 µm max |
| PCB thickness | TE product/datasheet: 1.6 mm minimum/recommended; application spec is more conservative at at least 2.0 mm for stable mounting |
| Press-fit force | 40–250 N per pin; 25 pins means high total press-in load if inserted simultaneously |
Current Flux project footprint read-back
Inspection of the current part-project layout shows:
Table
| Project item | Observed value |
|---|---|
| Pads present in layout | P1, P2, P3 only |
| Pad positions | All at (0, 0) mm |
| Pad size | 0.0016 mm x 0.0016 mm x 0.0016 mm computed size |
| Pad shape | Circular |
| Layers | Top with annular layers forced Top and Bottom |
| Footprint package size | 0 x 0 x 0 |
| Root gridArrayCount rule | 5 5 |
| Uploaded assets visible through assets list | 3D model asset c-225679-e-1-3d and thumbnail/image asset TE225679; no footprint asset was visible as a footprint asset |
Comparison result
The current footprint does not match the TE 225679-E drawing/datasheet.
Major mismatches:
- Pin count mismatch: datasheet requires 25 press-fit holes; project currently has only 3 pads.
- Pin placement mismatch: datasheet requires a 5 x 5 array on 2.54 mm pitch; project pads are all located at the origin.
- Hole size mismatch: datasheet requires approximately Ø1.45–1.475 mm finished plated press-fit holes depending on PCB finish, with Ø1.60 mm drill before plating; project pads read back as 0.0016 mm, effectively zero-sized.
- Footprint extent mismatch: datasheet pin grid spans 10.16 mm x 10.16 mm between outer pin centers; project footprint has no real span.
- Asset/linkage issue: the uploaded 3D model and image are visible, but the footprint asset is not visible/flagged as a footprint in the project asset list, and the layout still reflects the old logical 3-pad placeholder footprint.
Recommended correction
Replace or rebuild the PCB footprint as a 25-hole press-fit pattern:
- 5 x 5 plated through-hole array.
- Pitch: 2.54 mm.
- Hole centers relative to footprint origin: X/Y = -5.08, -2.54, 0, +2.54, +5.08 mm.
- Finished hole diameter: choose based on PCB finish:
- Immersion/chemical tin: Ø1.475 ±0.05 mm.
- HAL lead-free: Ø1.45 ±0.05 mm.
- Drill before plating: Ø1.60 +0.00/-0.03 mm.
- Keep the logical schematic symbol as 1 electrical position if desired, but map all 25 physical press-fit pads to the same electrical node/net for the power terminal.
- Confirm with the board fabricator that they can hold the press-fit hole tolerance and plating stack; this is much tighter than a normal loose through-hole connector.
Open uncertainty
The current project description says this is a logical 1-position connector for PCM J0A/J0B and the project context says
Pads: 3. That logical abstraction may be intentional, but it is not the physical TE 225679-E footprint. For an actual PCB layout using TE 225679-E, the physical footprint should have 25 press-fit holes.Sources checked
Datasheet / drawing footprint requirements
Current Flux project footprint read-back
Comparison result
Recommended correction
Open uncertainty
