Bluetooth, WiFi 802.11b/g/n/ax, Bluetooth v5.4 Transceiver Module 2.4GHz Integrated, Chip Surface Mount
Silicon Labs SiWG917 module is our lowest power Wi-Fi 6 plus Bluetooth LE 5.4, ideal
for ultra-low power IoT wireless devices using Wi-Fi®, Bluetooth, Matter, and IP networking for secure cloud connectivity. It is optimal for developing battery operated devices
that need long battery life. SiWG917 module includes an ultra-low power Wi-Fi 6 plus
Bluetooth Low Energy (LE) 5.4 wireless CPU subsystem, and an integrated micro-controller (MCU) application subsystem, security, peripherals and power management subsystem all in a single 16 x 21.1 x 2.3 mm package. The wireless subsystem consists of a
multi-threaded Network Wireless Processor (NWP) running up to 160 MHz, baseband
digital signal processing, analog front end, 2.4 GHz RF transceiver and integrated power
amplifier. The application subsystem consists of an ARM® Cortex®-M4 running up to 180
MHz, embedded SRAM, flash, ultra-low power sensor hub, and matrix vector processor.
The ARM® Cortex®-M4 is dedicated for peripheral and application-related processing,
while the NWP runs the wireless and networking stacks on independent threads, thus
providing a fully integrated solution that is ready for a wide range of embedded wireless
IoT applications. The modules come with modular radio type approvals for various countries, including USA (FCC), Canada (IC/ISED) and Japan (MIC), and are in compliance
with the relevant EN standards (including EN 300 328 v2.2.2) for the conformity with the
directives and regulations in EU and UK.
KEY FEATURES
• Wi-Fi 6 Single Band 2.4 GHz 20 MHz 1x1
stream IEEE 802.11 b/g/n/ax
• Bluetooth LE 5.4
• Single chip Matter Over Wi-Fi Solution
• ARM® Cortex® M4 Processor with FPU
subsystem up to 180 MHz with rich set of
Digital and Analog Peripherals.
• Wi-Fi 6 Benefits: TWT for improved
efficiency and longer battery life, MUMIMO/OFDMA for Higher Throughput,
network capacity and low latency
• Best in Class Device and Wireless
Security
• WLAN Tx power up to +17.5 dBm with
integrated PA
• Bluetooth LE Tx power up to +17 dBm
with integrated PA
• WLAN Rx sensitivity as low as -95.5 dBm
• Wi-Fi 4 Standby Associated mode current:
71 μA @ 1-second listen interval
• Embedded Flash option up to 8 MB/
optional external Flash up to 16 MB
• Embedded PSRAM option up to 2 MB/
optional external PSRAM option up to 16
MB
• Ultra-low power sensor hub peripherals
• Matrix Vector Processor (MVP)
• Embedded Wi-Fi, Bluetooth LE, Matter,
and networking stacks supporting wireless
coexistence
• Three software-configurable MCU
application memory options for sharing the
RAM between the wireless, system, and
application (192/256/320 KB)
• Operating temperature: -40 to +85 ºC
• Operating supply range: 3.0 to 3.63 V
• Supply voltage for GPIOs: 1.71 to 3.63 V