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Table
| Check | Status | Notes |
|---|---|---|
| Stack-up supports controlled USB impedance | ||
| Differential pair geometry reviewed against fab capability | ||
| Copper thickness adequate for downstream VBUS current | ||
| Ground plane is continuous under USB pairs | ||
| Via strategy for exposed pad is manufacturable and solder-void risk reviewed | ||
| Solder mask and paste openings for QFN ePad reviewed |
Table
| Check | Status | Notes |
|---|---|---|
| USB2514B package land pattern matches selected package | ||
| QFN stencil design reviewed for center pad and void control | ||
| Small passives use assembly-friendly package sizes where possible | ||
| Crystal package and orientation are assembly-safe | ||
| Connector anchoring is adequate for insertion force | ||
| Rework access around hub, crystal, and protection devices is acceptable |
Table
| Check | Status | Notes |
|---|---|---|
| Exact MPN selected for all mandatory components | ||
| Lifecycle checked for hub, connectors, power switches, ESD, crystal | ||
| Alternate sources approved for passives and non-critical parts | ||
| Long-lead items identified | ||
| Assembly house can source or accept consigned specialty parts |
Table
| Check | Status | Notes |
|---|---|---|
| Every exposed downstream port has a power switch path and fault reporting | ||
| VBUS traces are wide and short enough for intended current | ||
| Bulk caps for downstream VBUS are near connectors | ||
| ESD devices are on the same layer and close to connectors | ||
| No USB trace stubs created by protection placement | ||
| Crystal and RBIAS routing isolated from noisy traces | ||
| All decoupling caps placed adjacent to hub pins |
Table
| Check | Status | Notes |
|---|---|---|
| Test points or accessible nodes exist for 3.3 V, 5 V, GND, RESET_N | ||
| Method exists to verify upstream enumeration | ||
| Method exists to verify each downstream VBUS enable path | ||
| EEPROM programming method defined if EEPROM used | ||
| Serial number / revision traceability method defined |
Table
| Check | Status | Notes |
|---|---|---|
| PRD released | ||
| Schematic design spec released | ||
| BOM tracker updated | ||
| Design review completed | ||
| Validation plan approved | ||
| Known errata and mitigations documented |
1. PCB Fabrication
2. Assembly
3. BOM / Sourcing
4. Electrical Manufacturability
5. Testability
6. Documentation Release
7. Pre-Production Exit Criteria