Datasheet Review and Symbol Validation
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Looking for "part description package pin count supply voltage organization speed temperature range special features ordering/package information" in w9825g6kh.html
Looking for "absolute maximum ratings voltage current temperature" in w9825g6kh.html
Looking for "recommended operating conditions supply voltage input voltage temperature capacitance" in w9825g6kh.html
Looking for "dc electrical characteristics input leakage standby current operating current output high low voltage capacitance" in w9825g6kh.html
Looking for "pin descriptions pin configuration TSOP II 54" in w9825g6kh.html
Looking for "package dimensions TSOP II 54 mechanical dimensions" in w9825g6kh.html
Looking for "features summary self refresh auto refresh burst length CAS latency data mask auto precharge" in w9825g6kh.html
Looking for "part description package pin count supply voltage organization speed temperature range special features ordering/package information" in w9825g6kh_a04-1489735.pdf
Looking for "absolute maximum ratings voltage current temperature" in w9825g6kh_a04-1489735.pdf
Looking for "recommended operating conditions supply voltage input voltage temperature capacitance" in w9825g6kh_a04-1489735.pdf
Looking for "dc electrical characteristics input leakage standby current operating current output high low voltage capacitance" in w9825g6kh_a04-1489735.pdf
Looking for "pin descriptions pin configuration TSOP II 54" in w9825g6kh_a04-1489735.pdf
Looking for "package dimensions TSOP II 54 mechanical dimensions" in w9825g6kh_a04-1489735.pdf
Looking for "features summary self refresh auto refresh burst length CAS latency data mask auto precharge" in w9825g6kh_a04-1489735.pdf
Using PCB Layout Tool.
Compar.
Evalu.
Address.
1) Available part information in this project
| Field | Value |
|---|---|
| MPN | W9825G6KH-6I |
| Manufacturer | Winbond |
| Part type | Integrated Circuits |
| Description | 256 Mb SDRAM, 166 MHz, TSOP II 54 |
| Package from datasheet | TSOP II, 54-pin, 400 mil, 0.80 mm pitch |
| Schematic implementation | 54 individual terminal pins |
| PCB footprint presence | Yes, 54 pads present |
| Nets defined | None |
Core device metadata
| Parameter | Datasheet value |
|---|---|
| Memory organization | 4,194,304 words x 4 banks x 16 bits |
| Density | 256 Mb |
| Interface | LVTTL |
| Supply voltage | 3.3 V ± 0.3 V |
| Speed grade for -6I | 166 MHz / CL3 or 133 MHz / CL2 |
| Temperature grade for -6I | -40 °C to 85 °C |
| Package | TSOP II 54-pin, 400 mil, 0.80 mm pitch |
Special features
| Feature | Datasheet value |
|---|---|
| CAS latency | 2, 3 |
| Burst lengths | 1, 2, 4, 8, full page |
| Refresh | 8K cycles / 64 ms at -40 °C to 85 °C |
| Self-refresh | Supported |
| Note | Self refresh not supported for TA > 85 °C |
| DQM | LDQM, UDQM byte masking |
| Precharge | Auto-precharge and controlled precharge |
| Power modes | Power-down, self-refresh |
3) Absolute maximum ratings
| Parameter | Rating |
|---|---|
| Any pin relative to VSS | -1 V to VDD + 0.5 V, limited to 4.6 V max |
| VDD/VDDQ relative to VSS | -1 V to 4.6 V |
| Operating temperature for -6I | -40 °C to 85 °C |
| Storage temperature | -55 °C to 150 °C |
| Soldering temperature | 260 °C for 10 s |
| Power dissipation | 1 W |
| Short-circuit output current | 50 mA |
Recommended operating conditions
| Parameter | Min | Typ | Max |
|---|---|---|---|
| VDD | 3.0 V | 3.3 V | 3.6 V |
| VDDQ | 3.0 V | 3.3 V | 3.6 V |
| VIH | 2.0 V | - | VDD + 0.3 V |
| VIL | -0.3 V | - | 0.8 V |
| Operating temperature for -6I | -40 °C | - | 85 °C |
DC characteristics
| Parameter | Datasheet value |
|---|---|
| VOH | 2.4 V min at IOH = -2 mA |
| VOL | 0.4 V max at IOL = 2 mA |
| Input leakage | -5 µA to 5 µA |
| Output leakage | -5 µA to 5 µA |
| IDD1 operating current for -6I | 60 mA max |
| IDD2 standby current for -6I | 25 mA max |
| IDD2P power-down standby for -6I | 2 mA max |
| IDD3 no operating current for -6I | 35 mA max |
| IDD4 burst operating current for -6I | 80 mA max |
| IDD5 auto-refresh current for -6I | 75 mA max |
| IDD6 self-refresh current for -6I | 2 mA max |
Capacitance
| Parameter | Max |
|---|---|
| CI | 3.8 pF |
| CCLK | 3.5 pF |
| CIO | 6.5 pF |
Power, ground, and control pins
| Pin/function | Datasheet description |
|---|---|
| VDD | Power for input buffers and logic circuit inside DRAM |
| VSS | Ground for input buffers and logic circuit inside DRAM |
| VDDQ | Power for I/O buffer, separated from VDD to improve DQ noise immunity |
| VSSQ | Ground for I/O buffer, separated from VSS to improve DQ noise immunity |
| CLK | System clock used to sample inputs on the rising edge |
| CKE | Controls clock activation/deactivation and entry to power-down, suspend, or self-refresh |
| CS | Chip select, enables/disables command decoder |
| RAS | Row address strobe command input |
| CAS | Column address strobe command input |
| WE | Write enable command input |
| LDQM / UDQM | Input/output mask pins for byte masking |
| NC | No connection |
Address/data pins
| Pin/function | Datasheet description |
|---|---|
| A0-A12 | Multiplexed row/column address inputs |
| A10/AP | Also selects auto-precharge behavior during precharge/read/write commands |
| BS0 / BS1 | Bank select inputs |
| DQ0-DQ15 | Multiplexed data input/output pins |
6) Package dimensions
| Dimension | Min | Nom | Max |
|---|---|---|---|
| D | 22.09 mm | 22.22 mm | 22.35 mm |
| E | 11.56 mm | 11.76 mm | 11.96 mm |
| E1 | 10.03 mm | 10.16 mm | 10.29 mm |
| Pitch e | - | 0.80 mm | - |
| Body height A | - | 0.95 mm | 1.05 mm |
| Lead length L | 0.40 mm | 0.50 mm | 0.60 mm |
Critical findings
| Severity | Finding | Why it matters |
|---|---|---|
| Critical | The left-side symbol pin mapping is incorrect from pin 3 onward through pin 27. | This can cause a board wired to the wrong SDRAM pins, leading to total functional failure. |
| Critical | Several power and I/O supply pins are assigned to the wrong pin numbers. | This can cause incorrect power connection and possible device damage. |
| Critical | Several control/address pins are shifted to wrong numbers. | This will break memory initialization and bus operation even if the board is assembled correctly. |
| Medium | Footprint count appears correct at 54 pads, but geometric land pattern details were not exposed by the PCB inspector. | Pin count is consistent, but full mechanical verification of pad geometry/pitch in-project could not be completed from the available layout metadata. |
Confirmed symbol mismatches
| Project symbol pin | Project pin number | Datasheet expected at that pin number | Result |
|---|---|---|---|
| VDDQ_1 | 3 | DQ1 | Mismatch |
| DQ1 | 4 | DQ2 | Mismatch |
| DQ2 | 5 | VSSQ | Mismatch |
| VSSQ_1 | 6 | DQ3 | Mismatch |
| DQ4 | 8 | VDDQ | Mismatch |
| VDDQ_2 | 9 | DQ5 | Mismatch |
| VDD_2 | 14 | LDQM | Mismatch |
| LDQM | 15 | BS0 | Mismatch |
| ~WE | 16 | BS1 | Mismatch |
| ~CAS | 17 | A10/AP | Mismatch |
| ~RAS | 18 | A0 | Mismatch |
| ~CS | 19 | A1 | Mismatch |
| BS0 | 20 | A2 | Mismatch |
| BS1 | 21 | A3 | Mismatch |
| A10/AP | 22 | VDD | Mismatch |
| A0 | 23 | CS | Mismatch |
| A1 | 24 | RAS | Mismatch |
| A2 | 25 | CAS | Mismatch |
| A3 | 26 | WE | Mismatch |
| VDD_3 | 27 | VDDQ | Mismatch |
Pins that do appear consistent
Bottom line
| Area | Verdict |
|---|---|
| Datasheet availability | Present |
| Part metadata completeness | Good after datasheet extraction |
| Symbol correctness | Fail - critical pin mapping errors |
| Footprint existence | Present |
| Footprint mechanical verification | Partial only |
| Risk if used as-is | High risk of nonfunctional or damaged hardware |
Ready.
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Assets
W9825G6KH-6I
SOP80P1176X120-54N.kicad_modFootprint
W9825G6KH-6I
W9825G6KH-6I Symbol.svgDefault
W9825G6KH-6I-thumb.png
W9825G6KH-6I-thumbThumbnailW9825G6KH-6I
W9825G6KH-6I.stp3D ModelControls
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