Parts Datasheet Verification

Thought for 3 mins 59 sec

Part review completed

The datasheet property was already set, so no web-found replacement URL needed to be written back.

1) Current part metadata review

Table

Field	Current value	Status
MPN	DW3210TR13	Present
Manufacturer	Qorvo	Present
Description	IC RF TxRx Only 802.15.4 IR-UWB 6.5 GHz, 8 GHz 40-WFQFN Exposed Pad	Present
Part type	Integrated Circuits	Present
Datasheet URL	https://www.qorvo.com/products/d/da008142	Present
Symbol pin count	40 terminals	Present
Footprint pad count	40 pads	Present
Package metadata field	Not explicitly set as a structured package property in the part metadata I could read	Incomplete
Pin electrical types	All terminals currently show Unspecified	Incomplete

2) Datasheet source used for scan

The existing Qorvo URL was set, but it did not return clean structured results consistently through file scanning. I therefore used a directly accessible datasheet PDF mirror of the same DW3000-family datasheet to complete the extraction:

Datasheet used for detailed extraction: https://www.mouser.com/catalog/specsheets/Qorvo_DW3000.pdf

3) Datasheet summary Core device metadata

Table

Item	Datasheet result
Family	DW3000 UWB Transceiver
Variant	DW3210
Package	QFN40
Package size	5 mm x 5 mm
Pin count	40 pads
Temperature grade	-40 °C to +85 °C
Channels	5 and 9
Center frequencies	6489.6 MHz and 7987.2 MHz
SPI	Up to 38 MHz
Data rates	850 kbps and 6.8 Mbps

Key features

Table

Feature	Datasheet result
UWB standard	IEEE 802.15.4-2015 and IEEE 802.15.4z (BPRF mode)
Location modes	2-way ranging, TDoA, PDoA
Security	Integrated HW AES 256
Power	Low power consumption
Packet length	Up to 1023 bytes
Package options in family	QFN40 (5 mm x 5 mm) and WLCSP52 (3.1 mm x 3.5 mm)

4) Absolute maximum ratings

Table

Parameter	Min	Max	Units
Supply voltage	-0.3	4.0	V
Receiver power		14	dBm
Storage temperature	-65	+150	°C
Operating temperature	-40	+85	°C
MSL for QFN packages	3	3	Level
ESD, HBM		2000	V

5) Recommended / nominal operating conditions

Table

Parameter	Min	Typ	Max	Units
Operating temperature	-40		85	°C
Supply voltage VDD1	1.62	3.0	3.6	V
Supply voltage VDD2a / VDD2b	2.4	3.0	3.6	V
Supply voltage VDD3	1.5	3.0	3.6	V
Voltage on GPIO0-5, WAKEUP, RSTn, SPICSn, SPIMOSI, SPICLK			3.6	V

6) Selected electrical characteristics

Table

Parameter	Value
Deep sleep current	260 nA
Sleep current	850 nA
Idle current, channel 5	18 mA
Idle current, channel 9	32 mA
Idle-RC current	8 mA
Oscillator startup current	1.5 mA
Single TX frame current, CH5	14 mA
Single TX frame current, CH9	17 mA
Single RX frame current, CH5	16 mA
Single RX frame current, CH9	19 mA
Peak RX current, CH5	72 mA
Peak RX current, CH9	88 mA
Peak TX current, CH5 VDD2	23 mA nominal, 29 mA max power
Peak TX current, CH9 VDD2	24 mA nominal, 29 mA max power
Peak TX current, CH5 VDD3	25 mA
Peak TX current, CH9 VDD3	35 mA
Receiver sensitivity example, CH5, 850 kbps	-100 dBm / 500 MHz
Receiver sensitivity example, CH5, 6.8 Mbps	-94.3 dBm / 500 MHz
Output power spectral density	-31 dBm/MHz
RF load impedance	50 Ω single-ended

7) Pin-function summary Power, RF, clock, and control pins

Table

Pin group	Datasheet summary
RF1	50 Ω single-ended RF connection, requires 2 pF on the pin
RF2	50 Ω single-ended RF connection; for non-PDoA variants it should be grounded with 50 Ω, and a 50 Ω PCB trace is required
XTI / XTO	Reference crystal input / output
VDD1	Main supply, 1.62 V to 3.6 V, also powers several digital I/Os
VDD2a / VDD2b	Supply, 2.4 V to 3.6 V
VDD3	Supply, 1.5 V to 3.6 V
VTX_D	TX supply decoupling, requires external capacitor to ground
VIO_D	I/O supply decoupling
WAKEUP	Active-high wake input; connect to ground if unused
RSTn	Active-low reset; must not be pulled high by external source
EXTON	External enable output for external power circuitry
IRQ	Interrupt output; recommended external 100 kΩ pull-down to avoid spurious interrupts in sleep/deepsleep

SPI and GPIO

Table

Pin group	Datasheet summary
SPICLK / SPICSn / SPICDI / SPICDO	SPI interface
GPIO0-8	GPIOs with alternate LED / control / sync functions
GPIO5 / GPIO6 at power-up	Define SPI polarity and SPI phase configuration on startup
LED note	GPIO pins are not suitable to drive LEDs directly

8) Package / mechanical information

Table

Item	Datasheet result
QFN package size	5 mm x 5 mm
QFN package type	QFN40
Reel size	330 mm (13 in)
Units per reel, QFN	4000
QFN MSL	3

9) Layout guidance from datasheet

Table

Topic	Datasheet guidance
Trace length	Keep all traces as short as possible
Grouping	Avoid mixing RF, power, and digital groups together
Decoupling	Place decoupling capacitors as close as possible to the corresponding pads
RF lines	RF1 and RF2 should be 50 Ω impedance-controlled
DC-blocking capacitors	The 2 pF capacitor pads should be embedded into the RF track width
Copper clearance	Keep clear of copper, tracks, and vias around the RF structures shown in the recommended layout

10) Symbol and footprint cross-check Good matches

Table

Check	Result	Risk
Symbol pin count vs datasheet	40 vs 40	Low
Footprint pad count vs datasheet	40 vs 40	Low
Pin numbering continuity	Appears consistent from 1 to 40	Low
Major pin naming	Appears aligned with datasheet naming	Low

Issues and flags

Table

Finding	Why it matters	Severity
Footprint asset name is `DW3220TR13-1.kicad_mod` while the part MPN is DW3210TR13	Even if the package is likely shared within the family, this creates a real risk of part-library confusion, wrong future substitutions, or incorrect trust in the footprint provenance	Medium
Project description says `40-WFQFN Exposed Pad`, but the footprint I inspected has only 40 perimeter pads and no obvious exposed center pad	If the actual DW3210 package truly requires an exposed pad, this would be a manufacturing and thermal/reliability issue. The datasheet excerpts I could access identify the device as QFN40 5 mm x 5 mm, but I did not get a machine-readable package drawing confirming a center pad one way or the other	High - needs manual verification against the package drawing
All symbol terminals are typed `Unspecified`	Not a fabrication failure by itself, but it weakens ERC usefulness and can hide integration mistakes in downstream designs	Low
No structured package property visible in part metadata	Increases ambiguity during reuse and review	Low
Existing datasheet URL is not ideal for direct automated extraction	Makes future automated review less reliable	Low

11) Bottom line

Table

Area	Verdict
Basic symbol-to-datasheet pin mapping	Looks broadly correct
Basic footprint pad count / package family alignment	Looks broadly correct
Most important risk	Potential mismatch around exposed-pad status
Second important risk	Footprint file name references DW3220, not DW3210

12) Recommended fixes

Table

Priority	Action
1	Verify the package drawing page for the DW3210 QFN40 and confirm whether there is an exposed center pad
2	If no exposed pad exists, update the part description to remove Exposed Pad
3	Rename or replace the footprint asset so its identity matches DW3210TR13 cleanly
4	Add proper pin electrical types for better rule checking
5	Replace the current datasheet property with a direct PDF URL if you want future automated scans to be more reliable

If you want, I can next turn this into a concise pass/fail checklist for publishing the part.

Create publish checklist

Check exposed pad

Fix datasheet URL

Review pin types

Reviews

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