I reviewed the part project against the datasheet and current project data.
Overall result
The part metadata is partially complete.
The project already has a Datasheet URL, so I did not search/update it per your rule.
The symbol is mostly aligned by pin names/numbers, but there are several likely mismatches and a lot of missing pin metadata.
The footprint exists and appears to target a 100-pin VQFN with exposed pad, which matches the datasheet package family, but I could only do a structural cross-check from the available layout data.
Metadata reviewCurrent project metadata
MPN: USB5807C/KD
Manufacturer: Microchip
Part Type: Integrated Circuits
Designator Prefix: IC
Datasheet URL: Mouser-hosted PDF
Datasheet-derived metadata
The datasheet identifies USB5807C/KD as a Microchip Technology Inc. low-power, OEM-configurable 7-port USB 3.1 Gen 1 hub controller in a 100-pin VQFN, 12 mm x 12 mm package, with VDD12 = 1.08 V to 1.32 V and VDD33 = 3.0 V to 3.6 V. It supports 7 downstream ports and 1 upstream port, BC 1.2 features, FlexConnect, OTP/SPI/SMBus configuration, and an exposed pad tied to ground. The datasheet also lists commercial 0 C to 70 C and industrial -40 C to 85 C grades.
These values come directly from the datasheet extraction.
Schematic symbol reviewWhat matches
The project contains 101 terminal components, which is consistent with a 100-pin package plus an exposed ground pad being modeled as a separate terminal, matching the datasheet guidance that the exposed pad must be tied to ground.
Many core pins align correctly by name and pin number, for example:
Issues found1. All terminal pin types are still unset
Every terminal I inspected has Pin Type: Unspecified, including power, ground, clock, control, and USB pins. That weakens ERC behavior and is a clear incompleteness issue for an IC-style part project. The sync workflow specifically expects exact pin typing from the datasheet.
The datasheet extraction returned pin 55 as SPEED_IND7/BC_IND7/GPIO0
That is a likely symbol mismatch on pin 55 and should be verified against the original pin table page in the PDF.
3. Ground/exposed pad naming inconsistency
The project models the exposed pad as VSS with pin 101
The datasheet text refers to the exposed pad / ground as GND, and the extracted pin table does not provide a separate numeric pin for the pad
So this is not necessarily wrong, but it is a naming/numbering ambiguity:
electrically: likely fine
library accuracy: should be confirmed whether you want the pad terminal named GND or VSS, and whether 101 is your intended internal convention
4. Missing pin descriptions
The terminals do not appear to carry short per-pin descriptions beyond the designator text, even though the datasheet provides meaningful functional descriptions for pins like VBUS_DET/GPIO16, RESET_N, TESTEN, and the PRT_CTL1/GPIO17 through PRT_CTL7/GPIO23 multifunction pins.
5. Missing symbol organization metadata
I did not see populated Section, Pin Group, Pin Orientation, or sub-symbol grouping on the terminals. For a 100-pin hub IC, that is a major completeness gap.
Footprint reviewWhat matches
The datasheet describes a 100-pin VQFN, 12.00 mm x 12.00 mm, 0.40 mm pitch package with an optional/exposed center pad about 8.1 mm and a required ground via array. The project layout contains:
a footprint object
pad objects for all terminals
a separate layout footprint container and shape objects
That is structurally consistent with a VQFN package.
What I could not fully verify
The layout tool did not expose pad geometry dimensions, so I could not directly verify:
pad width/length against the datasheet land pattern
exact 0.40 mm pitch
exact body outline size
exact center pad size / thermal via pattern
pin 1 indicator geometry
Footprint-specific flags
The datasheet calls for the exposed pad to connect to ground with a via array, and recommends filled/tented thermal vias for reflow robustness.
I could not confirm the center pad geometry or via pattern from the available layout data.
I also could not confirm pin-1 marker placement from the footprint object alone, only that the datasheet requires a visible pin-1 indicator.
Property issues to flag
Table
Property
Status
Notes
Manufacturer Part Number
OK
USB5807C/KD matches project
Manufacturer Name
Mostly OK
Project says Microchip; datasheet says Microchip Technology Inc.
Part Type
Weak
Integrated Circuits is too generic; USB hub controller would be more precise
Package / Case Code
Missing
Datasheet says 100-pin VQFN, 12 mm x 12 mm
Designator Prefix
Weak
IC works, but U is more conventional for ICs
Datasheet URL
Present
Existing URL is Mouser-hosted, not canonical Microchip PDF
Operating Voltage
Missing
Should reflect the recommended supply context from datasheet
Operating Temperature
Missing
Commercial and industrial variants are listed in datasheet
Wirelessly connects nets on schematic. Used to organize schematics and separate functional blocks. To wirelessly connect net portals, give them same designator. #portal
General Purpose Thick Film Standard Power
and High-Power Chip Resistor
47 kOhms ±5% 0.125W, 1/8W Chip Resistor 0805 (2012 Metric) Automotive AEC-Q200 Thick Film
Features:
- RMCF – standard power ratings
- RMCP – high power ratings
- Nickel barrier terminations standard
- Power derating from 100% at 70ºC to zero at +155ºC
- RoHS compliant, REACH compliant, and halogen free
- AEC-Q200 compliant