Part Information Review and Datasheet Extraction

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Here’s a complete, tool-driven review of your part project, in order.
  1. Review of available part information
  1. Datasheet URL check and update
  • The Datasheet URL is already set on this part. No update required.
  1. Datasheet and series PDF extraction (metadata summary) Documents used:
Key mechanical and product attributes
  • Form factor: PCIe M.2 (NGFF) card edge connector
  • Pitch: 0.50 mm (series datasheet)
  • Positions / contacts: 75 positions (series) / 67 contacts (active) (series datasheet)
  • Orientation: Right angle (series)
  • Height: 4.2 mm (series table entries for 4.2 mm variants including Key M)
  • Keying: Key M (per MPN family and series tables)
  • Plating options (series): Au flash / 15 µin Au / 30 µin Au; your MPN indicates 30 µin Au
  • Materials (series): Contacts: copper alloy with gold plating; Housing: UL 94 V-0
Electrical characteristics
  • Current rating:
    • 0.75 A per power contact (continuous) (Gen 5 datasheet: Farnell PDF)
    • 0.5 A per power contact (continuous) (SSIO series PDF)
    • Note: two series sources list different continuous current ratings; use the stricter/official document for the exact MPN where available.
  • Voltage rating: 50 V AC per contact (both series PDFs)
  • Low-level contact resistance: 55 mΩ max initial; 20 mΩ max change (series)
  • Insulation resistance: > 5 × 10^8 Ω at 500 V DC (series)
  • Dielectric withstanding voltage: > 300 V AC (RMS) at sea level (series)
  • Operating temperature: -40 °C to +80 °C (series)
  • Compliance/features (series): Fully compliant with PCI-SIG PCIe M.2; supports angled insertion; multiple keying/height options; right angle and vertical options available in family.
Package dimensions and land pattern
  • The drawing (cmdt420x01501.pdf) contains the mechanical outline and recommended PCB land pattern for this exact MPN.
  • Automated text extraction from the drawing did not return numeric dimensions. Please refer to the drawing PDF directly for:
    • Pad sizes and spacing
    • Connector outline and seating plane
    • Mounting features/peg geometry and locations
    • Board edge-to-connector body relationships (if shown)
Pin descriptions
  • Connector manufacturers typically do not define interface signal names in the product drawing; pin functions are governed by the PCI-SIG M.2 specification for the M-key variant.
  • The series datasheets reviewed do not include a full pin function table. Use the M.2 (M-key) specification for functional pin mapping when assigning signals.
  1. Cross-check: schematic symbol and footprint vs. datasheet
Schematic symbol
  • Pin count: The symbol instantiates numbered terminals P1–P75, consistent with “75 positions” in the series documentation. Examples:
  • Mechanical pins: MP1 and MP2 are present in the symbol with Pin Numbers 76 and 77, respectively. Good.
  • Naming: Many terminals are generically named “SIGNAL_x”, “GND_x”, or “SIGNAL/GND_x”. This is acceptable for a generic connector, but for system clarity you may later want to rename nets per the M.2 M-key spec (not required for footprint correctness).
Footprint (PCB)
  • Pad inventory: The footprint contains a Pads container with entries corresponding to the symbol terminals and includes MP1 and MP2 mechanical pads. This aligns with the expected contact/peg set for a 75-position M.2 connector.
  • Pad pitch: Expected per datasheet is 0.50 mm. The current PCB data does not expose numeric pad-to-pad pitch here; verification against the drawing is recommended.
  • Land pattern dimensions: Not machine-extracted from the drawing; manual check against the drawing PDF is required to confirm pad sizes, solder mask/solder paste apertures, and exact pad-to-body relationships.
  • Keying/board keepouts: For host connectors, the module’s notch provides keying; the housing geometry is defined by the connector body. No contrary features are indicated in the layout snapshot; verify any keepout or mechanical outlines provided in the drawing.
Flags and recommendations
  • PASS: Pin/position count alignment with series spec (75 positions) and presence of mechanical pegs (MP1, MP2).
  • UNKNOWN: Pad pitch and all land pattern detailed dimensions were not text-extractable. Please cross-check the footprint against the drawing (cmdt420x01501.pdf) for:
    • 0.50 mm contact pitch
    • Individual pad sizes and gaps
    • Mounting peg pad/hole dimensions/locations (if applicable to this specific housing variant)
    • Recommended mask/paste apertures and any stated tolerances
  • NOTE: Electrical ratings show differing continuous current per contact between two series documents (0.75 A vs 0.5 A). Confirm which series rev applies to MDT420M01501 when finalizing current budgets.
  • OPTIONAL: Consider renaming connector pins/nets in the schematic to match M.2 M-key functional naming for easier system integration.
If you want, I can proceed to:
  • Extract exact land-pattern and outline dimensions by manually referencing the drawing PDF into structured notes, and
  • Annotate the footprint checks (pitch, pad sizes, peg geometry) item-by-item once those numbers are captured.
Run DRC/ERC checks
Verify pad pitch
Check part properties
Get M.2 pinout
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MDT420M01501

MDT420M01501 thumbnail
75 Position Female Connector M.2 (NGFF) Mini Card Gold 0.020" (0.50mm) Black #CommonPartsLibrary #Connector #Card Edge Connectors #Edgeboard-Connector #M.2

Properties

MDT420M01501

Amphenol Communications Solutions

Connectors

cdn.amphenol-cs.com/media/wysiwyg/files/drawing/cmdt420x01501.pdf

J

Standard

Card Edge Connectors

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