Part Audit and Datasheet Update

adrian95

adrian95

Review all available part information (MPN, package, pin count, description, properties). If no datasheet URL is already set, search the web for the official datasheet and update the part's Datasheet property with the URL. Then cross-check the schematic symbol, footprint, and pin descriptions against the datasheet. Summarize key specs and flag any mismatches.

flux

I’ll audit the part metadata, schematic symbol/pins, and footprint against the official datasheet; if the datasheet property is missing, I’ll find the official URL and update it, then save the detailed findings in a project file.

flux

Completed the part audit for 91911-31311LF. I updated the missing Datasheet URL to the official Amphenol CS PDF, populated missing Manufacturer Name and Part Type metadata, cross-checked the 11-pin passive symbol and footprint geometry, and saved the detailed findings in Part Audit: 91911-31311LF.
Key result: the 11 signal pins and 1.00 mm two-row SMT footprint match the available part data; the only caveat is that SH1/SH2 hold-down pads are footprint-only, which is acceptable unless you want them electrically tied to ground/chassis. The final review is clean with no open errors or warnings.
Ground shield pads
Run ERC/DRC
Document shield pads
Check BOM entry
Sign up to send
8
Pin Number
8
1
Pin Number
1
4
Pin Number
4
7
Pin Number
7
11
Pin Number
11
2
Pin Number
2
10
Pin Number
10
9
Pin Number
9
6
Pin Number
6
3
Pin Number
3
5
Pin Number
5

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Learn to Add a Component

91911-31311LF

91911-31311LF thumbnail
11 Position Connector Header, Center Strip Contacts Surface Mount Gold or Gold, GXT™ The 91911-31311LF is a 1.00 mm pitch board-to-board mezzanine connector from the Conan™ / MezzSelect™ series by Amphenol ICC. It is designed for compact, high-density PCB stacking applications commonly used in industrial, embedded, networking, and portable electronic systems.
Key Features 11-position vertical header 1.00 mm pitch compact board-to-board connector Surface-mount (SMT) mounting 5 mm mated stacking height Gold/GXT™ contact plating for reliable signal integrity and durability Board guide and solder retention features for easier assembly and improved mechanical stability Supports high-density PCB layouts Designed for industrial and embedded applications RoHS and REACH compliant Housing material: LCP (Liquid Crystal Polymer) Rated up to 1 A current and 500 V voltage Typical Applications Embedded computing modules Industrial control systems Networking equipment Portable electronics Compact PCB stacking designs

Properties

91911-31311LF

Amphenol Communications Solutions

Connector

cdn.amphenol-cs.com/media/wysiwyg/files/drawing/91900.pdf

J

creativecommons.org/licenses/by/4.0/

parametric-v1

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