Thermal Image Sensor 32H x 24V TO-39

The MLX90640ESF-BAB-000-TU is a contactless infrared thermal imaging sensor manufactured by Melexis. It incorporates a microbolometer array that detects infrared radiation emitted by objects and converts the captured thermal energy into temperature data, enabling the creation of thermal images without physical contact.

The device is designed for compact and cost-effective thermal imaging applications, offering high thermal sensitivity and accurate temperature measurement capabilities. It integrates a digital signal-processing engine, calibration data memory, and a digital communication interface, allowing direct connection to microcontrollers, embedded systems, and industrial monitoring equipment.

The sensor provides real-time thermal mapping across its field of view and is suitable for applications involving human presence detection, predictive maintenance, industrial automation, smart building systems, medical screening, consumer electronics, robotics, and thermal monitoring solutions. Its factory calibration ensures stable performance throughout its operating life while minimizing external calibration requirements.

Manufacturer: Melexis

Manufacturer Part Number: MLX90640ESF-BAB-000-TU

Component Type: Infrared thermal imaging sensor

Sensor Technology: Microbolometer thermal sensor array

Measurement Method: Non-contact infrared temperature sensing

Output Type: Digital thermal image data

Communication Interface: I²C-compatible serial interface

Temperature Measurement Capability: Object temperature monitoring and thermal imaging

Thermal Imaging Function: Real-time thermal map generation

Integrated Processing: On-chip signal processing and calibration management

Calibration: Factory calibrated with stored calibration parameters

Power Supply Configuration: Single-supply operation

Power Consumption: Optimized for low-power embedded applications

Refresh Rate: Programmable thermal frame refresh operation

Thermal Sensitivity: High-sensitivity infrared detection

Field of View Variant: Wide-angle thermal imaging configuration

Accuracy Characteristics: High-precision temperature measurement with integrated compensation algorithms

Memory Features: Internal EEPROM for calibration coefficients

Operating Mode: Continuous and programmable thermal acquisition

Data Output Format: Digital temperature and thermal pixel information

Environmental Stability: Designed for reliable operation across varying ambient conditions

Electromagnetic Compatibility: Suitable for embedded and industrial electronic systems

Package Type: Surface-mount package with infrared-transparent window

Mounting Style: Surface mount technology

Package Construction: Reflow-solderable assembly

Lead Finish: Lead-free finish

Environmental Compliance: RoHS compliant and halogen-free

Reliability Features: Factory-tested and production-calibrated thermal imaging device

Thermal cameras

Human presence detection systems

Occupancy monitoring

Industrial predictive maintenance

Electrical equipment inspection

Smart building automation

HVAC monitoring systems

Medical screening devices

Consumer electronics

Robotics and autonomous systems

Fire detection and prevention systems

Industrial process monitoring

Energy management systems

Automotive thermal sensing applications

Security and surveillance equipment

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