Part Project Execution Steps

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5:38

Project
BOM
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PCB Layout
Schematic

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Using PCB Layout Tool.

Using BOM Tool.

Looking for "Features list" in avagotechnologies_ADNS-3050-1217285.pdf

Looking for "Pin description table" in avagotechnologies_ADNS-3050-1217285.pdf

Looking for "Pinout diagram or pin configuration" in avagotechnologies_ADNS-3050-1217285.pdf

Looking for "Package dimensions mechanical outline" in avagotechnologies_ADNS-3050-1217285.pdf

Looking for "Absolute Maximum Ratings" in avagotechnologies_ADNS-3050-1217285.pdf

Looking for "Recommended Operating Conditions" in avagotechnologies_ADNS-3050-1217285.pdf

Looking for "Electrical Characteristics table" in avagotechnologies_ADNS-3050-1217285.pdf

Looking for "Supply voltage VDD and VIO levels" in avagotechnologies_ADNS-3050-1217285.pdf

Looking for "Current consumption or supply current" in avagotechnologies_ADNS-3050-1217285.pdf

Looking for "Resolution counts per inch (CPI or DPI)" in avagotechnologies_ADNS-3050-1217285.pdf

Looking for "Maximum speed (inches per second) and acceleration (g)" in avagotechnologies_ADNS-3050-1217285.pdf

Looking for "Frame rate or image acquisition rate" in avagotechnologies_ADNS-3050-1217285.pdf

Looking for "Image array size or pixel resolution" in avagotechnologies_ADNS-3050-1217285.pdf

Looking for "Serial interface type and timing (SPI)" in avagotechnologies_ADNS-3050-1217285.pdf

Looking for "LED illumination or wavelength and drive" in avagotechnologies_ADNS-3050-1217285.pdf

Looking for "Operating temperature range" in avagotechnologies_ADNS-3050-1217285.pdf

Looking for "Package outline dimensions numeric values mm for 8-pin DIP package of ADNS-3050" in avagotechnologies_ADNS-3050-1217285.pdf

Looking for "Recommended PCB mechanical cutouts dimensions and spacing numeric values" in avagotechnologies_ADNS-3050-1217285.pdf

Looking for "Pin pitch and row spacing for 8-pin DIP package" in avagotechnologies_ADNS-3050-1217285.pdf

Using PCB Layout Tool.

Here’s a complete execution of your 4 requested steps for the ADNS-3050 part project.
  1. Review of currently available part information
  • MPN: ADNS-3050
  • Manufacturer: Avago Technologies
  • Part type: Sensors
  • Designator prefix: IC
  • Datasheet: PDF
  • Schematic symbol status:
    • Present as discrete terminals named MISO, LED, MOTION, NCS, SCLK, GND, VDD, MOSI
    • Pin numbers assigned: 1..8 in order (MISO=1 … MOSI=8)
    • Pin electrical types: currently Unspecified on all terminals
  • Footprint status:
  1. Datasheet presence check
  • A datasheet URL is already set: PDF
  • No changes required.
  1. Datasheet scan — extracted and summarized metadata Features
  • Small Form Factor Package - 8-pin DIP
  • Operating voltage: 2.8 V to 3.0 V
  • High-speed motion: 60 ips (typ), acceleration up to 20 g
  • Selectable resolutions up to 2000 cpi
  • Four-wire SPI serial interface
  • External MOTION interrupt (active low)
  • Internal oscillator (no external clock)
  • On-chip LED driver with configurable modes and drive current
  • Programmable power-saving/rest modes
  • Supports LED auto-current control; recommended red LED HLMP-EG3E; not designed for blue LED
Pin descriptions (exact from datasheet)

Table

PinNameTypeDescription
1MISOOutputSerial Data Output (Master In/Slave Out)
2LEDInputLED Illumination Control Input
3MOTIONOutputMotion Interrupt Output (Active low)
4NCSInputChip Select (Active low)
5SCLKInputSerial Clock Input
6GNDGroundGround
7VDDPowerSupply Voltage
8MOSIInputSerial Data Input (Master Out/Slave In)
Absolute Maximum Ratings

Table

ParameterSymbolMinMaxUnitsNotes
Storage TemperatureTS-4085°C
Operating TemperatureTA-1555°C
Lead Solder TemperatureTSOLDER260°C7 s, 1.6 mm below seating plane
Supply VoltageVDD-0.53.7V
ESD (HBM)2kVAll pins
Input VoltageVIN-0.5VDD + 0.5VAll I/O pins
Output CurrentIout7mAMISO pin
Recommended Operating Conditions

Table

ParameterSymbolMinTypMaxUnitsNotes
Operating TemperatureTA040°C
Power Supply VoltageVDD2.83.0V
Power Supply Rise TimetRT0.005100ms0 to VDD min
Supply Noise (Sinusoidal)VNA100mVp-p10 kHz–50 MHz
Serial Port Clock FrequencyfSCLK1MHz50% duty
Distance Lens-to-SurfaceZ2.32.42.5mm
SpeedS60ips
AccelerationA20gIn run mode
Load Capacitance (MISO)Cout100pF
DC Electrical Specifications

Table

ParameterSymbolMinTypMaxUnitsNotes
DC Supply Current (Run, DC)IDD_RUN_DC26.604mAIncludes LED current; no load on MISO
DC Supply Current (Run, Wireless)IDD_RUN_WIRELESS14.236mAIncludes LED current
Rest1 CurrentIDD_REST10.817mADefault rest settings
Rest2 CurrentIDD_REST20.105mADefault rest settings
Rest3 CurrentIDD_REST30.022mADefault rest settings
Power Down CurrentIPD10µA
Input Low VoltageVIL0.5VSCLK, MOSI, NCS
Input High VoltageVIHVDD-0.5VSCLK, MOSI, NCS
Input HysteresisVI_HYS200mVSCLK, MOSI, NCS
Input Leakage CurrentIleak±1±10µAVin = VDD-0.6 V
Output Low VoltageVOL0.7VIout = 1 mA (MISO, MOTION)
Output High VoltageVOHVDD-0.7VIout = -1 mA (MISO, MOTION)
Input CapacitanceCin50pFMOSI, NCS, SCLK
AC / SPI Timing (selected)

Table

ParameterSymbolMinTypMaxUnitsNotes
MISO Rise Timetr-MISO40200nsCL = 100 pF
MISO Fall Timetf-MISO40200nsCL = 100 pF
MISO Delay after SCLKtDLY-MISO120nsSCLK falling to MISO valid
MISO Hold Timethold-MISO5001/fSCLKns
MOSI Hold Timethold-MOSI200ns
MOSI Setup Timetsetup-MOSI120ns
Time between write cmdstSWW30µs
Time between write/readtSWR20µs
Read addr-data delaytSRAD4µs
NCS to SCLK activetNCS-SCLK120ns
SCLK to NCS inactive (read)tSCLK-NCS120ns
SCLK to NCS inactive (write)tSCLK-NCS20µs
NCS to MISO high-ZtNCS-MISO250ns
Resolution control
  • Selectable up to 2000 cpi (multiple control paths via RES fields; default 1000 dpi)
Frame rate
  • Max frame rate about 6666 fps at 26 MHz when frame idle = 0
Image array
  • 19 × 19 pixel array (361 reads to capture a full frame)
LED and illumination
  • LED control via LED_CTRL (0x40) and AUTO_LED_CONTROL (0x43) with discrete current levels and auto/current switching behavior
  • Recommended LED: HLMP‑EG3E (red); “not designed for use with blue LED”
  • Example electrical spec conditions reference VDDLED = 2.8 V and RLED = 33 Ω
Package and mechanical
  • Package: 8-pin staggered DIP
  • Datasheet includes “Figure 3: Recommended PCB Mechanical Cutouts and Spacing” required for proper lens and optical path alignment (dimensions shown graphically in the PDF; numeric values are not tabulated in the version accessed)
  • Lens/clip system referenced (e.g., ADNS‑5110‑001 lens, ADNS‑5200 clip)
  1. Cross-check: symbol and footprint vs datasheet Schematic symbol checks
  • Pin count: 8 — matches datasheet.
  • Pin names and numbers: Matches exactly (1:MISO, 2:LED, 3:MOTION, 4:NCS, 5:SCLK, 6:GND, 7:VDD, 8:MOSI).
  • Pin electrical types: All current terminals are “Unspecified.” Based on the datasheet:
    • Set MISO = Output
    • Set LED = Input
    • Set MOTION = Output (active low)
    • Set NCS = Input
    • Set SCLK = Input
    • Set GND = Ground
    • Set VDD = Power In
    • Set MOSI = Input
  • Signal directionality and logic levels:
    • Outputs (MISO, MOTION) have VOH = VDD−0.7 V and VOL = 0.7 V at ±1 mA. Ensure the host logic thresholds are compatible at your chosen VDD.
Footprint checks
  • Present footprint: df3f2e1e-4727-4f32-990a-225f579bf849.defaultFootprint is a through-hole, 8-pad staggered DIP pattern. This is consistent with the datasheet’s “8‑pin DIP” package.
  • Pad mapping: The package asset defines pads 1–8; ensure symbol pin-to-pad mapping follows the datasheet numbering (Pin 1 indicator is present in silk/arc near the top; verify board orientation so Pin 1= MISO).
  • Mechanical cutouts/alignment: The datasheet provides a “Recommended PCB Mechanical Cutouts and Spacing” figure required for the optical path and lens/clip seating. The current footprint definition does not include any board cutouts/slots/alignment holes on Edge.Cuts or mechanical layers.
    • Action needed: Add the recommended optical aperture and mechanical keep-outs/cutouts per the datasheet figure for the selected lens/clip (e.g., ADNS‑5110‑001 + ADNS‑5200).
  • Numerical mechanical dimensions: The accessed PDF shows figures but does not tabulate key values (e.g., pin pitch, body outline, hole locations) in text tables. Before committing to manufacturing, verify pin pitch, row spacing, and hole sizes against a full mechanical drawing from the manufacturer or the lens reference design to confirm pad drills (currently 0.8 mm) and spacing.
Sourcing and ordering risk
  • The project’s symbol/footprint align broadly with an 8‑pin DIP ADNS‑3050. The main manufacturing risk is omission of the required PCB optical cutouts and lens alignment geometry. Without them, the sensor will not track correctly.
If you want, I can:
  • Update the symbol pin electrical types as listed.
  • Add notes/properties referencing the key electrical limits.
  • Create or import a footprint variant that includes the recommended mechanical cutouts aligned to the lens/clip you plan to use.
Reference part link for convenience: ADNS-3050
Run DRC/ERC review
Check footprint pad mapping
Find lens/clip parts
Extract mechanical cutout dims
26 days

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ADNS-3050

ADNS-3050 thumbnail
Optical Sensor 8-DIP Module #CommonPartsLibrary #Sensor #Transducer #Optical-Sensor #Ambient-Light #IR #UV #Sensor

Properties

ADNS-3050

Avago Technologies

Sensors

mouser.co.uk/datasheet/2/678/avagotechnologies_ADNS-3050-1217285.pdf

IC

creativecommons.org/licenses/by/4.0/

Pricing & Availability

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Assets

ADNS-3050

ADNS-3050

ADNS-3050 Symbol.svgDefault
ADNS-3050-thumb.png

ADNS-3050-thumb.png

ADNS-3050-thumbThumbnail
kicad_mod

ADNS-3050

ADNS3050.kicad_modFootprint

Controls