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Bipolar (BJT) Transistor NPN 40V 200 mA 300MHz 300 mW Surface Mount SOT-23-3 (TO-236) The MMBT3904LT1G is a general-purpose NPN bipolar junction transistor designed for switching and amplification applications. It is housed in a compact SOT-23 surface-mount package, making it suitable for high-density PCB designs. This transistor is widely used in low-power signal processing, digital switching, and analog amplification circuits due to its reliable performance and fast switching characteristics. Key Features General-purpose NPN transistor Compact SOT-23 surface-mount package Fast switching speed Low saturation voltage Suitable for low-current and low-power applications High reliability and stability Pb-free, Halogen-free, and RoHS compliant Electrical Characteristics (Typical @ 25°C unless otherwise specified) Collector-Emitter Voltage (VCEO): 40 V Collector-Base Voltage (VCBO): 60 V Emitter-Base Voltage (VEBO): 6 V Collector Current (IC): 200 mA (max) DC Current Gain (hFE): 100 – 300 Collector-Emitter Saturation Voltage (VCE(sat)): 0.2 V (typ) Transition Frequency (fT): ~300 MHz Absolute Maximum Ratings Collector Current (Continuous): 200 mA Power Dissipation: ~225 mW Junction Temperature: +150°C (max) Operating Temperature Range: -55°C to +150°C Storage Temperature Range: -55°C to +150°C Mechanical Characteristics Package Type: SOT-23 (TO-236AB) Mounting Type: Surface Mount Number of Pins: 3 Marking Code: Dependent on lot/manufacturer marking Applications General-purpose switching circuits Signal amplification Digital logic interfacing LED drivers and small load switching Audio and RF signal processing #CommonPartsLibrary #TransistorBJT #MMBT2222

Bluetooth, WiFi 802.11b/g/n, Bluetooth v5.0 Transceiver Module 2.4GHz PCB Trace Surface Mount The ESP32-S3-WROOM-1-N16R8 is a high-performance Wi-Fi + Bluetooth Low Energy (BLE) module developed by Espressif Systems. It is built around the ESP32-S3 SoC, featuring a dual-core Xtensa LX7 32-bit processor running up to 240 MHz. This module integrates 16 MB Flash memory and 8 MB PSRAM, making it suitable for memory-intensive applications such as AI, image processing, and advanced IoT systems. It also includes an onboard PCB trace antenna, RF circuitry, crystal oscillator, and power management components—allowing designers to quickly integrate wireless connectivity into compact embedded designs. Key Features Processing & Memory Dual-core Xtensa LX7 CPU, up to 240 MHz 384 KB ROM, 512 KB SRAM + 16 KB RTC SRAM 16 MB Flash (Quad SPI) 8 MB PSRAM (Octal/Quad SPI) Connectivity 2.4 GHz Wi-Fi (802.11 b/g/n) Bluetooth 5 (LE) + Mesh support Integrated PCB antenna Peripherals & Interfaces Up to 36 GPIOs Interfaces: UART, SPI, I2C, I2S, PWM, ADC, USB OTG Built-in USB Serial/JTAG support Supports touch sensors, timers, watchdogs, CAN (TWAI) Electrical Characteristics Supply voltage: 3.0 V – 3.6 V TX power: up to ~20.5 dBm RX sensitivity: ~-103.5 dBm Operating temp: −40 °C to +65 °C (typical) Advanced Capabilities Optimized for AI acceleration (vector instructions) Suitable for voice recognition, image processing, and edge AI Low-power modes for battery-operated devices| Typical Applications IoT devices and sensor hubs Smart home & home automation AIoT (voice/image recognition) Industrial automation & monitoring Wearables and health devices USB-connected embedded systems #Module #RF-Transceiver #ESP32-S3

U.FL (UMCC) Connector Receptacle, Male Pin 50Ohm Surface Mount Solder #Connector #Coaxial #RF

SMA Connector Jack, Female Socket 50Ohm Board Edge, End Launch Solder #CommonPartsLibrary #Connector #RF #Coaxial

MAX98357A Series 5.5V 3.2W PCM Input Class D Audio Power Amplifier - TQFN-16 The MAX98357A/MAX98357B is an easy-to-use, low-cost, digital pulse-code modulation (PCM) input Class D amplifier that provides industry-leading Class AB audio performance with Class D efficiency. The digital audio interface automatically recognizes up to 35 different PCM and TDM clocking schemes which eliminates the need for I2C programming. Operation is further simplified by eliminating the need for an external MCLK signal that is typically used for PCM communication. Simply supply power, LRCLK, BCLK, and digital audio to generate audio! Furthermore, a novel pinout allows customers to use the cost-effective WLP package with no need for expensive vias (refer to Application Note 6643: Optimize Cost, Size, and Performance with MAX98357 WLP for more information). The digital audio interface is highly flexible with the MAX98357A supporting I2S data and the MAX98357B supporting left-justified data. Both ICs support 8 channel time division multiplexed (TDM) data. The digital audio interface accepts specified sample rates between 8kHz and 96kHz for all supported data formats. The ICs can be configured to produce a left channel, right channel, or (left/2 + right/2) output from the stereo input data. The ICs operate using 16/24/32-bit data for I2S and left-justified modes as well as 16-bit or 32-bit data using TDM mode. The ICs eliminate the need for the external MCLK signal that is typically used for PCM communication. This reduces EMI and possible board coupling issues in addition to reducing the size and pin count of the ICs. The ICs also feature a very high wideband jitter tolerance (12ns typ) on BCLK and LRCLK to provide robust operation. Active emissions-limiting, edge-rate limiting, and overshoot control circuitry greatly reduce EMI. A filterless spread-spectrum modulation scheme eliminates the need for output filtering found in traditional Class D devices and reduces the component count of the solution. The ICs are available in 9-pin WLP (1.345mm x 1.435mm x 0.64mm) and 16-pin TQFN (3mm x 3mm x 0.75mm) packages and are specified over the -40°C to +85°C temperature range. ● Single-Supply Operation (2.5V to 5.5V) ● 3.2W Output Power into 4Ω at 5V ● 2.4mA Quiescent Current ● 92% Efficiency (RL = 8Ω, POUT = 1W) ● 22.8μVRMS Output Noise (AV = 15dB) ● Low 0.013% THD+N at 1kHz ● No MCLK Required ● Sample Rates of 8kHz to 96kHz ● Supports Left, Right, or (Left/2 + Right/2) Output ● Sophisticated Edge Rate Control Enables Filterless Class D Outputs ● 77dB PSRR at 1kHz ● Low RF Susceptibility Rejects TDMA Noise from GSM Radios ● Extensive Click-and-Pop Reduction Circuitry ● Robust Short-Circuit and Thermal Protection ● Available in Space-Saving Packages: 1.345mm x 1.435mm WLP (0.4mm Pitch) and 3mm x 3mm TQFN ● Solution Size with Single Bypass Capacitor is 4.32mm2 Applications ● Single Li-ion Cell/5V Devices ● Smart Speakers ● Notebook Computers ● IoT Devices ● Gaming Devices (Audio and Haptics) ● Smartphones ● Tablets ● Cameras #commonpartslibrary #integratedcircuit #linearamplifier #mono

Bluetooth, WiFi 802.11b/g/n, Bluetooth v5.0 Transceiver Module 2.4GHz Antenna Not Included, U.FL Surface Mount The ESP32-S3-WROOM-1U-N16R8 is a high-performance embedded module designed for IoT and edge computing applications, featuring integrated wireless connectivity and enhanced processing capabilities. Processor: Dual-core Xtensa LX7, up to 240 MHz Wireless Connectivity: Wi-Fi 2.4 GHz (802.11 b/g/n) Bluetooth LE 5.0 Memory Configuration (N16R8): 16 MB Flash memory 8 MB PSRAM Antenna Type: U.FL connector for external antenna (“1U” variant) Indicates support for an external antenna via U.FL connector Allows improved RF performance and flexible antenna placement #commonpartslibrary #rf #wireless #transceiver #module

Linear Voltage Regulator IC Positive Fixed 1 Output 500mA SOT-23-5 The TLV75533PDBVR is a low-dropout (LDO) linear voltage regulator designed to provide a stable 3.3 V output from a higher input voltage source. It features ultra-low quiescent current and high power-supply rejection ratio (PSRR), making it ideal for battery-powered and noise-sensitive applications such as IoT devices, portable electronics, and RF circuits. The device is optimized for fast transient response and stable operation with small ceramic output capacitors. Key Features Fixed output voltage: 3.3 V Low dropout voltage (typ. ~200 mV at full load) Ultra-low quiescent current (typ. 25 µA) High PSRR for noise-sensitive applications Stable with small ceramic capacitors (≥1 µF) Thermal shutdown and overcurrent protection Available in compact SOT-23-5 package (DBV) Absolute Maximum Ratings Input voltage: –0.3 V to 6.5 V Output voltage: –0.3 V to (VIN + 0.3 V) Operating junction temperature: –40°C to +125°C Storage temperature range: –65°C to +150°C Recommended Operating Conditions Input voltage range: 1.45 V to 5.5 V Output voltage: 3.3 V (fixed) Output current: up to 500 mA Operating temperature range: –40°C to +125°C Electrical Characteristics (Typical unless otherwise noted) Output voltage accuracy: ±1% Dropout voltage: ~200 mV @ 500 mA Quiescent current: ~25 µA PSRR: up to 70 dB (at 1 kHz) Line regulation: <0.05%/V Load regulation: <0.5% Pin Configuration (SOT-23-5) Pin 1: IN – Input voltage Pin 2: GND – Ground Pin 3: EN – Enable (active high) Pin 4: NC – No connect Pin 5: OUT – Regulated output Typical Application Power management for microcontrollers and sensors Battery-powered portable devices RF and analog circuits requiring low noise supply IoT and wearable electronics Protection Features Thermal shutdown protection Overcurrent protection Undervoltage lockout (UVLO) #commonpartsLibrary #integratedcircuit #powermanagement #voltageregulator

Bluetooth, WiFi 802.11b/g/n/ax, Bluetooth v5.4 Transceiver Module 2.4GHz Integrated, Chip Surface Mount Silicon Labs SiWG917 module is our lowest power Wi-Fi 6 plus Bluetooth LE 5.4, ideal for ultra-low power IoT wireless devices using Wi-Fi®, Bluetooth, Matter, and IP networking for secure cloud connectivity. It is optimal for developing battery operated devices that need long battery life. SiWG917 module includes an ultra-low power Wi-Fi 6 plus Bluetooth Low Energy (LE) 5.4 wireless CPU subsystem, and an integrated micro-controller (MCU) application subsystem, security, peripherals and power management subsystem all in a single 16 x 21.1 x 2.3 mm package. The wireless subsystem consists of a multi-threaded Network Wireless Processor (NWP) running up to 160 MHz, baseband digital signal processing, analog front end, 2.4 GHz RF transceiver and integrated power amplifier. The application subsystem consists of an ARM® Cortex®-M4 running up to 180 MHz, embedded SRAM, flash, ultra-low power sensor hub, and matrix vector processor. The ARM® Cortex®-M4 is dedicated for peripheral and application-related processing, while the NWP runs the wireless and networking stacks on independent threads, thus providing a fully integrated solution that is ready for a wide range of embedded wireless IoT applications. The modules come with modular radio type approvals for various countries, including USA (FCC), Canada (IC/ISED) and Japan (MIC), and are in compliance with the relevant EN standards (including EN 300 328 v2.2.2) for the conformity with the directives and regulations in EU and UK. KEY FEATURES • Wi-Fi 6 Single Band 2.4 GHz 20 MHz 1x1 stream IEEE 802.11 b/g/n/ax • Bluetooth LE 5.4 • Single chip Matter Over Wi-Fi Solution • ARM® Cortex® M4 Processor with FPU subsystem up to 180 MHz with rich set of Digital and Analog Peripherals. • Wi-Fi 6 Benefits: TWT for improved efficiency and longer battery life, MUMIMO/OFDMA for Higher Throughput, network capacity and low latency • Best in Class Device and Wireless Security • WLAN Tx power up to +17.5 dBm with integrated PA • Bluetooth LE Tx power up to +17 dBm with integrated PA • WLAN Rx sensitivity as low as -95.5 dBm • Wi-Fi 4 Standby Associated mode current: 71 μA @ 1-second listen interval • Embedded Flash option up to 8 MB/ optional external Flash up to 16 MB • Embedded PSRAM option up to 2 MB/ optional external PSRAM option up to 16 MB • Ultra-low power sensor hub peripherals • Matrix Vector Processor (MVP) • Embedded Wi-Fi, Bluetooth LE, Matter, and networking stacks supporting wireless coexistence • Three software-configurable MCU application memory options for sharing the RAM between the wireless, system, and application (192/256/320 KB) • Operating temperature: -40 to +85 ºC • Operating supply range: 3.0 to 3.63 V • Supply voltage for GPIOs: 1.71 to 3.63 V #WiFi6 #BluetoothLE54 #IoTModule #WirelessSoC #SiliconLabs #EmbeddedSystems #SmartHome #IndustrialIoT #LowPowerDesign #RFModule #ConnectedDevices #EdgeComputing #MatterReady #PCBDesign #ElectronicsEngineering

MAX-M10 RF Receiver BeiDou, Galileo, GLONASS, GPS, GNSS 1.561GHz, 1.575GHz, 1.602GHz -167dBm 921.6kbps Not Included Module The MAX-M10S-00B is a professional-grade, ultra-low-power GNSS positioning module from u-blox based on the u-blox M10 platform. It is designed for battery-powered applications such as asset trackers, wearables, IoT devices, and navigation systems. The module supports simultaneous reception of multiple GNSS constellations, providing high positioning availability, fast acquisition times, and excellent sensitivity even in challenging urban or weak-signal environments. It integrates a TCXO, LNA, and SAW filter to improve RF performance while maintaining very low power consumption. Key Features Multi-constellation GNSS receiver: GPS Galileo GLONASS BeiDou QZSS SBAS support (WAAS, EGNOS, MSAS, GAGAN) Concurrent tracking of up to four GNSS constellations for improved position availability and accuracy. Ultra-low power consumption: Approximately 25 mW in continuous tracking mode, making it ideal for battery-powered devices. High RF sensitivity: Tracking sensitivity up to −167 dBm for reliable operation in weak-signal conditions. High positioning accuracy: Typical position accuracy of approximately 1.5 m CEP under suitable conditions. Navigation update rate: Up to 10 Hz for responsive tracking applications. Integrated RF front-end: Built-in LNA (Low Noise Amplifier) Built-in SAW filter Integrated TCXO for stable operation. Supports Assisted GNSS services: AssistNow Online AssistNow Offline AssistNow Autonomous CloudLocate support for low-power IoT positioning. Communication interfaces: UART I²C NMEA and UBX protocols supported. Wide operating temperature range: −40°C to +85°C. Supply voltage: 1.76 V to 3.6 V. Typical Applications Asset tracking devices Wearable electronics Fleet management systems Industrial IoT Smart meters Drone and robotics navigation Personal navigation devices Timing and synchronization systems Package Information Package Type: Surface-mount LCC module Dimensions: 9.7 mm × 10.1 mm × 2.5 mm (typical module size) #Commonpartslibrary #RF #Wireless #RFreceivers #MAXM10S #uBlox #GNSS #GPS #Galileo #GLONASS #BeiDou #QZSS #NavigationModule #GNSSModule #GPSTracking #AssetTracking #IoT #IndustrialIoT #WearableTech #FleetManagement #DroneNavigation #EmbeddedSystems #ElectronicsDesign #PCBDesign #HardwareEngineering #LowPowerDesign #LocationTracking #Geolocation #RFDesign #LNA #SMTModule

ESP32-S3-MINI-1-N8 is a compact, low-power Wi-Fi and Bluetooth module from Espressif Systems based on the ESP32-S3 SoC. It integrates a dual-core Xtensa LX7 processor, 8 MB flash memory, crystal oscillator, RF matching circuitry, and a PCB antenna in a small SMD package, making it ideal for IoT devices, smart home products, industrial automation, HMI applications, AIoT edge devices, and USB-connected embedded systems. Key Features Dual-core 32-bit Xtensa LX7 CPU Up to 240 MHz operating frequency Includes single-precision floating-point unit (FPU) for enhanced processing performance. Integrated Memory 8 MB Quad SPI Flash (N8 variant) 512 KB SRAM 384 KB ROM 16 KB RTC SRAM. Wireless Connectivity 2.4 GHz Wi-Fi 4 (802.11 b/g/n) Data rates up to 150 Mbps Bluetooth 5 LE with Bluetooth Mesh support Simultaneous Wi-Fi and Bluetooth operation through an integrated coexistence mechanism. Rich Peripheral Set Up to 39 GPIOs USB 2.0 OTG USB Serial/JTAG SPI, I²C, I²S, UART PWM, MCPWM SDIO Host ADC Touch sensing Temperature sensor TWAI® (CAN 2.0 compatible) Timers and watchdogs. Integrated Components On-board 40 MHz crystal oscillator PCB antenna RF matching network Compact certified module design. Operating Conditions Supply voltage: 3.0 V to 3.6 V Operating temperature: −40°C to +85°C. Compliance RoHS and REACH compliant RF-certified module for simplified product development. #RF_transceiver #Module #Esp32