LED Blinker Circuit Design

flux

Manufacturing files generated successfully:
  1. Gerber ZIP

  2. JLCPCB BOM CSV

    CommentDesignatorFootprintJLCPCB Part #LCSC Part #
    Non-Polarized Capacitor 22uF SMD_0603_1608MetricC_3V3_OUT, C_5V_OUT
    Non-Polarized Capacitor 100nF SMD_0603_1608MetricC_4V_BOOT, C_LTE_100N, C_MCU_VDD1, C_MCU_VDD2, C_MCU_VDD3, C_MCU_VDDA, C_NRST
    Non-Polarized Capacitor 1uF SMD_0603_1608MetricC_4V_VCC
    Non-Polarized Capacitor 1nF SMD_0603_1608MetricC_ACS_FILTER
    Non-Polarized Capacitor 100uF SMD_1206_3216MetricC_LTE_BULK
    Non-Polarized Capacitor 1000uF SMD_0603_1608MetricC_RES
    1N4007D2
    L-53IDD_STATUSLED-TH_BD5.9-P2.54-RD_REDC598429
    P6KE15AD_TVS
    U.FL-R-SMT(01)J_ANT
    236-103J_CT, J_RELAY_CONTACT, J_VSENSE
    DC-005J_PWR
    236-102J_S1, J_S2
    2452796-1J_SIM
    TSW-105-07-G-SJ_SWD
    TSW-103-07-G-SJ_UART
    SRD-12VDC-SL-CK1
    Inductor 8.2uH SMD_0603_1608MetricL1
    BC547Q1
    Resistor 10kΩ SMD_0603_1608MetricR_BOOT0, R_NRST
    Resistor 100kΩ SMD_0603_1608MetricR_FB1
    Resistor 33.2kΩ SMD_0603_1608MetricR_FB2
    Resistor 330Ω SMD_0603_1608MetricR_OPTO_LED, R_OPTO_LED2
    Resistor 4.7kΩ SMD_0603_1608MetricR_Q_BASE
    Resistor 1kΩ SMD_0603_1608MetricR_STATUS
    1040TP_RESET
    AMS1117-3.3U_3V3
    LMR33630ADDAU_4VESOP-8_L4.9-W3.9-P1.27-LS6.0-BL-EP-1C2866787
    AMS1117-5.0U_5V
    ACHS-7122-000EU_ACS8-SO
    A7672SU_LTE
    STM32F103C8T6U_MCU
    PC817U_OPTO1, U_OPTO2DIP-4_W7.62mm
    ECS-80-12-33-JGN-TRY1

  3. PCBWay BOM CSV

    Item #DesignatorQtyManufacturerMfg Part #Description / ValuePackage/FootprintTypeYour Instructions / Notes
    1C_3V3_OUT,C_5V_OUT2Non-Polarized Capacitor, 22uF, SMD_0603_1608Metric
    2C_4V_BOOT,C_LTE_100N,C_MCU_VDD1,C_MCU_VDD2,C_MCU_VDD3,C_MCU_VDDA,C_NRST7Non-Polarized Capacitor, 100nF, SMD_0603_1608Metric
    3C_4V_VCC1Non-Polarized Capacitor, 1uF, SMD_0603_1608Metric
    4C_ACS_FILTER1Non-Polarized Capacitor, 1nF, SMD_0603_1608Metric
    5C_LTE_BULK1Non-Polarized Capacitor, 100uF, SMD_1206_3216Metric
    6C_RES1Non-Polarized Capacitor, 1000uF, SMD_0603_1608Metric
    7D21NTE Electronics, Inc1N4007Diode
    8D_STATUS1KingbrightL-53IDLED, LED-TH_BD5.9-P2.54-RD_REDLED-TH_BD5.9-P2.54-RD_RED
    9D_TVS1STMicroelectronicsP6KE15ADiode
    10J_ANT1Hirose Electric Co LtdU.FL-R-SMT(01)Connector
    11J_CT,J_RELAY_CONTACT,J_VSENSE3Wago236-103Connector
    12J_PWR1Best IncDC-005Connectors
    13J_S1,J_S22https://wago.priintcloud.com/datasheets/236-102/en/236-102Connector
    14J_SIM1TE Connectivity2452796-1Connector
    15J_SWD1SamtecTSW-105-07-G-SConnector
    16J_UART1Samtec Inc.TSW-103-07-G-SConnector
    17K11Ningbo Songle RelaySRD-12VDC-SL-CRelay
    18L11Inductor, 8.2uH, SMD_0603_1608Metric
    19Q11onsemiBC547Transistor
    20R_BOOT0,R_NRST2Resistor, 10kΩ, SMD_0603_1608Metric
    21R_FB11Resistor, 100kΩ, SMD_0603_1608Metric
    22R_FB21Resistor, 33.2kΩ, SMD_0603_1608Metric
    23R_OPTO_LED,R_OPTO_LED22Resistor, 330Ω, SMD_0603_1608Metric
    24R_Q_BASE1Resistor, 4.7kΩ, SMD_0603_1608Metric
    25R_STATUS1Resistor, 1kΩ, SMD_0603_1608Metric
    26TP_RESET1Keystone1040Connectors
    27U_3V31AMS AMS1117-3.3Integrated Circuit
    28U_4V1TI(德州仪器)LMR33630ADDADC-DC Converters, ESOP-8_L4.9-W3.9-P1.27-LS6.0-BL-EP-1ESOP-8_L4.9-W3.9-P1.27-LS6.0-BL-EP-1
    29U_5V1AMS AMS1117-5.0Integrated Circuit
    30U_ACS1BroadcomACHS-7122-000ESensor, 8-SO8-SO
    31U_LTE1SIMCom Wireless Solutions Limited A7672SRF Transceiver
    32U_MCU1STMicroelectronicsSTM32F103C8T6Microcontroller
    33U_OPTO1,U_OPTO22PC817, DIP-4_W7.62mmDIP-4_W7.62mm
    34Y11ECSECS-80-12-33-JGN-TROscillator

  4. JLCPCB Pick-and-Place / CPL CSV

    DesignatorLayerRotationMid XMid Y
    C_3V3_OUTTop058mm-49mm
    C_4V_BOOTTop038mm48mm
    C_4V_VCCTop088mm58.5mm
    C_5V_OUTTop058mm-36mm
    C_ACS_FILTERTop056mm-25mm
    C_LTE_100NTop088mm55mm
    C_LTE_BULKTop084mm59mm
    C_MCU_VDD1Top023mm-1.4mm
    C_MCU_VDD2Top9026mm-4.2mm
    C_MCU_VDD3Top9032.5mm-0.8mm
    C_MCU_VDDATop032.5mm-4.2mm
    C_NRSTTop017mm10mm
    C_RESTop062mm-20mm
    D2Top270-72mm-8.08mm
    D_STATUSTop090mm12mm
    D_TVSTop047.2644mm-35mm
    J_ANTTop090mm61.225mm
    J_CTTop052.9573mm-52.15mm
    J_PWRTop27085.6mm-24.5mm
    J_RELAY_CONTACTTop90-87.85mm-2.0427mm
    J_S1Top0-90.85mm-59.2025mm
    J_S2Top0-91.1589mm-43.1998mm
    J_SIMTop048mm2.25mm
    J_SWDTop18010mm-60mm
    J_UARTTop040.54mm-59.5mm
    J_VSENSETop069.9573mm-52.15mm
    K1Top0-61mm0mm
    L1Top038mm42mm
    Q1Top0-48.73mm-8mm
    R_BOOT0Top025mm15mm
    R_FB1Top047mm48mm
    R_FB2Top047mm36mm
    R_NRSTTop019mm14mm
    R_OPTO_LEDTop010mm20mm
    R_OPTO_LED2Top0-29mm30mm
    R_Q_BASETop0-36mm-4mm
    R_STATUSTop090mm5mm
    TP_RESETTop030mm12mm
    U_3V3Top068mm-49mm
    U_4VTop042.995mm42mm
    U_5VTop068mm-36mm
    U_ACSTop050mm-25mm
    U_LTETop072mm42mm
    U_MCUTop025mm5mm
    U_OPTO1Top180-15mm21.27mm
    U_OPTO2Top0-15mm30.5983mm
    Y1Top017mm5mm

  5. DXF Drawing

The DXF uses a MILLING_CUTOUT layer and shows the 1.5mm non-plated full-height isolation slot centered at x=85mm on the 200×140mm board. Specify 2-layer FR4, ENIG in the fab order notes.
Review package and DRC
Review Gerbers
Check DXF alignment
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Project Specification: GLECS V4 Pure Logic Controller
Project Overview
  • Status: Draft from uploaded specification
  • Device: GLECS V4 PURE LOGIC CONTROLLER, Onboard 4G Module Edition
  • PCB: 200mm x 140mm rectangular, 2-layer FR4, 1.6mm, 1oz copper, ENIG finish
  • Purpose: STM32-based clean logic controller with onboard 4G connectivity, isolated relay/switching section, sensors, display/debug headers, and strict ground isolation between relay and logic zones.
Intended Use
  • Controller board for monitoring and command/control, including Ganga starter coil command wiring through an isolated relay contact interface.
  • Intended as a production-intent or advanced prototype PCB with onboard cellular connectivity.
What the Device Should Do
  • Accept 12V DC input through a barrel jack.
  • Generate 5V, 3.3V, and 4.0V LTE rails.
  • Run STM32F103C8T6 firmware.
  • Communicate with an onboard A7672S/SIM7600 4G module through UART.
  • Provide relay command output through an optically isolated relay zone.
  • Read DS18B20, DHT22, and ACS712 sensor signals.
  • Provide OLED I2C, SWD programming, UART debug, reset test point, SIM, and U.FL antenna interfaces.
Main Features
  • STM32F103C8T6 MCU with 8MHz crystal, reset, BOOT0, SWD, and UART debug.
  • A7672S/SIM7600-style onboard 4G module header with nano SIM holder and U.FL antenna connector.
  • Separate Zone 1 relay/switching ground and Zone 2 logic/star ground.
  • 12V relay output contact interface via SPDT relay.
  • 12V input protection: fuse, TVS, reservoir capacitor.
  • Multiple regulated rails: 5V, 3.3V, and 4V LTE.
System Architecture
Diagram



  
    
  
  
    
  


























12V DC Barrel Jack
Fuse, TVS, Reservoir
5V Regulator
3.3V Regulator
4.0V LTE Buck
STM32F103C8T6
A7672S node_4G Module
Nano SIM
U.FL Antenna
I2C OLED Header
Sensors
PC817 Optocoupler
12V Relay Driver Zone
Hardware Subsystems
Power
  • J_PWR: DC-005 5.5mm/2.1mm center-positive barrel jack.
  • F1: 1A polyfuse specified in uploaded spec.
  • D_TVS: P6KE15A across VCC_12V_INPUT and GND_STAR.
  • C_RES: 1000uF/25V reservoir capacitor.
  • U_5V: AMS1117-5.0 from 12V to 5V.
  • U_3V3: AMS1117-3.3 from 5V to 3.3V.
  • U_4V: LMR33630 buck from 5V to 4.0V LTE rail with 100k/51.1k feedback.
MCU
  • STM32F103C8T6 powered from 3.3V.
  • VDD/VDDA decoupling, reset pull-up/cap, BOOT0 pull-down, 8MHz crystal with 22pF load capacitors.
Cellular
  • A7672S/SIM7600-type module on 2x20 header.
  • Dedicated 4V rail with local 100uF and 100nF decoupling.
  • SIM holder and U.FL connector with antenna keepout.
Relay Isolation
  • Zone 1 is left of x=85mm isolation slot.
  • GND_RELAY and GND_STAR must never connect.
  • Only RELAY_CTRL crosses the slot through PC817 LED input path.
Sensors and Headers
  • DS18B20, DHT22, ACS712-20A, OLED I2C, SWD, UART debug, status LED, reset test point.
Interfaces and Connections
  • Power input: 12V DC barrel jack.
  • Relay terminals: J1 12V relay drive, J2 starter coil COM/NO/NC.
  • Cellular: SIM card holder and U.FL/IPEX antenna.
  • Sensors: DS18B20, DHT22, ACS712 current sense.
  • Debug: SWD and UART headers.
  • Display: 4-pin I2C OLED header.
Power Tree and Power Budget

Table

RailSourceLoads
VCC_12V_INPUTJ_PWR through F15V regulator input, reservoir/protection
VCC_12V_RELAYDirect 12V relay feed per specRelay coil/screw terminal zone only
VCC_5VAMS1117-5.0Sensors, OLED, pullups, feeds 3.3V and 4V regulators
VCC_3V3AMS1117-3.3STM32, SWD/debug references
VCC_4V_LTELMR33630 buckA7672S/SIM7600 4G module
Important engineering concern: The uploaded spec feeds AMS1117-5.0 from 12V while also feeding LTE through downstream conversion. This may exceed safe thermal dissipation depending on sensor/OLED/current loads and should be verified or changed to a buck-first power tree before layout.
Manufacturing and Assembly Expectations
  • 2-layer FR4, 1.6mm, 1oz copper, ENIG.
  • Mixed components from spec include SMD and through-hole; hand-soldering ease must be considered when choosing footprints.
  • Zone isolation slot: 1.5mm physical cutout at x=85mm, full height.
Firmware-Relevant Hardware Requirements
  • STM32 boot from flash via BOOT0 pulldown.
  • SWD programming header and UART debug header required.
  • UART2 to LTE module.
  • GPIO controls: LTE_PWRKEY, LTE_RESET, RELAY_CTRL.
  • Inputs: LTE_STATUS, DS18B20, DHT22, ACS712 ADC.
Physical Design Expectations
  • Board size: 200mm x 140mm.
  • Zone 1: x=0-85mm isolated relay/switching zone.
  • Zone 2: x=85-200mm clean logic zone.
  • 4G antenna top-right with copper keepout.
  • STM32 crystal keepout: no copper fill within 5mm and away from LTE/antenna trace.
Important Design Decisions
  • Preserve separate GND_STAR and GND_RELAY nets.
  • Use optocoupler for relay control isolation.
  • Use 4.0V dedicated regulator for LTE module.
  • Use 200x140mm board to relieve routing congestion around LTE and power clusters.
Assumptions
  • Uploaded DOCX is the controlling specification and replaces the previous LED blinker request.
  • Exact Flux library availability may require acceptable equivalent parts when specified MPNs are unavailable.
  • Power architecture from the spec will be checked against regulator thermal/current limits before finalizing.
Change Notes
  • Initial project created from uploaded GLECS V4 Onboard 4G 200x140 schematic specification.

    Project Overview

    Intended Use

    What the Device Should Do

    Main Features

    System Architecture

    Hardware Subsystems

    Power

    MCU

    Cellular

    Relay Isolation

    Sensors and Headers

    Interfaces and Connections

    Power Tree and Power Budget

    Manufacturing and Assembly Expectations

    Firmware-Relevant Hardware Requirements

    Physical Design Expectations

    Important Design Decisions

    Assumptions

    Change Notes

Documents

    Project Specification: GLECS V4 Pure Logic Controller

    Board Bring-Up Plan — GLECS V4 Logic Controller

    Firmware Starter — STM32F103C8T6

    Technical Construction File — GLECS V4 Logic Controller

    ERC Waivers — GLECS V4 Logic Controller

    PCB Layout Constraints — GLECS V4 Logic Controller

Assets

Assets are files uploaded to this project which can be used in various ways.

GLECS V4 Logic Controller thumbnail
STM32F103-based GLECS V4 pure logic controller with 12V input power tree, onboard 4G module, isolated relay control zone, sensors, OLED, debug headers, and 200x140mm two-layer PCB requirements.

Properties

Properties describe core aspects of the project.

Pricing & Availability

Distributor

Qty 1

Arrow

$12.42–$14.12

Digi-Key

$16.88–$17.44

HQonline

$2.39–$2.84

LCSC

$12.63–$13.24

Mouser

$20.40–$595.82

TME

$5.41–$5.67

Verical

$8.97–$31.52

Controls