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Datasheet metadata extraction (QSH series; specific to -030, -01, -L, -D, -A where available)
Part number decoding
Series: QSH
Positions per row: 30 (code “030”) → total contacts: 60 (2 rows)
Lead style: 01
Plating: L = 10 µin (0.25 µm) Gold on contact, Matte Tin on tail
Type: D = Single-ended (not differential-pair)
Option: A = Pick & place pad (polyimide film)
Pitch: 0.50 mm (0.0197 in)
Rows: 2 (A/B)
Electrical and environmental
Current rating: 2 A per contact (with 2 pins powered)
Ground plane current (if applicable in options using ground plane): 25 A per ground plane (1 ground plane powered)
Voltage rating: 175 VAC / 247 VDC
Operating temperature range: -55 °C to +125 °C
Mechanical and stack height
General series dimensions include typical widths/heights such as (3.05) 0.120, (3.25) 0.128, (7.24) 0.285, (7.49) 0.295, etc. (see drawing)
Mated stack height with QTH (by QTH lead style):
01: A height 4.27 mm; with QSH 5.00 mm
02: 7.26 mm; with QSH 8.00 mm
03: 10.27 mm; with QSH 11.00 mm
04: 15.25 mm; with QSH 16.00 mm
05: 18.26 mm; with QSH 19.00 mm
07: 24.24 mm; with QSH 25.00 mm
09: 13.26 mm; with QSH 14.00 mm
Note: Processing conditions can affect mated height.
Recommended PCB land pattern (QSH-XXX-01-X-D-XXX)
The datasheet provides a full recommended layout for QSH-XXX-01-X-D-XXX including typical values such as:
0.5001 mm pitch (0.01969 in)
Repeating dimensions like 0.279 mm, 0.815 mm, 6.20 mm, 14.504 mm, 4.890 mm, etc.
Symmetry about the centerline and connector envelope keep-out notes
For -SD/-DS (screw-down) options, a different application drawing is referenced
Soldering guidance (per Samtec SMT process guidance): connectors typically must withstand up to 230 °C for 30–60 s, and may see up to 260 °C for 10 s (refer to Samtec processing docs)
Pin arrangement and numbering
QSH has two rows (A and B) at 0.50 mm pitch. QSH-030-D = 30 contacts per row → total 60 contacts.
The catalog page is largely graphical; explicit text for “Pin 1 locator” could not be extracted from the text layer. Conventionally, rows are labeled A/B, with numbering sequence shown in the figure on the page.
Mating connectors
Board mate: QTH (QTH/QSH system)
Cable mates: HQCD, HQDP
Cross-check: schematic symbol and footprint vs datasheet
Findings
Total contacts mismatch (critical):
Datasheet for QSH-030-D: 2 rows, 30 contacts per row → total contacts: 60.
Schematic symbol contains 64 terminals (components labeled as “Terminal” with designators 1..64; no nets yet).
Footprint contains 64 pads (Pads 1..64 in the PCB node tree).
Impact: This is a high-risk mismatch. If left uncorrected, it can cause net mapping errors, assembly issues, and functional failures. The part is advertised as “60 Way 2 Row,” so symbol and footprint should present exactly 60 signal pads (30 per row), with any additional mechanical features (e.g., pick & place pad, mechanical holes) implemented as non-electrical features, not numbered contacts.
Row labeling and numbering:
Datasheet: two rows (A/B) at 0.50 mm pitch; numbering figure is present.
Current symbol: appears to use generic untyped “Terminal” objects numbered sequentially; there’s no explicit A/B row labeling or a clear pin 1 indication in the symbol.
Risk: Ambiguity during schematic capture and layout correlation. Suggest adopting A/B row labels and confirming the correct numbering sequence/pin 1 location per the datasheet figure.
Pitch and land pattern:
Datasheet: pitch is 0.50 mm and provides detailed recommended PCB layout for QSH-XXX-01-X-D-XXX.
Current footprint: Pad count visible; specific pad sizes/spacing not displayed in the node index. Unable to verify actual pad pitch/geometry from available layout nodes alone.
Action needed: Confirm pad pitch (should be 0.50 mm) and land pattern dimensions match the recommended PCB layout for QSH-XXX-01-X-D-XXX.
Option -A (Pick & place pad):
Datasheet: “A” = pick & place pad (polyimide film).
Footprint: From the node listing alone, additional non-electrical features (pick & place pad zone) aren’t visible. If modeled, it should not be implemented as numbered signal pads. Ensure the pick & place pad is handled as a mechanical/assembly feature, not as an electrical pad.
Soldering and mechanical holes:
The catalog page references PTH features for certain variants/processes (paste-in-hole notes are present in the recommended layout text). For the -01 lead style single-ended variant (no screw-down), ensure any PTH or mechanical holes in the footprint exactly match the recommended layout for this specific option and are not misrepresented as electrical pads.
Summary of required corrections
Reduce the symbol to exactly 60 signal pins (30 per row) and align numbering with the datasheet’s A/B row scheme and pin 1 orientation.
Reduce the footprint to exactly 60 electrical pads for signals; represent any mechanical features (pick & place pad, optional holes) as non-electrical/mechanical where appropriate.
Verify pad pitch is exactly 0.50 mm and all pad and spacing dimensions match the “RECOMMENDED PCB LAYOUT FOR QSH-XXX-01-X-D-XXX.”
Add a clear pin 1 locator on the symbol and footprint silkscreen/assembly layers per the datasheet figure.
If you want, I can update the symbol and footprint to the correct 60-pin configuration and align the land pattern to the datasheet-recommended layout.
Wirelessly connects nets on schematic. Used to organize schematics and separate functional blocks. To wirelessly connect net portals, give them same designator. #portal
General Purpose Thick Film Standard Power
and High-Power Chip Resistor
47 kOhms ±5% 0.125W, 1/8W Chip Resistor 0805 (2012 Metric) Automotive AEC-Q200 Thick Film
Features:
- RMCF – standard power ratings
- RMCP – high power ratings
- Nickel barrier terminations standard
- Power derating from 100% at 70ºC to zero at +155ºC
- RoHS compliant, REACH compliant, and halogen free
- AEC-Q200 compliant