Schematic: ERC and schematic-legibility checks report no open errors or warnings. The isolated-side supply shared by U4/U5/U6/U8 was treated as intentional external power.
Layout: DRC reports no open errors or warnings; all 76 footprints are assigned, and there are 0 airwires and 0 dangling traces. The board is configured as an 80 × 62 mm, 4-layer stackup.
Caveat: The placement summary’s aggregate component envelope is 78.2 × 67.9 mm—taller than the nominal board height—while the outside-board DRC remains clean. Verify the ESP module/connector mechanical envelope against the actual outline visually before fabrication.
Open items
Confirm edge clearances and mating access for the large connectors and ESP module in the layout editor.
Review the numerous intentional PCB override notices; they are informational, not DRC failures.
Suggested next steps
Run a fabrication-oriented DFM/export check.
Review silkscreen readability around connectors.
Produce Gerbers, drill, BOM, and pick-and-place files.