Part Review and Datasheet Verification

flux

I’ll pull the SiWG917Y datasheet pin table, map each of the 71 terminals to datasheet-derived pin types/descriptions, update the terminal properties, then spot-check the result.

flux

I started the update and adjusted the pin-type vocabulary to Flux’s standard values before continuing.

flux

Populated Pin Type, Pin Group, and Pin Description for all 71 SiWG917Y terminals and verified the schematic now shows the new properties.
Open items:
  • The descriptions are concise datasheet-derived functional summaries; exhaustive alternate-function mux tables were not copied into every GPIO pin.
Suggested next steps:
  1. Update the Datasheet URL to the official Silicon Labs PDF.
  2. Audit the footprint geometry and antenna keepout against the recommended land pattern.
  3. Correct the IC metadata that previously showed Logic/AND.
Fix metadata and audit
Update datasheet URL
Fix IC metadata
Audit footprint geometry
Run part review

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Part Review: SIWG917Y111MGABAR
Sources checked
Current part metadata
  • MPN: SIWG917Y111MGABAR
  • Manufacturer: Silicon Labs
  • Description: RF System on a Chip / SoC module, Wi‑Fi 6 2.4 GHz, Bluetooth LE 5.4, integrated antenna, external PSRAM, 8 MB Flash noted in project description.
  • Part Type: Integrated Circuits
  • Package or Case Code: Module
  • Designator Prefix: IC
  • Terminal / pad count: 71
  • Current project Datasheet URL: https://storage.googleapis.com/graviton-electric-symbols/document_assets/user-uploaded/a304d5e8e6e437830e39c060dfff2feb9d6bc31b2834f45b43e373b5288d7fa0.pdf
  • Library Datasheet URL for same Part UID: https://www.silabs.com/documents/public/data-sheets/siwg917y-datasheet.pdf
  • Footprint asset: SIWG917Y111MGABAR.kicad_mod
Official datasheet status
A datasheet URL is already set on the project, so it was not overwritten. However, the official Silicon Labs datasheet URL was found and should be preferred for long-term maintainability:
https://www.silabs.com/documents/public/data-sheets/siwg917y-datasheet.pdf
Symbol / pin review
The symbol is implemented as 71 individual Terminal components, each carrying a Pin Number property. Pin numbers span 1 through 71 with no missing numbers observed in the inspected schematic data. The visible terminal names include the expected functional groups for this module family: antenna tuning, ground pads, RF, ULP GPIO, GPIO, JTAG/SWD, voltage rails, reset, POC, SDIO/Flash/IO supplies, and VBATT.
Observed pin-number mapping from the symbol:

Table

PinSymbol terminal name
1ANT_TUNE_1
2GND_1
3GND_2
4UULP_VBAT_GPIO_0
5ULP_GPIO_11
6ULP_GPIO_5
7ULP_GPIO_7
8ULP_GPIO_4
9GND_3
10RF
11GND_4
12GPIO_55
13JTAG_TMS_SWDIO
14JTAG_TDO_SWO
15JTAG_TCK_SWCLK
16JTAG_TDI
17GPIO_56
18GPIO_53
19GPIO_54
20GPIO_8
21GPIO_57
22GPIO_9
23ULP_GPIO_6
24GPIO_6
25GPIO_52
26ULP_IO_VDD
27ULP_GPIO_9
28ULP_GPIO_1
29UULP_VBAT_GPIO_3
30UULP_VBAT_GPIO_2
31POC_IN
32POC_OUT
33RESET_N
34VBATT
35ULP_GPIO_0
361V8_LDO
37ULP_GPIO_8
38GPIO_7
39GPIO_48
40GPIO_47
41GPIO_49
42GPIO_50
43GPIO_51
44GPIO_46
45GPIO_30
46GPIO_27
47GPIO_29
48GPIO_28
49GPIO_25
50IOVDD
51ULP_GPIO_2
52SDIO_IO_VDD
53GPIO_26
54FLASH_IO_VDD
55GPIO_10
56GPIO_12
57GND_5
58GPIO_11
59GPIO_15
60GND_6
61ANT_TUNE_2
62GND_7
63GND_8
64GND_9
65GND_10
66GND_11
67GND_12
68GND_13
69GND_14
70GND_15
71GND_16
Footprint review
  • Layout contains 71 pad nodes matching the 71 symbol terminals.
  • A KiCad footprint asset named SIWG917Y111MGABAR.kicad_mod is attached.
  • The inspection output confirms pad-node count and naming, but did not expose pad geometry/dimensions in enough detail to verify land pattern dimensions against the datasheet.
Mismatches / issues flagged
  1. Datasheet URL inconsistency: the current project property uses a user-uploaded PDF URL, while the Flux library record and web search identify the official Silicon Labs PDF URL. This is not a functional symbol mismatch, but the official URL should be used if the goal is traceable vendor documentation.
  2. IC-specific metadata is wrong: library search reports part-type-specific values icType: Logic and logicFunction: AND, which do not match a Silicon Labs Wi‑Fi/Bluetooth SoC module. These fields should be cleared or changed to RF/Wireless module / SoC module semantics if editable.
  3. Pin descriptions and pin types are incomplete: all inspected terminal Pin Type values are Unspecified, and no Pin Description values were present. The names and pin numbers are useful, but the symbol is not fully annotated.
  4. Footprint geometry not fully verified: pad count matches, but pad size, pitch, courtyard, keepout, antenna keepout, and module outline could not be confirmed from the available layout inspection output.
  5. Description wording has uncertainty: project description ends with “external PSRAM, 8MB Flash in IC package?”; this should be replaced with confirmed ordering-code memory/antenna/package wording from the datasheet.
Key specs confirmed at high level
  • Silicon Labs SiWG917Y module family.
  • 2.4 GHz Wi‑Fi 6 plus Bluetooth LE 5.4 module.
  • Integrated antenna variant indicated by project description and official product result.
  • Module package with 71 external pads/terminals in this Flux part.
  • Exact orderable MPN under review: SIWG917Y111MGABAR.
  1. Update the project Datasheet URL to the official Silicon Labs URL for traceability.
  2. Correct or remove the erroneous Logic / AND IC metadata.
  3. Populate each terminal with datasheet-derived Pin Type, Pin Group, and Pin Description.
  4. Perform a geometry-level footprint audit against the Silicon Labs recommended land pattern, including module outline and antenna keepout.
  5. Replace uncertain description text with confirmed ordering-code details from the datasheet.

  • Sources checked

  • Current part metadata

  • Official datasheet status

  • Symbol / pin review

  • Footprint review

  • Mismatches / issues flagged

  • Key specs confirmed at high level

  • Recommended fixes

Documents

  • Part Review: SIWG917Y111MGABAR

Assets

SIWG917Y111MGABAR-thumb.png

SIWG917Y111MGABAR-thumb.png

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SIWG917Y111MGABAR

SIWG917Y111MGABAR

SIWG917Y111MGABAR Symbol.svgDefault
kicad_mod

SIWG917Y111MGABAR

SIWG917Y111MGABAR.kicad_modFootprint
stp

SIWG917Y111MGABAR

SIWG917Y111MGABAR.stp3D Model

SIWG917Y111MGABAR

SIWG917Y111MGABAR thumbnail
Bluetooth, WiFi 802.11b/g/n/ax, Bluetooth v5.4 Transceiver Module 2.4GHz Integrated, Chip Surface Mount
Silicon Labs SiWG917 module is our lowest power Wi-Fi 6 plus Bluetooth LE 5.4, ideal for ultra-low power IoT wireless devices using Wi-Fi®, Bluetooth, Matter, and IP networking for secure cloud connectivity. It is optimal for developing battery operated devices that need long battery life. SiWG917 module includes an ultra-low power Wi-Fi 6 plus Bluetooth Low Energy (LE) 5.4 wireless CPU subsystem, and an integrated micro-controller (MCU) application subsystem, security, peripherals and power management subsystem all in a single 16 x 21.1 x 2.3 mm package. The wireless subsystem consists of a multi-threaded Network Wireless Processor (NWP) running up to 160 MHz, baseband digital signal processing, analog front end, 2.4 GHz RF transceiver and integrated power amplifier. The application subsystem consists of an ARM® Cortex®-M4 running up to 180 MHz, embedded SRAM, flash, ultra-low power sensor hub, and matrix vector processor. The ARM® Cortex®-M4 is dedicated for peripheral and application-related processing, while the NWP runs the wireless and networking stacks on independent threads, thus providing a fully integrated solution that is ready for a wide range of embedded wireless IoT applications. The modules come with modular radio type approvals for various countries, including USA (FCC), Canada (IC/ISED) and Japan (MIC), and are in compliance with the relevant EN standards (including EN 300 328 v2.2.2) for the conformity with the directives and regulations in EU and UK.
KEY FEATURES • Wi-Fi 6 Single Band 2.4 GHz 20 MHz 1x1 stream IEEE 802.11 b/g/n/ax • Bluetooth LE 5.4 • Single chip Matter Over Wi-Fi Solution • ARM® Cortex® M4 Processor with FPU subsystem up to 180 MHz with rich set of Digital and Analog Peripherals. • Wi-Fi 6 Benefits: TWT for improved efficiency and longer battery life, MUMIMO/OFDMA for Higher Throughput, network capacity and low latency • Best in Class Device and Wireless Security • WLAN Tx power up to +17.5 dBm with integrated PA • Bluetooth LE Tx power up to +17 dBm with integrated PA • WLAN Rx sensitivity as low as -95.5 dBm • Wi-Fi 4 Standby Associated mode current: 71 μA @ 1-second listen interval • Embedded Flash option up to 8 MB/ optional external Flash up to 16 MB • Embedded PSRAM option up to 2 MB/ optional external PSRAM option up to 16 MB • Ultra-low power sensor hub peripherals • Matrix Vector Processor (MVP) • Embedded Wi-Fi, Bluetooth LE, Matter, and networking stacks supporting wireless coexistence • Three software-configurable MCU application memory options for sharing the RAM between the wireless, system, and application (192/256/320 KB) • Operating temperature: -40 to +85 ºC • Operating supply range: 3.0 to 3.63 V • Supply voltage for GPIOs: 1.71 to 3.63 V
#WiFi6 #BluetoothLE54 #IoTModule #WirelessSoC #SiliconLabs #EmbeddedSystems #SmartHome #IndustrialIoT #LowPowerDesign #RFModule #ConnectedDevices #EdgeComputing #MatterReady #PCBDesign #ElectronicsEngineering

Properties

SIWG917Y111MGABAR

Silicon Labs

Module

silabs.com/documents/public/data-sheets/siwg917y-datasheet.pdf

U

Module

parametric-v1

creativecommons.org/licenses/by/4.0/

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