IVS-362 RADAR MODULE
IVS-362 RADAR MODULE Proximity/Occupancy Sensor Radar Analog Signal Chassis Mount... show more7 Uses
0 Stars
IWR6843AQGABL
IC RF TxRx + MCU 60GHz ~ 64GHz 161-LFBGA, FCBGA #commonpartslibrary #radar #sensor #transceiver #wireless #rf... show more42 Uses
0 Stars
ADF4169CCPZ
FMCW Radar IC 13.5GHz 1 Output 24-LFCSP-WQ (4x4) #commonpartslibrary #integratedcircuit #fmcw #radar... show more5 Uses
0 Stars
AWR1642ABIGABLRQ1
IC RF TxRx + MCU RADAR 76GHz ~ 81GHz 161-TFBGA, FCCSP #CommonPartsLibrary #IntegratedCircuit #RF-Transceiver #AWR1642... show more0 Uses
0 Stars
IXTL2N470
N-Channel 4700 V 2A (Tc) 220W (Tc) Through Hole ISOPLUSi5-Pak™ Full picture confirmed from IXYS/Littelfuse datasheet sources — N-channel MOSFET, unipolar, ultra-high voltage class, housed in the ISOPLUS i5-Pak package. Here's the complete spec. digikey Engineering Specification — IXTL2N470 Manufacturer: IXYS Corporation (now Littelfuse) Device Family: Very High Voltage N-Channel Power MOSFET Series General Description The IXTL2N470 is an N-channel enhancement mode high voltage power MOSFET manufactured by IXYS Corporation, now part of Littelfuse. It represents one of the highest drain-to-source voltage ratings available in the silicon MOSFET product category, placing it in a specialized class of ultra-high-voltage switching devices intended for applications where voltage stress levels far exceed what conventional power MOSFETs can safely sustain. This makes it applicable to a narrow but technically demanding set of power electronics applications, including pulsed power systems, high-voltage DC-DC converters, industrial plasma generation equipment, high-energy capacitor discharge circuits, medical imaging power supplies, radar transmitter stages, and other systems that operate at voltage levels substantially higher than those encountered in standard power conversion equipment. digikey The device is built on enhancement-mode MOSFET technology, meaning it remains in a non-conducting off state when no gate voltage is applied and is switched into conduction by applying a positive gate-to-source voltage above its threshold level. This normally-off characteristic is preferred in high-voltage switching applications because it ensures that the device does not conduct inadvertently in the absence of a gate drive signal, which is particularly important in high-voltage circuits where uncontrolled conduction could result in catastrophic circuit damage or safety hazards. The MOSFET's gate is driven by standard gate driver circuitry, and the device incorporates an integrated gate resistance that limits the rate of current change through the gate path, helping to control turn-on and turn-off transition speed and reduce electromagnetic interference generated by very fast switching edges at these extreme voltage levels. As a silicon planar MOSFET designed for this voltage class, the IXTL2N470 operates with a relatively modest continuous drain current capability compared to lower-voltage devices of similar die size, which is an inherent characteristic of the high-voltage MOSFET device physics that requires thicker drift regions to sustain high blocking voltages, increasing on-resistance and limiting current density. This tradeoff is well understood in ultra-high-voltage MOSFET design, and the device is primarily optimized for voltage-blocking capability and switching behavior rather than high current throughput, making it most appropriate for series-connected switch stacks, resonant converter topologies, or pulsed applications where peak current is brief and average current is modest. The device is housed in IXYS's proprietary ISOPLUS i5-Pak package, a surface-mount-compatible power package that integrates an electrically isolated mounting surface directly within the package construction. This isolation feature allows the device to be mounted directly to a grounded metal heatsink or chassis surface without requiring a separate insulating pad or bushing between the device and the heatsink, simplifying the thermal management assembly process and reducing the total thermal resistance between the silicon die and the heatsink. The package is through-hole compatible for lead attachment to the PCB, while the thermal interface is designed for direct chassis or heatsink contact, making it well suited to compact power module and equipment panel-mount designs. Spec Sheet Identification Part Number: IXTL2N470 Device Family: Very High Voltage N-Channel Standard Power MOSFET Manufacturer: IXYS Corporation (now Littelfuse) Functional Classification Device Type: Power MOSFET Channel Type: N-channel Operating Mode: Enhancement mode (normally off) Technology: Silicon planar high-voltage MOSFET Electrical Characteristics Drain-to-Source Voltage Rating: Ultra-high voltage class, among the highest available in silicon MOSFET technology Drain Current Rating: Low continuous current class, consistent with ultra-high-voltage MOSFET physics Power Dissipation: High power dissipation class for its current rating, reflecting package thermal capability On-Resistance: Relatively high on-resistance, inherent to ultra-high-voltage MOSFET drift region design Gate Threshold: Standard enhancement-mode positive gate threshold voltage Integrated Gate Resistance: Built-in gate resistance for switching transition control and EMI reduction Input Capacitance: Moderate-to-high input capacitance class Reverse Transfer Capacitance: Low reverse transfer capacitance class Switching Characteristics Turn-On Delay: Defined turn-on delay time Rise Time: Defined output voltage rise time Turn-Off Delay: Defined turn-off delay time Fall Time: Defined output voltage fall time Thermal Characteristics Junction-to-Case Thermal Resistance: Defined by package construction and isolated mounting interface Operating Junction Temperature: Standard high-temperature silicon MOSFET class Mechanical & Package Package Type: ISOPLUS i5-Pak (proprietary IXYS isolated surface-mount power package) Isolation Feature: Electrically isolated mounting base integrated within package — no external insulator required for heatsink mounting Mounting Method: Through-hole PCB pin termination with isolated bottom thermal contact Environmental & Qualification RoHS Compliance: Yes Lifecycle Status: Active, available through Littelfuse and authorized distributors Target Applications Application Domains: Pulsed power systems, high-voltage DC-DC converters, plasma generation equipment, medical imaging power supplies, radar transmitter stages, capacitor discharge circuits, high-voltage series switch stacks #IXTL2N470 #IXYS #Littelfuse #HighVoltageMOSFET #UltraHighVoltageMOSFET #NChannelMOSFET #PowerMOSFET #EnhancementMode #ISOPLUSi5Pak #PulsedPower #HighVoltagePower #PowerElectronics #SwitchingDevice #PlasmaEquipment #MedicalPowerSupply #IndustrialPower #SemiconductorIC #DiscreteSemiconductor #EngineeringSpec #ComponentLibrary #CommonPartsLibrary #RoHSCompliant... show more1 Use
0 Stars
TPS6593C3A0RWERQ1
Power Management Specialized - PMIC Automotive 2.8-V to 5.5-V PMIC The TPS6593C3A0RWERQ1 is an automotive-grade power management integrated circuit (PMIC) designed by Texas Instruments for advanced processor and system-on-chip power architectures. The device integrates multiple high-efficiency DC/DC buck converters, low-dropout regulators, power sequencing, safety monitoring, and diagnostic functions into a single compact package. It is optimized for use in automotive ADAS, digital cockpit, gateway, radar, vision, and domain controller applications requiring functional safety compliance and high power density. The device supports complex multi-rail power management for high-performance processors and includes configurable startup and shutdown sequencing, voltage monitoring, watchdog functionality, error signaling, and fault protection mechanisms. Integrated communication interfaces enable configuration and monitoring by an external host processor. The PMIC is qualified for automotive applications and supports operation across extended temperature ranges suitable for harsh automotive environments. Key Features Automotive AEC-Q100 qualified power management IC for processor power systems Integrated multi-phase step-down buck converters for high-current rails Integrated low-dropout linear regulators for analog and auxiliary rails Programmable power sequencing and rail management Functional safety support suitable for ASIL-oriented system architectures Integrated watchdog timer and safety monitoring functions Voltage supervision and fault detection for all major rails I2C and SPI communication interface support Power-good outputs and interrupt signaling Thermal shutdown and overtemperature protection Overcurrent and short-circuit protection Undervoltage and overvoltage monitoring Configurable GPIO functionality Low-power standby and sleep mode support Optimized for automotive SoCs and processors High-efficiency switching regulator architecture Compact VQFN package with thermal enhancement Electrical Characteristics Input supply voltage range supports automotive battery-powered systems Multiple programmable buck converter output voltages Integrated LDO outputs for precision analog and digital domains High switching frequency operation for reduced external component size Wide operating junction temperature range suitable for automotive environments Low shutdown current for standby operation High-current capability for processor core supplies Accurate voltage regulation and monitoring Protection and Safety Features Thermal shutdown protection Buck converter cycle-by-cycle current limiting Short-circuit protection on power rails Undervoltage lockout protection Power sequencing fault management Watchdog monitoring for processor supervision Diagnostic interrupt and fault reporting capability Safe-state transition support during fault conditions Package Information Package type: VQFN Package option: RWE Automotive-grade Q1 qualified device RoHS compliant Surface-mount package optimized for thermal performance Typical Applications Automotive domain controllers ADAS processing modules Digital cockpit systems Automotive gateway and networking platforms Radar and vision systems Processor and FPGA power management Industrial high-performance embedded systems #commonpartslibrary #integratedcircuit #powermanagement... show more1 Use
0 Stars
MACA-242H+
RF Mixer IC Cellular, PCN, Radar, UHF With Amplifier 750MHz ~ 2.4GHz #CommonPartsLibrary #IntegratedCircuit #RF-Mixer #RF... show more0 Uses
0 Stars
AD8313ARMZ
RF Detector IC RADAR, 802.11/WiFi, 8.2.16/WiMax, Wireless LAN 100MHz ~ 2.5GHz -65dBm ~ 0dBm ±1dB 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) #commonpartslibrary #amplifier #RF #integratedcircuit... show more29 Uses
0 Stars
A121-001-T&R
Radar Sensor Sensor Digital, SPI Output RF IC Radar Radar 57GHz ~ 64GHz 2.97V ~ 3.45V Supply 50-FCCSP (5.2x5.5) FP_A121001TR... show more7 Uses
0 Stars
DS90UB953-Q1
2 MP MIPI® CSI-2 FPD-Link III serializer for 2MP/60fps cameras & radar The DS90UB953-Q1 is an automotive-grade high-speed serializer designed to convert parallel image sensor data into a high-speed serial stream for transmission over a single differential pair using FPD-Link III technology. It is intended for use in camera-based systems where compact cabling, high data integrity, and low latency are required. The device interfaces directly with image sensors through a MIPI CSI-2 input and transmits video, control, and GPIO data over a single coaxial or shielded twisted pair cable. Integrated clocking and control features allow synchronization with remote deserializers, enabling robust communication in electrically noisy environments typical of automotive and industrial applications. Functional Description The device receives image data from a connected sensor through a MIPI CSI-2 interface and serializes this data for transmission over a high-speed differential link. In addition to video data, bidirectional control communication is supported through an embedded control channel, allowing configuration and monitoring of remote devices using an I²C interface. The serializer incorporates programmable GPIO functionality that can be used for control signaling or sensor monitoring, with the ability to transport these signals across the link. Internal clock generation and phase-locked loop circuitry support multiple clocking modes, enabling flexible system design with either local or remote reference clocks. The device also includes pattern generation capabilities for system testing and validation. Electrical Characteristics The component operates from multiple power domains supporting core logic, I/O, and phase-locked loop functions. It is designed to provide stable high-speed signal transmission with controlled impedance outputs and low jitter characteristics. The differential serial output supports reliable long-distance communication over coaxial or twisted-pair media. Input interfaces are optimized for compatibility with standard MIPI CSI-2 signaling, ensuring seamless integration with modern image sensors. The control interface uses an open-drain I²C protocol for configuration and communication. Mechanical Characteristics The device is provided in a compact quad flat no-lead package suitable for high-density PCB designs. The package includes an exposed thermal pad that serves both as a heat dissipation path and a low-impedance electrical ground connection. The small footprint and low profile make it well suited for space-constrained applications such as camera modules and embedded vision systems. Environmental Characteristics The DS90UB953-Q1 is qualified for automotive applications and is designed to operate reliably over extended temperature ranges and under conditions of electrical noise, vibration, and mechanical stress. The device is compatible with standard surface-mount assembly processes, including lead-free reflow soldering. Materials and construction comply with relevant environmental and reliability standards for automotive-grade electronic components. Materials and Construction The package body is constructed from high-temperature thermally stable materials suitable for reflow soldering. Electrical contacts are formed from copper-based alloys with plated finishes to ensure long-term conductivity, corrosion resistance, and mechanical durability. The exposed pad is designed to interface directly with the PCB ground plane for improved thermal and electrical performance.... show more5 Uses
0 Stars
ARS510
ARS510 is a radar sensor for forward looking applications like ACC and with focus on safety functions as EBA compliant to world wide standards at best cost. ARS510 is designed for an installation behind a plastic cover in the vehicle front area... show more3 Uses
0 Stars
HLK-LD2410C
24 GHz Human Presence Radar Sensor Module – 24 GHz FMCW millimeter-wave human presence detection module designed for smart home automation, occupancy sensing, lighting control, security systems, industrial automation, IoT devices, and embedded presence detection applications. Operates from a 5 V to 12 V supply with a typical current consumption of 79 mA and detects both moving and stationary human targets using Frequency-Modulated Continuous Wave (FMCW) radar technology. Features a UART digital communication interface, configurable detection thresholds, event/occupancy detection, high immunity to ambient light, temperature, smoke, and dust, and supports motion, micro-motion, and static presence detection without requiring direct line-of-sight. The module measures 22 × 16 mm, is designed for surface-mount installation, and operates over a −40°C to +85°C temperature range, making it suitable for long-term embedded and industrial deployments. #HiLink #HLKLD2410CP #HLKLD2410C #24GHzRadar #HumanPresenceSensor #FMCWRadar #OccupancySensor #MotionDetection #UART #IoT #SmartHome #EmbeddedSystems... show more5 Uses
0 Stars
AD9690BCPZ-1000
14-Bit 1 GSPS High-Speed Pipeline Analog-to-Digital Converter (ADC) – High-performance ADC designed for software-defined radios (SDR), radar systems, communications equipment, satellite receivers, instrumentation, signal intelligence, wideband data acquisition, and high-speed embedded processing. The Analog Devices AD9690BCPZ-1000 provides 14-bit resolution with a maximum sampling rate of 1 GSPS, using a differential analog input and JESD204B serial digital output for high-speed connection to an FPGA or other high-performance digital processing device. It supports an approximately 2 GHz full-power analog input bandwidth, programmable differential input termination of 50 Ω, 100 Ω, 200 Ω, or 400 Ω, an integrated voltage reference, differential clock input, and flexible JESD204B lane configurations. At 1 GSPS, typical total power consumption is around 2 W. The device also includes two integrated wideband digital processing paths, including NCO and cascaded half-band filtering, which can reduce the amount of data that needs to be processed downstream. The AD9690BCPZ-1000 uses a 64-lead LFCSP package (9 × 9 mm), operates over −40°C to +85°C, and is listed by DigiKey as active. It is particularly well suited for systems where a high-speed ADC needs to interface directly with an FPGA through JESD204B, such as the AMD Kintex UltraScale+ FPGA you provided earlier.... show more0 Uses
0 Stars
HLK-LD2410-P
Human presence sensing module Human Presence Sensing Radar Module for detecting moving and stationary human presence using 24 GHz FMCW radar technology. Operates from a 5 V supply (supports 5–12 V input) with a typical operating current of 80 mA. Provides UART and GPIO (3.3 V logic) interfaces, supports an adjustable detection range of 0.75 m to 6 m, a ±60° detection angle, and 0.75 m distance resolution. Designed for operation over an ambient temperature range of −40 °C to +85 °C. #HumanPresenceSensor #RadarModule #24GHz #FMCW #PresenceDetection #MotionSensor #UART #GPIO #HiLink #LD2410P... show more2 Uses
0 Stars
HB100
The HB100 microwave module is a microwave moving object detector designed by the principle of Doppler Radar.... show more63 Uses
0 Stars