SIM MFF2 Verification

Thought for 19 sec

Not safe as a generic MFF2 footprint because the eight PCB lands copy the package terminals rather than the larger ETSI Annex A PCB lands, reducing solder-joint tolerance. Also, ETSI does not specify the exposed center feature as GND; that requires device-specific evidence.

Measured geometry: Body: 5.9944 × 5.0038 mm. Pads 1–8: 0.6096 × 0.4064 mm, centers X = ±2.545202 mm; Y = ±1.905 and ±0.635 mm; 1.27 mm pitch. EPAD: 3.6068 × 3.7084 mm at (0,0).

ETSI Annex A lands are 0.96 × 0.50 mm at X = ±2.675 mm. Terminal 9 (“EPAD”) is electrically mapped to the center pad.

For the user’s explicitly specified footprint requiring center EPAD = GND, tying terminal 9 to GND is acceptable only if the exact eUICC vendor confirms EPAD is GND. Otherwise, it is not safe.

trolik

flux

Only give the missing final numeric values in one line, no explanation: ETSI Annex A land center X and Y coordinates for pads 1-8, recommended land size, central anchor/EPAD copper size if specified.

Thought for 7 sec

flux

Pads 1–8 centers: X = ±2.675 mm, Y = +1.905, +0.635, −0.635, −1.905 mm; land size = 0.96 × 0.50 mm; central anchors = 1.50 × 0.35 mm and 1.50 × 0.70 mm pairs (3.40 mm overall span), no single EPAD copper size specified.

Fix footprint and verify

Apply Annex A lands

Keep EPAD grounded

Run DRC check

Create verification note

EPAD

CLK

VCC

I/O

RST

GND

Reviews

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Project Name

Description

SIM-ST-MFF2_HOL EUICC MFF2 SIM WITH GLOBAL SIM P

Properties

Properties describe core aspects of the project.

Pricing & Availability

Distributor	Qty 1

Controls

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