Resumed and completed the PCB layout flow: resized to a 60 × 90 mm 4-layer board, re-placed by USB/logic/boost/HV-output zones, replaced the problematic UCC27282 footprint with a corrected local 10-WSON part, and auto-routed the board. I also created Board Bring-Up Plan and Firmware Starter.
Open items:
One remaining Airwires check references an auto-generated stitch-via/fill artifact (34289c48); auto-route reports no normal pins left to route, so this needs manual review before manufacturing export.
HV boost compensation/output voltage still requires bench validation with the actual PDLC film load.
The corrected local UCC27282 part should be reviewed before production release.
Suggested next steps:
Visually inspect the routed PCB around R5/Q5 and the copper fill artifact.
Run a final manufacturing/DFM review before export.
Export Gerbers/BOM/pick-and-place for prototype quote.
Build the first firmware from the new starter file and begin low-voltage bring-up.
Wirelessly connects nets on schematic. Used to organize schematics and separate functional blocks. To wirelessly connect net portals, give them same designator. #portal
General Purpose Thick Film Standard Power
and High-Power Chip Resistor
47 kOhms ±5% 0.125W, 1/8W Chip Resistor 0805 (2012 Metric) Automotive AEC-Q200 Thick Film
Features:
- RMCF – standard power ratings
- RMCP – high power ratings
- Nickel barrier terminations standard
- Power derating from 100% at 70ºC to zero at +155ºC
- RoHS compliant, REACH compliant, and halogen free
- AEC-Q200 compliant
Compact USB-C 5 V smart film sample controller that generates a selectable 60–80 VAC bipolar output for up to about 1 ft² of PDLC film, with automatic 1 s clear / 1 s frosted cycling and safety-focused high-voltage design.