Parts Datasheet Verification

flux

Part review completed
The datasheet property was already set, so no web-found replacement URL needed to be written back.
1) Current part metadata review

Table

FieldCurrent valueStatus
MPNDW3210TR13Present
ManufacturerQorvoPresent
DescriptionIC RF TxRx Only 802.15.4 IR-UWB 6.5 GHz, 8 GHz 40-WFQFN Exposed PadPresent
Part typeIntegrated CircuitsPresent
Datasheet URLhttps://www.qorvo.com/products/d/da008142Present
Symbol pin count40 terminalsPresent
Footprint pad count40 padsPresent
Package metadata fieldNot explicitly set as a structured package property in the part metadata I could readIncomplete
Pin electrical typesAll terminals currently show UnspecifiedIncomplete
2) Datasheet source used for scan
The existing Qorvo URL was set, but it did not return clean structured results consistently through file scanning. I therefore used a directly accessible datasheet PDF mirror of the same DW3000-family datasheet to complete the extraction:
  • Datasheet used for detailed extraction: https://www.mouser.com/catalog/specsheets/Qorvo_DW3000.pdf
3) Datasheet summary Core device metadata

Table

ItemDatasheet result
FamilyDW3000 UWB Transceiver
VariantDW3210
PackageQFN40
Package size5 mm x 5 mm
Pin count40 pads
Temperature grade-40 °C to +85 °C
Channels5 and 9
Center frequencies6489.6 MHz and 7987.2 MHz
SPIUp to 38 MHz
Data rates850 kbps and 6.8 Mbps
Key features

Table

FeatureDatasheet result
UWB standardIEEE 802.15.4-2015 and IEEE 802.15.4z (BPRF mode)
Location modes2-way ranging, TDoA, PDoA
SecurityIntegrated HW AES 256
PowerLow power consumption
Packet lengthUp to 1023 bytes
Package options in familyQFN40 (5 mm x 5 mm) and WLCSP52 (3.1 mm x 3.5 mm)
4) Absolute maximum ratings

Table

ParameterMinMaxUnits
Supply voltage-0.34.0V
Receiver power14dBm
Storage temperature-65+150°C
Operating temperature-40+85°C
MSL for QFN packages33Level
ESD, HBM2000V
5) Recommended / nominal operating conditions

Table

ParameterMinTypMaxUnits
Operating temperature-4085°C
Supply voltage VDD11.623.03.6V
Supply voltage VDD2a / VDD2b2.43.03.6V
Supply voltage VDD31.53.03.6V
Voltage on GPIO0-5, WAKEUP, RSTn, SPICSn, SPIMOSI, SPICLK3.6V
6) Selected electrical characteristics

Table

ParameterValue
Deep sleep current260 nA
Sleep current850 nA
Idle current, channel 518 mA
Idle current, channel 932 mA
Idle-RC current8 mA
Oscillator startup current1.5 mA
Single TX frame current, CH514 mA
Single TX frame current, CH917 mA
Single RX frame current, CH516 mA
Single RX frame current, CH919 mA
Peak RX current, CH572 mA
Peak RX current, CH988 mA
Peak TX current, CH5 VDD223 mA nominal, 29 mA max power
Peak TX current, CH9 VDD224 mA nominal, 29 mA max power
Peak TX current, CH5 VDD325 mA
Peak TX current, CH9 VDD335 mA
Receiver sensitivity example, CH5, 850 kbps-100 dBm / 500 MHz
Receiver sensitivity example, CH5, 6.8 Mbps-94.3 dBm / 500 MHz
Output power spectral density-31 dBm/MHz
RF load impedance50 Ω single-ended
7) Pin-function summary Power, RF, clock, and control pins

Table

Pin groupDatasheet summary
RF150 Ω single-ended RF connection, requires 2 pF on the pin
RF250 Ω single-ended RF connection; for non-PDoA variants it should be grounded with 50 Ω, and a 50 Ω PCB trace is required
XTI / XTOReference crystal input / output
VDD1Main supply, 1.62 V to 3.6 V, also powers several digital I/Os
VDD2a / VDD2bSupply, 2.4 V to 3.6 V
VDD3Supply, 1.5 V to 3.6 V
VTX_DTX supply decoupling, requires external capacitor to ground
VIO_DI/O supply decoupling
WAKEUPActive-high wake input; connect to ground if unused
RSTnActive-low reset; must not be pulled high by external source
EXTONExternal enable output for external power circuitry
IRQInterrupt output; recommended external 100 kΩ pull-down to avoid spurious interrupts in sleep/deepsleep
SPI and GPIO

Table

Pin groupDatasheet summary
SPICLK / SPICSn / SPICDI / SPICDOSPI interface
GPIO0-8GPIOs with alternate LED / control / sync functions
GPIO5 / GPIO6 at power-upDefine SPI polarity and SPI phase configuration on startup
LED noteGPIO pins are not suitable to drive LEDs directly
8) Package / mechanical information

Table

ItemDatasheet result
QFN package size5 mm x 5 mm
QFN package typeQFN40
Reel size330 mm (13 in)
Units per reel, QFN4000
QFN MSL3
9) Layout guidance from datasheet

Table

TopicDatasheet guidance
Trace lengthKeep all traces as short as possible
GroupingAvoid mixing RF, power, and digital groups together
DecouplingPlace decoupling capacitors as close as possible to the corresponding pads
RF linesRF1 and RF2 should be 50 Ω impedance-controlled
DC-blocking capacitorsThe 2 pF capacitor pads should be embedded into the RF track width
Copper clearanceKeep clear of copper, tracks, and vias around the RF structures shown in the recommended layout
10) Symbol and footprint cross-check Good matches

Table

CheckResultRisk
Symbol pin count vs datasheet40 vs 40Low
Footprint pad count vs datasheet40 vs 40Low
Pin numbering continuityAppears consistent from 1 to 40Low
Major pin namingAppears aligned with datasheet namingLow
Issues and flags

Table

FindingWhy it mattersSeverity
Footprint asset name is DW3220TR13-1.kicad_mod while the part MPN is DW3210TR13Even if the package is likely shared within the family, this creates a real risk of part-library confusion, wrong future substitutions, or incorrect trust in the footprint provenanceMedium
Project description says 40-WFQFN Exposed Pad, but the footprint I inspected has only 40 perimeter pads and no obvious exposed center padIf the actual DW3210 package truly requires an exposed pad, this would be a manufacturing and thermal/reliability issue. The datasheet excerpts I could access identify the device as QFN40 5 mm x 5 mm, but I did not get a machine-readable package drawing confirming a center pad one way or the otherHigh - needs manual verification against the package drawing
All symbol terminals are typed UnspecifiedNot a fabrication failure by itself, but it weakens ERC usefulness and can hide integration mistakes in downstream designsLow
No structured package property visible in part metadataIncreases ambiguity during reuse and reviewLow
Existing datasheet URL is not ideal for direct automated extractionMakes future automated review less reliableLow
11) Bottom line

Table

AreaVerdict
Basic symbol-to-datasheet pin mappingLooks broadly correct
Basic footprint pad count / package family alignmentLooks broadly correct
Most important riskPotential mismatch around exposed-pad status
Second important riskFootprint file name references DW3220, not DW3210
12) Recommended fixes

Table

PriorityAction
1Verify the package drawing page for the DW3210 QFN40 and confirm whether there is an exposed center pad
2If no exposed pad exists, update the part description to remove Exposed Pad
3Rename or replace the footprint asset so its identity matches DW3210TR13 cleanly
4Add proper pin electrical types for better rule checking
5Replace the current datasheet property with a direct PDF URL if you want future automated scans to be more reliable
If you want, I can next turn this into a concise pass/fail checklist for publishing the part.
Create publish checklist
Check exposed pad
Fix datasheet URL
Review pin types

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    Assets

    stp

    DW3210TR13

    DW3210TR13.stp3D Model
    DW3210TR13-thumb.png

    DW3210TR13-thumb.png

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    DW3210TR13

    DW3210TR13

    DW3210TR13 Symbol.svgDefault
    kicad_mod

    DW3210TR13

    DW3220TR13-1.kicad_modFootprint

    DW3210TR13

    DW3210TR13 thumbnail
    IC RF TxRx Only 802.15.4 IR-UWB 6.5GHz, 8GHz 40-WFQFN Exposed Pad #CommonPartsLibrary #IntegratedCircuit #RF-Transceiver

    Properties

    DW3210TR13

    Qorvo

    Integrated Circuits

    qorvo.com/products/d/da008142

    IC

    creativecommons.org/licenses/by/4.0/

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