adrian95 / 203456-0003

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Part Data Review and Updates

flux

2:17

Planning project updates.

Reviewing the bill of materials.

Analyzing the schematic.

Looking for "Manufacturer part number, manufacturer name, product description, package/mechanical style, plating, circuit count, row count, differential pair count, connector height, mounting style, current rating, voltage rating, temperature range, insulation resistance, dielectric withstanding voltage, contact resistance, durability, and any key specifications from the first pages/specification tables." in 2034560003_sd.pdf

Looking for "Complete pin / signal assignment information for the 699-circuit Mirror Mezz connector, including whether the datasheet provides a pin map, contact naming convention, row naming, and any notes needed to verify symbol pin descriptions." in 2034560003_sd.pdf

Looking for "Mechanical package details and footprint-related information: recommended land pattern, BGA attach details, dimensions, pitch, rows, columns, and any package or PCB layout notes needed to verify the footprint." in 2034560003_sd.pdf

Cross-checking design elements.

Searching the project.

Analyzing the PCB layout.

Searching for terminal components.

Searching 3 domains.

Searching 2 domains.

Searching 3 domains.

Evaluating missing pin descriptions.

Assessing pin numbers and descriptions.

Search complete — 926 results across 3 domains.

Clarifying mismatches and designators.

Review Summary
I reviewed the current part metadata, the official Molex datasheet, the symbol terminals, and the footprint/layout representation.
Datasheet property
  • No web search was needed
  • The project already has Datasheet URL set to the official Molex PDF:
    • https://www.molex.com/pdm_docs/sd/2034560003_sd.pdf
Part information check

Current project metadata vs datasheet


FieldIn projectIn datasheetStatus
Manufacturer Part Number203456-00032034560003OK, same part with hyphen formatting difference
Manufacturer NameMolexMolex Electronic Technologies, LLCOK, project value is abbreviated but acceptable
Part TypeConnectorsMirror Mezz board-to-board / mezzanine connectorMostly OK, could be more specific
Package or Case CodeBGABGA-style solder ball attach, Mirror Mezz 7P x 11RToo generic
Designator PrefixJConnectorOK
DescriptionMirror Mezz Hermaphroditic Connector, 5.50 mm Connector Height, BGA-Attach Mounting, 7 Pair, 11 Row, 699 Circuits, 0.76 µm Gold PlatingMirror Mezz, 5.5 mm height, 7P x 11R, 699 circuitsMostly OK, but "7 Pair" is not the same as datasheet's 7P x 11R
Key specs from datasheet

Core specifications


ParameterDatasheet value
Product familyMirror Mezz
MPN2034560003
Height5.50 mm
Row scheme7P x 11R
Total circuits699
Differential pairs77
Contact plating30 µin gold on contact area
Nickel plating50 µin min overall
MountingSolder ball / surface mount PCB attach
Operating temperature-55°C to +105°C
Voltage rating< 30 V AC RMS / VDC
Current rating0.75 A/pin on 1 oz Cu, 1.2 A/pin on 2 oz Cu
Contact resistance30 mΩ max initial
Insulation resistance1000 MΩ min
Dielectric withstand500 VAC RMS for 1 minute
Durability100 cycles
Symbol audit

What matches


CheckResult
Terminal count699 terminals present
Pin-number populationThe sampled terminals all have Pin Number populated
Pin naming styleUses alphanumeric grid IDs like A11, F65, J34, which matches the datasheet convention
Ground-style labelsGND_xx labels still map to coordinate-based Pin Number values, which is acceptable if intentional

Problems flagged


IssueResult
Pin Type coverageAll sampled terminals are still Pin Type = Unspecified
Pin Description coverageI did not find populated per-pin descriptions in the visible terminal properties
Semantic pin descriptionsThe datasheet does not provide unique functional names for every contact; it mainly provides coordinate IDs and mirroring, so full semantic pin descriptions cannot be derived directly from this datasheet alone
Symbol naming consistencySome designators are coordinate IDs, while others are GND_xx; that is a mixed labeling style
Interpretation
  • The symbol appears structurally complete because the 699-pin count matches the datasheet.
  • The pin identifier scheme is aligned with the datasheet's row/column naming.
  • The main symbol-quality issue is metadata completeness, not missing pins:
    • Pin Type is not classified
    • Pin Description appears missing
    • labeling style is inconsistent between coordinate pins and GND_xx pins
Footprint audit

What matches


CheckResult
Footprint asset existsYes, a KiCad footprint asset is present
Layout pad count699 pads
Connector styleBGA/solder-ball style representation is consistent with datasheet
Datasheet pad-field expectationDatasheet calls for 699X pads / mask apertures

Datasheet footprint details to verify against the asset


Datasheet itemValue
Recommended pad diameter0.50 ± 0.05 mm
Solder mask aperture0.60 ± 0.05 mm
Pad styleNon-solder-mask-defined
Orientation anchorPin A3 explicitly identified
Array conventionRows A, B, C, D, E, F, G, H, J, K, L
Limitation
I could confirm:
  • a footprint exists,
  • the PCB representation has 699 pads,
  • and that this is directionally consistent with the datasheet.
I could not fully numerically verify pad diameters, pitch, and exact row/column geometry from the available project-tool output alone, because the current layout response does not expose the per-pad dimensions/coordinates in a usable way.
Mismatches and concerns

Confirmed / likely mismatches


AreaFindingSeverity
Package fieldBGA is too generic for this partMedium
Description text7 Pair does not match datasheet 7P x 11R wordingMedium
Terminal metadataPin Type left as UnspecifiedMedium
Pin descriptionsMissing or not visible on terminalsMedium
Labeling consistencyMix of coordinate labels and GND_xx labelsLow to Medium

Not flagged as mismatches


AreaFinding
MPNHyphenated vs non-hyphenated form appears acceptable
ManufacturerMolex is acceptable shorthand
Pin countMatches datasheet
Footprint existencePresent
Pad countMatches datasheet
Recommended fixes

Metadata


FieldRecommended value
Package or Case CodeMirror Mezz 7P x 11R, 699-circuit, solder-ball attach
Part TypeBoard-to-board mezzanine connector or Connector
DescriptionMirror Mezz board-to-board mezzanine connector, 5.5 mm height, 699 circuits, 7P x 11R, solder-ball attach

Symbol data


ImprovementRecommendation
Pin TypeClassify pins at least into Ground vs Unspecified/Passive where justified
Pin DescriptionAdd short descriptions if you have a pin-role source beyond this drawing
Label styleDecide whether all visible labels should be coordinate-based, or whether ground contacts should intentionally stay grouped as GND_xx
Bottom line
  • Datasheet URL: already correct, so no update was needed.
  • Part metadata: mostly right, but package and description wording should be tightened.
  • Symbol: pin count and coordinate naming look structurally correct, but terminal metadata is incomplete.
  • Footprint: 699-pad footprint is present and consistent at a high level, but I could not fully prove pad geometry against the drawing from the available layout output.
If you want, I can now fix the project metadata and terminal properties for this part.
Fix all mismatches
Check missing footprints
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203456-0003

203456-0003 thumbnail
Mirror Mezz Hermaphroditic Connector, 5.50mm Connector Height, BGA-Attach Mounting, 7 Pair, 11 Row, 699 Circuits, 0.76m Gold (Au) Plating The 203456-0003 is a board-to-board mezzanine connector manufactured by Molex. It belongs to a family of high-density, fine-pitch connectors designed to provide reliable electrical and mechanical connections between stacked PCBs.
This connector is typically used in compact electronic designs where space-saving and high pin-count interconnections are required, such as consumer electronics, embedded systems, industrial equipment, and communication devices.
It is engineered to support stable signal transmission, including high-speed signals, while maintaining a low-profile form factor suitable for modern, miniaturized designs. Key Characteristics (General) Connector Type: Board-to-board (mezzanine) Mounting Style: Surface-mount (SMT) High pin density for compact PCB layouts Low profile height (ideal for slim devices) Designed for reliable mating cycles Supports signal integrity for high-speed applications Typical Applications Embedded modules and carrier boards Consumer electronics (tablets, handheld devices) Industrial control systems Communication and networking equipment #CommonPartsLibrary #Connector #Mirror Mezz 203456

Properties

2034560003

Molex

Connectors

molex.com/pdm_docs/sd/2034560003_sd.pdf

J

BGA

creativecommons.org/licenses/by/4.0/

parametric-v1

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