Datasheet Review and Symbol Validation

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Looking for "part description package pin count supply voltage organization speed temperature range special features ordering/package information" in w9825g6kh.html

Looking for "absolute maximum ratings voltage current temperature" in w9825g6kh.html

Looking for "recommended operating conditions supply voltage input voltage temperature capacitance" in w9825g6kh.html

Looking for "dc electrical characteristics input leakage standby current operating current output high low voltage capacitance" in w9825g6kh.html

Looking for "pin descriptions pin configuration TSOP II 54" in w9825g6kh.html

Looking for "package dimensions TSOP II 54 mechanical dimensions" in w9825g6kh.html

Looking for "features summary self refresh auto refresh burst length CAS latency data mask auto precharge" in w9825g6kh.html

Looking for "part description package pin count supply voltage organization speed temperature range special features ordering/package information" in w9825g6kh_a04-1489735.pdf

Looking for "absolute maximum ratings voltage current temperature" in w9825g6kh_a04-1489735.pdf

Looking for "recommended operating conditions supply voltage input voltage temperature capacitance" in w9825g6kh_a04-1489735.pdf

Looking for "dc electrical characteristics input leakage standby current operating current output high low voltage capacitance" in w9825g6kh_a04-1489735.pdf

Looking for "pin descriptions pin configuration TSOP II 54" in w9825g6kh_a04-1489735.pdf

Looking for "package dimensions TSOP II 54 mechanical dimensions" in w9825g6kh_a04-1489735.pdf

Looking for "features summary self refresh auto refresh burst length CAS latency data mask auto precharge" in w9825g6kh_a04-1489735.pdf

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Review result for W9825G6KH-6I

Step 2 was not needed: this part project already has a datasheet URL set in its properties, so no property update was required.

I was able to extract the datasheet content from mirrored copies of the same Winbond family datasheet: PDF and HTML. The existing Winbond URL in the part properties appears to serve a binary resource that was not directly readable by the file reader.

1) Available part information in this project

Field	Value
MPN	W9825G6KH-6I
Manufacturer	Winbond
Part type	Integrated Circuits
Description	256 Mb SDRAM, 166 MHz, TSOP II 54
Package from datasheet	TSOP II, 54-pin, 400 mil, 0.80 mm pitch
Schematic implementation	54 individual terminal pins
PCB footprint presence	Yes, 54 pads present
Nets defined	None

2) Datasheet metadata summary

Core device metadata

Parameter	Datasheet value
Memory organization	4,194,304 words x 4 banks x 16 bits
Density	256 Mb
Interface	LVTTL
Supply voltage	3.3 V ± 0.3 V
Speed grade for -6I	166 MHz / CL3 or 133 MHz / CL2
Temperature grade for -6I	-40 °C to 85 °C
Package	TSOP II 54-pin, 400 mil, 0.80 mm pitch

Special features

Feature	Datasheet value
CAS latency	2, 3
Burst lengths	1, 2, 4, 8, full page
Refresh	8K cycles / 64 ms at -40 °C to 85 °C
Self-refresh	Supported
Note	Self refresh not supported for TA > 85 °C
DQM	LDQM, UDQM byte masking
Precharge	Auto-precharge and controlled precharge
Power modes	Power-down, self-refresh

3) Absolute maximum ratings

Parameter	Rating
Any pin relative to VSS	-1 V to VDD + 0.5 V, limited to 4.6 V max
VDD/VDDQ relative to VSS	-1 V to 4.6 V
Operating temperature for -6I	-40 °C to 85 °C
Storage temperature	-55 °C to 150 °C
Soldering temperature	260 °C for 10 s
Power dissipation	1 W
Short-circuit output current	50 mA

4) Recommended operating conditions and electrical characteristics

Recommended operating conditions

Parameter	Min	Typ	Max
VDD	3.0 V	3.3 V	3.6 V
VDDQ	3.0 V	3.3 V	3.6 V
VIH	2.0 V	-	VDD + 0.3 V
VIL	-0.3 V	-	0.8 V
Operating temperature for -6I	-40 °C	-	85 °C

DC characteristics

Parameter	Datasheet value
VOH	2.4 V min at IOH = -2 mA
VOL	0.4 V max at IOL = 2 mA
Input leakage	-5 µA to 5 µA
Output leakage	-5 µA to 5 µA
IDD1 operating current for -6I	60 mA max
IDD2 standby current for -6I	25 mA max
IDD2P power-down standby for -6I	2 mA max
IDD3 no operating current for -6I	35 mA max
IDD4 burst operating current for -6I	80 mA max
IDD5 auto-refresh current for -6I	75 mA max
IDD6 self-refresh current for -6I	2 mA max

Capacitance

Parameter	Max
CI	3.8 pF
CCLK	3.5 pF
CIO	6.5 pF

5) Pin descriptions from datasheet

Power, ground, and control pins

Pin/function	Datasheet description
VDD	Power for input buffers and logic circuit inside DRAM
VSS	Ground for input buffers and logic circuit inside DRAM
VDDQ	Power for I/O buffer, separated from VDD to improve DQ noise immunity
VSSQ	Ground for I/O buffer, separated from VSS to improve DQ noise immunity
CLK	System clock used to sample inputs on the rising edge
CKE	Controls clock activation/deactivation and entry to power-down, suspend, or self-refresh
CS	Chip select, enables/disables command decoder
RAS	Row address strobe command input
CAS	Column address strobe command input
WE	Write enable command input
LDQM / UDQM	Input/output mask pins for byte masking
NC	No connection

Address/data pins

Pin/function	Datasheet description
A0-A12	Multiplexed row/column address inputs
A10/AP	Also selects auto-precharge behavior during precharge/read/write commands
BS0 / BS1	Bank select inputs
DQ0-DQ15	Multiplexed data input/output pins

6) Package dimensions

Dimension	Min	Nom	Max
D	22.09 mm	22.22 mm	22.35 mm
E	11.56 mm	11.76 mm	11.96 mm
E1	10.03 mm	10.16 mm	10.29 mm
Pitch e	-	0.80 mm	-
Body height A	-	0.95 mm	1.05 mm
Lead length L	0.40 mm	0.50 mm	0.60 mm

7) Cross-check of symbol and footprint vs datasheet

Critical findings

Severity	Finding	Why it matters
Critical	The left-side symbol pin mapping is incorrect from pin 3 onward through pin 27.	This can cause a board wired to the wrong SDRAM pins, leading to total functional failure.
Critical	Several power and I/O supply pins are assigned to the wrong pin numbers.	This can cause incorrect power connection and possible device damage.
Critical	Several control/address pins are shifted to wrong numbers.	This will break memory initialization and bus operation even if the board is assembled correctly.
Medium	Footprint count appears correct at 54 pads, but geometric land pattern details were not exposed by the PCB inspector.	Pin count is consistent, but full mechanical verification of pad geometry/pitch in-project could not be completed from the available layout metadata.

Confirmed symbol mismatches

Project symbol pin	Project pin number	Datasheet expected at that pin number	Result
VDDQ_1	3	DQ1	Mismatch
DQ1	4	DQ2	Mismatch
DQ2	5	VSSQ	Mismatch
VSSQ_1	6	DQ3	Mismatch
DQ4	8	VDDQ	Mismatch
VDDQ_2	9	DQ5	Mismatch
VDD_2	14	LDQM	Mismatch
LDQM	15	BS0	Mismatch
~WE	16	BS1	Mismatch
~CAS	17	A10/AP	Mismatch
~RAS	18	A0	Mismatch
~CS	19	A1	Mismatch
BS0	20	A2	Mismatch
BS1	21	A3	Mismatch
A10/AP	22	VDD	Mismatch
A0	23	CS	Mismatch
A1	24	RAS	Mismatch
A2	25	CAS	Mismatch
A3	26	WE	Mismatch
VDD_3	27	VDDQ	Mismatch

Pins that do appear consistent

Project symbol pin	Pin number	Status
VDD_1	1	Matches datasheet
DQ0	2	Matches datasheet
VSS_1	28	Matches datasheet
A4 to VSS_3	29-54	Appears consistent with datasheet numbering

Bottom line

Area	Verdict
Datasheet availability	Present
Part metadata completeness	Good after datasheet extraction
Symbol correctness	Fail - critical pin mapping errors
Footprint existence	Present
Footprint mechanical verification	Partial only
Risk if used as-is	High risk of nonfunctional or damaged hardware

The most important issue is the symbol pin map from pins 3-27. That should be corrected before this part is used in any design.

@review check symbol issues

Inspect footprint geometry

Fetch exact pin map

19 days

Ready.

Reviews

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