Functional pins: 4 signal contacts (positions 1–4) at 0.5 mm pitch; bottom contact; horizontal insertion; ZIF back-flip actuator.
Mechanical pads: 2 metal hold-downs/tabs (commonly denoted MP1, MP2).
Pin 1 orientation: Refer to the 2D Drawing (English) for the exact pin-1 marker and orientation. The product page does not display the mark inline.
Cross-check: schematic symbol and footprint vs. datasheet
What matches
Pin count: Symbol shows four contacts 1, 2, 3, 4 which matches a 4-position receptacle.
Mechanical pads: Symbol includes MP1 and MP2, consistent with typical metal hold-down tabs for this series.
Designator prefix: Set to J, appropriate for connectors.
Items that require verification (potential risks)
Land pattern geometry: The footprint pad sizes and spacing could not be auto-extracted from the 2D drawing. You should verify pad dimensions, solder mask/paste apertures, and courtyard against “2D Drawing – English” (D166077_en) to ensure manufacturability.
Pitch confirmation on PCB: The layout API did not expose pad coordinates, so the 0.5 mm center-to-center pitch between contacts 1–4 could not be numerically verified here.
Pin-1 mark and orientation: Confirm the Pin 1 location on the footprint silkscreen/pin numbering matches the drawing. Incorrect pin-1 orientation is a common cause of assembly issues.
Keep-out and actuator clearance: Ensure the footprint provides adequate keep-out/clearance for the back-flip actuator mechanism per the drawing so the FPC can insert/remove freely.
Board edge and component keep-outs: If the design plans to place this at a board edge for cable access, confirm the mechanical outline and insertion path align with the recommended dimensions in the 2D drawing.
If you want, I can verify the pad geometry and pin-1 location against the 2D drawing by measuring your footprint directly and list any specific mismatches to fix.
Wirelessly connects nets on schematic. Used to organize schematics and separate functional blocks. To wirelessly connect net portals, give them same designator. #portal
General Purpose Thick Film Standard Power
and High-Power Chip Resistor
47 kOhms ±5% 0.125W, 1/8W Chip Resistor 0805 (2012 Metric) Automotive AEC-Q200 Thick Film
Features:
- RMCF – standard power ratings
- RMCP – high power ratings
- Nickel barrier terminations standard
- Power derating from 100% at 70ºC to zero at +155ºC
- RoHS compliant, REACH compliant, and halogen free
- AEC-Q200 compliant