OS102011MS2QN1
Slide Switch, SPDT, On-On, Through Hole, OS Series, 100mA # OS102011MS2QN1 ## General Description The OS102011MS2QN1 is a miniature slide switch manufactured by C&K, designed for low-power signal switching and control applications in electronic equipment. The switch features a compact mechanical design, reliable contact performance, and through-hole mounting configuration, making it suitable for embedded systems, industrial controls, instrumentation, telecommunications equipment, consumer electronics, and portable devices. Its robust construction ensures dependable operation throughout repeated switching cycles while maintaining stable electrical performance. The device is commonly utilized for mode selection, power control, configuration settings, and user-interface functions within electronic assemblies. ## Key Features ### Mechanical Characteristics * Miniature slide switch construction * Through-hole PCB mounting * Compact form factor * Durable actuator mechanism * Positive switching action * Designed for repeated mechanical operation ### Switching Characteristics * Maintained-contact operation * Reliable position retention * Low-force actuation * Stable contact engagement * Suitable for signal and control switching applications ### Electrical Characteristics * Low contact resistance * Reliable signal transmission * Stable switching performance * Suitable for low-current and low-voltage circuits * Consistent electrical operation throughout service life ### Contact System * High-reliability contact materials * Corrosion-resistant contact surfaces * Long operational durability * Dependable electrical continuity ### Material Construction * High-strength thermoplastic housing * Industrial-grade metallic contacts * Durable actuator assembly * RoHS-compliant materials ### Environmental Characteristics * Suitable for commercial and industrial electronic equipment * Resistant to mechanical wear * Reliable performance under normal operating environments * Designed for long-term service reliability ### Application Areas * Embedded Systems * Industrial Control Equipment * Consumer Electronics * Test and Measurement Instruments * Communication Devices * Medical Electronics * Power Control Circuits * User Interface Controls * Configuration and Mode Selection Functions * Electronic Development Platforms ### Compliance * RoHS Compliant * Lead-Free Compatible * Industrial-Grade Switching Component ## Manufacturer C&K ## Product Family OS Series Miniature Slide Switches #OS102011MS2QN1 #CKSwitches #SlideSwitch #MiniatureSwitch #ElectronicSwitch #PCBSwitch #EmbeddedSystems #IndustrialElectronics #ControlSystems #ConsumerElectronics #HardwareDesign #ElectronicsEngineering #SignalSwitching #PCBAssembly #ElectronicComponents #commonpartslibrary #switch #slide #spdt... show more616 Uses
1 Star
434123043816
Surface-Mount Tactile Switch – SPST normally open (SPST-NO) tactile pushbutton switch for user input, control panels, consumer electronics, industrial equipment, IoT devices, and embedded systems. Features a top-actuated rectangular button, 50 mA at 12 VDC contact rating, 160 gf operating force, and 0.25 mm travel for precise tactile feedback. Designed with surface-mount J-lead terminals, a 6.0 × 3.5 mm footprint, and a 4.3 mm actuator height, providing reliable operation in compact PCB designs. Constructed with a liquid crystal polymer (LCP) housing, rated for 50,000 mechanical cycles, and specified for operation over a −40°C to +85°C temperature range. Part of Würth Elektronik's WS-TASV tactile switch series. #WurthElektronik #434123043816 #WSTASV #TactileSwitch #PushButton #SPST #SMTSwitch #UserInterface #ControlPanel #EmbeddedSystems #IndustrialElectronics #ConsumerElectronics... show more27 Uses
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PTV09A-4020F-A103
Rotary Carbon Potentiometer (Audio/Log Taper) – Single-turn rotary potentiometer designed for audio volume control, user interface adjustment, industrial equipment, consumer electronics, musical instruments, and embedded control applications. Features a 10 kΩ logarithmic (audio) taper, ±20% resistance tolerance, and 50 mW (1/20 W) power rating. Part of the Bourns Pro Audio PTV09 Series, it provides 280° mechanical rotation, a 6 mm flatted shaft with 20 mm length, top adjustment, carbon resistive element, and through-hole snap-in mounting with PC pins and board locks for secure PCB installation. The potentiometer has a single gang, no integrated switch, and is suitable for low-power analog signal adjustment in compact electronic designs. #Bourns #PTV09A4020FA103 #PTV09 #RotaryPotentiometer #AudioTaper #LogarithmicPotentiometer #CarbonPotentiometer #VolumeControl #UserInterface #ThroughHole #EmbeddedSystems... show more12 Uses
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PTV09A-4020F-B104
Rotary Potentiometer – 100 kΩ single-turn linear carbon potentiometer for manual analog control and user interface adjustment. Features a 9 mm body, 280° mechanical rotation, top adjustment, through-hole snap-in PCB mounting, and 20 mm flatted shaft. Rated for 0.05 W (1/20 W) power dissipation, ±20% resistance tolerance, and includes PC pin terminals with board locks for secure mounting. Designed without an integrated switch and specified for operation over a −10°C to +50°C temperature range with a 10,000-cycle mechanical life. #Bourns #PTV09A4020FB104 #RotaryPotentiometer #Potentiometer #VariableResistor #100kOhm #LinearTaper #CarbonPotentiometer #ThroughHole #UserInterface #AnalogControl #EmbeddedSystems... show more4 Uses
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STM32MP157CAC3
ARM® Cortex®-A7 Microprocessor IC STM32MP1 2 Core, 32-Bit 209MHz, 650MHz 361-TFBGA (12x12) # Engineering Specification ## Product Name STM32MP157CAC3 ## General Description STM32MP157CAC3 is a high-performance microprocessor unit that combines application processing and real-time control capabilities within a single integrated circuit. The device is designed to support advanced embedded systems requiring a balance of computing performance, deterministic control, multimedia processing, connectivity, and security functionality. The component integrates multi-core processing resources, memory interfaces, graphics capabilities, peripheral controllers, and communication subsystems to enable the development of sophisticated embedded platforms. Its heterogeneous architecture allows high-level operating systems and real-time firmware to operate simultaneously, supporting applications that require both user-interface functionality and low-latency control. The device is intended for industrial automation, human-machine interface systems, edge computing platforms, communication equipment, medical devices, smart infrastructure, and Internet of Things applications. Its architecture enables consolidation of system functions, reducing component count and simplifying overall hardware design. The design emphasizes processing efficiency, system scalability, power management, security, and long-term reliability. It supports advanced software ecosystems and facilitates the development of connected embedded products with graphical interfaces, networking capabilities, and real-time operational control. ## Functional Requirements ### Application Processing The device shall provide application-level processing capabilities suitable for operating systems, middleware, and user applications. ### Real-Time Processing The device shall support deterministic control functions for time-critical embedded operations. ### Multimedia Support The component shall support graphical and multimedia processing functions for display and user-interface applications. ### System Integration The device shall integrate processing, communication, and peripheral functions within a unified embedded computing platform. ## Electrical Requirements ### Power Management The device shall support efficient power operation and multiple power management modes to optimize energy consumption. ### Memory Interface Support The component shall support external memory devices for program execution, data storage, and system operation. ### Peripheral Connectivity The device shall provide interfaces for communication, control, monitoring, and external subsystem integration. ### Signal Integrity The design shall support reliable operation across supported interface standards and operating conditions. ## Processing Architecture Requirements ### Multi-Core Operation The device shall support concurrent execution of application and real-time workloads through integrated processing resources. ### Operating System Support The architecture shall support embedded operating systems and software frameworks suitable for advanced application development. ### Security Features The device shall support hardware-based mechanisms intended to protect system integrity, software assets, and sensitive data. ### Resource Management The component shall support efficient allocation of processing, memory, and peripheral resources. ## Mechanical Requirements ### Surface Mount Construction The device shall be supplied in a high-density surface mount package suitable for automated manufacturing processes. ### PCB Integration The package shall support integration into multilayer printed circuit boards designed for high-performance embedded systems. ### Structural Integrity The device shall maintain electrical and mechanical reliability during assembly and operational service life. ## Environmental Requirements ### Operating Conditions The component shall operate reliably within environmental conditions commonly encountered in industrial and embedded applications. ### Thermal Performance The device shall support stable operation under sustained processing workloads and associated thermal conditions. ### Storage and Handling The component shall maintain physical and electrical integrity during transportation, storage, and manufacturing processes. ## Quality Requirements ### Reliability The device shall provide dependable long-term operation in embedded and industrial computing environments. ### Verification Processing, peripheral, communication, and system functions shall be validated through applicable testing and qualification procedures. ### Compliance The product shall conform to relevant semiconductor, quality, and embedded computing standards applicable to its intended use. ## Documentation Requirements Technical documentation shall include processor architecture information, hardware integration guidelines, memory interface recommendations, power management considerations, software development support, security features, and application design guidance. ## Classification Tags #STM32MP157CAC3 #STM32MP1 #Microprocessor #MPU #EmbeddedProcessor #ARMProcessor #EmbeddedLinux #RealTimeControl #IndustrialAutomation #HumanMachineInterface #EdgeComputing #IoTGateway #EmbeddedSystems #SystemOnChip #SoC #ApplicationProcessor #GraphicsProcessor #ConnectivityPlatform #IndustrialElectronics #PCBDesign #HardwareDevelopment #ElectricalEngineering #CommonPartsLibrary #ComponentLibrary #EngineeringSpecification #TechnicalDocumentation #SystemIntegration #SecureEmbeddedSystems #MulticoreProcessing... show more4 Uses
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