SIM MFF2 Verification
Thought for 19 sec
Not safe as a generic MFF2 footprint because the eight PCB lands copy the package terminals rather than the larger ETSI Annex A PCB lands, reducing solder-joint tolerance. Also, ETSI does not specify the exposed center feature as GND; that requires device-specific evidence.
Measured geometry:
Body: 5.9944 × 5.0038 mm.
Pads 1–8: 0.6096 × 0.4064 mm, centers X = ±2.545202 mm; Y = ±1.905 and ±0.635 mm; 1.27 mm pitch.
EPAD: 3.6068 × 3.7084 mm at (0,0).
ETSI Annex A lands are 0.96 × 0.50 mm at X = ±2.675 mm. Terminal 9 (“EPAD”) is electrically mapped to the center pad.
For the user’s explicitly specified footprint requiring center EPAD = GND, tying terminal 9 to GND is acceptable only if the exact eUICC vendor confirms EPAD is GND. Otherwise, it is not safe.
Thought for 7 sec
Pads 1–8 centers: X = ±2.675 mm, Y = +1.905, +0.635, −0.635, −1.905 mm; land size = 0.96 × 0.50 mm; central anchors = 1.50 × 0.35 mm and 1.50 × 0.70 mm pairs (3.40 mm overall span), no single EPAD copper size specified.
Fix footprint and verify
Apply Annex A lands
Keep EPAD grounded
Run DRC check
Create verification note
