Cortex v0 Schematic Design

I’ve made a plan, and started work on it.

Started implementing a plan

#Goal

- Hand-route the 6 remaining unrouted airwires and clean up floating copper on Cortex v0 BLE Audio Wearable, ensuring the preservation of U1 Raytac (RF keepout), PZ1 bottom-center placement, and the six U3 EPAD overlap exceptions.

#Implementation plan

1. Route the specific airwires:

1. Hand-route U1 P0.27 haptic motor enable to Q1 gate on the top layer using standard signal width.

2. Route the PZ1 piezo signal from terminal P2 on the bottom side through C11 to the non-inverting input of U5 MCP6001 with a short, isolated trace away from high-dV/dt nets (LED data, QSPI clock, USB, etc.).

3. Identify the GND_3 airwire and connect it to the nearest available ground via.

2. Clean up copper and resolve fill/stitching issues:

1. Regenerate the inner ground plane copper pour to resolve the three c37d412e fill/stitching items and add stitching vias as needed.

2. Delete the floating copper fragments: Trace 1692, 5ef0, 60f6, 7849, c80a, and e493.

3. Final verification:

1. Rerun airwire and DRC checks.

2. Confirm that only the six documented U3 EPAD overlap exceptions remain.

#Success criteria

- U1 P0.27 is routed to Q1 gate on top layer with correct trace width.

- PZ1 piezo signal correctly routed through C11 to U5 MCP6001 non-inverting input with required isolation.

- GND_3 is connected to ground via.

- Ground plane copper pour is updated, fill/stitching issues resolved, and all specified floating copper fragments are deleted.

- Post-fix DRC and airwire checks indicate only the accepted U3 EPAD exceptions remain.

Task unable to complete.

1:14

Thought for 4 sec — Considering PCB-Routing Skills
Looking up PCB routing airwire remediation floating copper cl....
Getting a layout overview.
Status
I re-ran the focused DRC/airwire checks and updated the itemized report in Post-Route DRC and Airwire Report. The current state is unchanged: 6 airwires, 6 floating-copper fragments, and the 6 accepted U3 EPAD overlap exceptions remain.
Blocker
I can’t complete the requested hand-routing or delete the specified orphan trace fragments from here because the available layout actions do not expose direct trace/via routing or trace-fragment deletion for those PCB UIDs. Manual PCB editor intervention is needed for P0.27, P2, GND_3, the c37d412e fill/stitching items, and floating traces 1692, 5ef0, 60f6, 7849, c80a, and e493.
Next steps
Hand-fix the listed traces/fragments in the PCB editor, then I can re-run DRC/airwire validation and confirm that only the six documented U3 EPAD exceptions remain.
Rerun validation
Locate fragments
Regenerate copper pour
List airwire endpoints

Refine this doc
Ask about this doc
Disconnected Pin Audit — Cortex v0
Generated after reviewing the live schematic connectivity and the latest ERC floating-pin review.
Bottom line
The disconnected pins reported during rewiring were mostly temporary disconnects used to move nets from the first-pass wiring to the revised architecture. In the current schematic, all power/regulator, QSPI, I2S, LED power, and SWD pins affected by those disconnect operations are reconnected correctly, except for intentionally unused spare MCU GPIOs and the WS2812B DOUT pin.
The current ERC floating-pin review reports 6 floating pins:
  • U1:P0.19
  • U1:P0.20
  • U1:P0.21
  • U1:P0.22
  • U1:P0.23
  • LED1:DOUT
These are not power pins. They should either receive explicit No Connect markers if intentionally unused, or be assigned to a future function/test pad if desired.
Batch 1 disconnects — power-path rewiring
These were disconnected while moving the system input rail from unswitched VBAT to switched VBAT_SW, and while moving the WS2812B supply from direct 3V3 to a load-switched rail.

Table


Reported disconnected pinCurrent statusIntentional?Action needed
LED1:VDDReconnected to WS2812_VDD_SW via U6:VOUT / U6:QODYes — intentionally moved off direct 3V3No electrical fix needed. This implements LED rail power gating.
U3:VIN::10Reconnected to VBAT_SWYesNo fix needed.
U3:VIN::11Reconnected to VBAT_SWYesNo fix needed.
U3:VINAReconnected to VBAT_SWYesNo fix needed.
U3:ENReconnected to VBAT_SWYesNo fix needed. If firmware-controlled regulator enable is later desired, route this to an MCU/supervisor instead.
U3:PS/SYNCReconnected to VBAT_SWYesNo fix needed. This ties the mode/sync control high with the switched battery rail.
R6:P1R6 was removedYesNo fix needed. Removed because the piezo-to-ADC path was replaced by the MCP6001 buffer/filter.
R6:P2R6 was removedYesNo fix needed. Removed because the piezo-to-ADC path was replaced by the MCP6001 buffer/filter.
Note: the tool output counted repeated U3:VIN entries because the TPS63020 has duplicate VIN pins; both VIN pins are now on VBAT_SW.
Batch 2 disconnects — QSPI/I2S pin reassignment
These were disconnected while moving QSPI onto the requested P0.13–P0.18 range and moving I2S onto P1.00–P1.02.

Table


Reported disconnected pinCurrent statusIntentional?Action needed
U1:P0.13Reconnected to QSPI_SCKYesNo fix needed.
U1:P0.14Reconnected to QSPI_CS_FLASHYesNo fix needed.
U1:P0.15Reconnected to QSPI_IO0YesNo fix needed.
U1:P0.16Connected to QSPI_IO1YesNo fix needed. This pin was part of the final QSPI assignment.
U1:P0.17Reconnected to QSPI_IO2YesNo fix needed.
U1:P0.18Connected to QSPI_IO3YesNo fix needed. This pin was part of the final QSPI assignment.
U1:P0.19Currently floating; ERC warningYes, if treated as spare GPIOAdd No Connect marker or reserve as optional test/GPIO. Do not tie directly to GND unless firmware/boot requirements say so.
U1:P0.20Currently floating; ERC warningYes, if treated as spare GPIOAdd No Connect marker or reserve as optional test/GPIO. No pull required unless assigned later.
U1:P0.21Currently floating; ERC warningYes, if treated as spare GPIOAdd No Connect marker or reserve as optional test/GPIO. No pull required unless assigned later.
U1:P0.22Currently floating; ERC warningYes, if treated as spare GPIOAdd No Connect marker or reserve as optional test/GPIO. No pull required unless assigned later.
U1:P0.23Currently floating; ERC warningYes, if treated as spare GPIOAdd No Connect marker or reserve as optional test/GPIO. No pull required unless assigned later.
U4:~CSReconnected to QSPI_CS_FLASHYesNo fix needed.
U4:CLKReconnected to QSPI_SCKYesNo fix needed.
U4:DI(IO0)Reconnected to QSPI_IO0YesNo fix needed.
U4:DO(IO1)Reconnected to QSPI_IO1YesNo fix needed.
U4:IO2Reconnected to QSPI_IO2YesNo fix needed.
U4:IO3Reconnected to QSPI_IO3YesNo fix needed.
MK1:BCLKReconnected to I2S_BCLK on U1:P1.00YesNo fix needed.
MK1:WSReconnected to I2S_LRCLK on U1:P1.01YesNo fix needed.
MK1:DATA_OUTReconnected to I2S_SD on U1:P1.02YesNo fix needed.
Other floating pin found by ERC

Table


PinCurrent statusIntentional?Action needed
LED1:DOUTFloating; ERC warningYes, because there is only one WS2812B in the chainAdd a No Connect marker. Do not tie to GND or pull up/down.
Substitution / one-for-one replacement notes
SWD header substitution
The main one-for-one substitution was J3:
  • Original J3: Conn_02x03-TSM-103-01-L-DV, a 2×3 SWD-style header.
  • New J3: TSW-105-07-G-S, a 1×5 2.54 mm header.
Reason: the updated requirement asked for a 5-pin SWD interface: VDD, SWDIO, GND, SWDCLK, and RESET. A TC2030 footprint would be preferable if available, but the available fallback was the 2.54 mm 5-pin header.
Symbol refreshes that looked like substitutions
I also used an add/remove pattern on U4 and MK1 to clear stale net membership after the QSPI/I2S reassignment:
  • U4 remained W25Q128JVSIQ; this was not an MPN change.
  • MK1 remained SPH0645LM4H-B; this was not an MPN change.
The reason was net hygiene: after disconnecting/reassigning the QSPI and I2S nets, refreshing those components made it easier to ensure QSPI_IO0 and I2S_SD were separated correctly and then reconnected cleanly.
Add explicit No Connect markers to:
  • U1:P0.19
  • U1:P0.20
  • U1:P0.21
  • U1:P0.22
  • U1:P0.23
  • LED1:DOUT
No pins from the disconnect batches need to be tied to ground or pulled up/down based on the current schematic. The remaining floating items are spare MCU GPIOs plus the unused WS2812B chain output.
  • Bottom line

  • Batch 1 disconnects — power-path rewiring

  • Batch 2 disconnects — QSPI/I2S pin reassignment

  • Other floating pin found by ERC

  • Substitution / one-for-one replacement notes

  • SWD header substitution

  • Symbol refreshes that looked like substitutions

  • Recommended cleanup

Cortex v0 BLE Audio Wearable

Cortex v0 BLE Audio Wearable thumbnail
Cortex v0 tiny AI wearable schematic: Raytac MDBT53V-1M BLE/nRF5340 module, USB-C LiPo charging, TPS63020 3.3V buck-boost, dual microphones, QSPI flash, tactile button, and WS2812B LED on a ~30mm round 4-layer PCB.

Properties

U3 TPS63020 EPAD: six overlapping-copper DRC errors accepted for v0 with note accepted-with-known-limitation: thermal vias missing, fix in rev-A.

Pricing & Availability

Distributor

Qty 1

Arrow

$4.69–$6.81

Digi-Key

$7.01–$10.65

HQonline

$5.70

LCSC

$19.06–$20.41

Mouser

$8.35

TME

$2.50

Verical

$4.19–$37.71

Controls