Bluetooth, WiFi 802.11b/g/n, Bluetooth v5.0 Transceiver Module 2.4GHz PCB Trace Surface Mount The ESP32-S3-WROOM-1-N16R8 is a high-performance Wi-Fi + Bluetooth Low Energy (BLE) module developed by Espressif Systems. It is built around the ESP32-S3 SoC, featuring a dual-core Xtensa LX7 32-bit processor running up to 240 MHz. This module integrates 16 MB Flash memory and 8 MB PSRAM, making it suitable for memory-intensive applications such as AI, image processing, and advanced IoT systems. It also includes an onboard PCB trace antenna, RF circuitry, crystal oscillator, and power management components—allowing designers to quickly integrate wireless connectivity into compact embedded designs. Key Features Processing & Memory Dual-core Xtensa LX7 CPU, up to 240 MHz 384 KB ROM, 512 KB SRAM + 16 KB RTC SRAM 16 MB Flash (Quad SPI) 8 MB PSRAM (Octal/Quad SPI) Connectivity 2.4 GHz Wi-Fi (802.11 b/g/n) Bluetooth 5 (LE) + Mesh support Integrated PCB antenna Peripherals & Interfaces Up to 36 GPIOs Interfaces: UART, SPI, I2C, I2S, PWM, ADC, USB OTG Built-in USB Serial/JTAG support Supports touch sensors, timers, watchdogs, CAN (TWAI) Electrical Characteristics Supply voltage: 3.0 V – 3.6 V TX power: up to ~20.5 dBm RX sensitivity: ~-103.5 dBm Operating temp: −40 °C to +65 °C (typical) Advanced Capabilities Optimized for AI acceleration (vector instructions) Suitable for voice recognition, image processing, and edge AI Low-power modes for battery-operated devices| Typical Applications IoT devices and sensor hubs Smart home & home automation AIoT (voice/image recognition) Industrial automation & monitoring Wearables and health devices USB-connected embedded systems #Module #RF-Transceiver #ESP32-S3

Thermal Image Sensor 32H x 24V TO-39 #camera #IR #

Thermal Image Sensor 32H x 24V TO-39 # MLX90640ESF-BAB-000-TU Engineering Specifications **General Description** The MLX90640ESF-BAB-000-TU is a contactless infrared thermal imaging sensor manufactured by Melexis. It incorporates a microbolometer array that detects infrared radiation emitted by objects and converts the captured thermal energy into temperature data, enabling the creation of thermal images without physical contact. The device is designed for compact and cost-effective thermal imaging applications, offering high thermal sensitivity and accurate temperature measurement capabilities. It integrates a digital signal-processing engine, calibration data memory, and a digital communication interface, allowing direct connection to microcontrollers, embedded systems, and industrial monitoring equipment. The sensor provides real-time thermal mapping across its field of view and is suitable for applications involving human presence detection, predictive maintenance, industrial automation, smart building systems, medical screening, consumer electronics, robotics, and thermal monitoring solutions. Its factory calibration ensures stable performance throughout its operating life while minimizing external calibration requirements. **Engineering Specifications** **Manufacturer:** Melexis **Manufacturer Part Number:** MLX90640ESF-BAB-000-TU **Component Type:** Infrared thermal imaging sensor **Sensor Technology:** Microbolometer thermal sensor array **Measurement Method:** Non-contact infrared temperature sensing **Output Type:** Digital thermal image data **Communication Interface:** I²C-compatible serial interface **Temperature Measurement Capability:** Object temperature monitoring and thermal imaging **Thermal Imaging Function:** Real-time thermal map generation **Integrated Processing:** On-chip signal processing and calibration management **Calibration:** Factory calibrated with stored calibration parameters **Power Supply Configuration:** Single-supply operation **Power Consumption:** Optimized for low-power embedded applications **Refresh Rate:** Programmable thermal frame refresh operation **Thermal Sensitivity:** High-sensitivity infrared detection **Field of View Variant:** Wide-angle thermal imaging configuration **Accuracy Characteristics:** High-precision temperature measurement with integrated compensation algorithms **Memory Features:** Internal EEPROM for calibration coefficients **Operating Mode:** Continuous and programmable thermal acquisition **Data Output Format:** Digital temperature and thermal pixel information **Environmental Stability:** Designed for reliable operation across varying ambient conditions **Electromagnetic Compatibility:** Suitable for embedded and industrial electronic systems **Package Type:** Surface-mount package with infrared-transparent window **Mounting Style:** Surface mount technology **Package Construction:** Reflow-solderable assembly **Lead Finish:** Lead-free finish **Environmental Compliance:** RoHS compliant and halogen-free **Reliability Features:** Factory-tested and production-calibrated thermal imaging device **Typical Applications** Thermal cameras Human presence detection systems Occupancy monitoring Industrial predictive maintenance Electrical equipment inspection Smart building automation HVAC monitoring systems Medical screening devices Consumer electronics Robotics and autonomous systems Fire detection and prevention systems Industrial process monitoring Energy management systems Automotive thermal sensing applications Security and surveillance equipment #MLX90640 #MLX90640ESF #Melexis #ThermalSensor #InfraredSensor #ThermalImaging #Microbolometer #TemperatureSensor #IndustrialAutomation #EmbeddedSystems #IoT #PredictiveMaintenance #SmartBuilding #ThermalCamera #ElectronicComponents #EngineeringSpecifications

CMOS Image Sensor 1280H x 800V 3µm x 3µm 69-ODCSP (5.55x5.57) #CommonPartsLibrary #IntegratedCircuit #sensor #Transducer #Optical-Sensor #Image-Sensor #Camera #AR0144

Image Sensors AR0135CS2C00SUEA0-DPBR IBGA-63_L9.0-W9.0-P1.00_AR0135 LCSC Part Number: C606295 JLCPCB Part Class: undefined Manufactured by onsemi(安森美)

CMOS with Processor Image Sensor 1920H x 1080V 1.4µm x 1.4µm 34-CSP5 (3.85x2.92)

System On Chip (SOC) IC It integrates multiple processing units including CPUs, DSPs, AI accelerators, and GPU into a single chip to handle vision processing, deep learning, sensor fusion, and real-time control in automotive and industrial systems. • C7x floating point, vector DSP, up to 1.0GHz, 80 GFLOPS, 256 GOPS • Deep-learning matrix multiply accelerator (MMA), up to 8 TOPS (8b) at 1.0GHz • Vision Processing Accelerators (VPAC) with Image Signal Processor (ISP) and multiple vision assist accelerators • Depth and Motion Processing Accelerators (DMPAC) • Dual 64-bit Arm® Cortex®-A72 microprocessor subsystem at up to 2.0GHz – 1MB shared L2 cache per dual-core Cortex®- A72 cluster – 32KB L1 DCache and 48KB L1 ICache per Cortex®-A72 core • Six Arm® Cortex®-R5F MCUs at up to 1.0GHz – 16K I-Cache, 16K D-Cache, 64K L2 TCM – Two Arm® Cortex®-R5F MCUs in isolated MCU subsystem – Four Arm® Cortex®-R5F MCUs in general compute partition • Two C66x floating point DSP, up to 1.35GHz, 40GFLOPS, 160GOPS • 3D GPU PowerVR® Rogue 8XE GE8430, up to 750MHz, 96GFLOPS, 6Gpix/sec • Custom-designed interconnect fabric supporting near max processing entitlement Memory subsystem: • Up to 8MB of on-chip L3 RAM with ECC and coherency – ECC error protection – Shared coherent cache – Supports internal DMA engine • External Memory Interface (EMIF) module with ECC – Supports LPDDR4 memory types – Supports speeds up to 4266MT/s – 32-bit data bus with inline ECC • General-Purpose Memory Controller (GPMC) • 512KB on-chip SRAM in MAIN domain, protected by ECC #CommonPartsLibrary #IntegratedCircuit

CCD Image Sensor 5.5µm x 64µm 16-GLCC (15.2x6) #sensor #CCD #image

BGA-565(15.5x14.4) Microcontrollers, Quad-core ARM Cortex-A55 processor The RK3566 is a high-performance, low-power 64-bit application processor developed by Rockchip for AIoT, industrial control, smart displays, tablets, embedded systems, and single-board computers. It integrates a quad-core ARM Cortex-A55 CPU, Mali-G52 GPU, AI acceleration engine (NPU), advanced multimedia processing, and a rich set of connectivity interfaces, making it suitable for Linux- and Android-based applications requiring efficient performance and multimedia capabilities. Key Features Quad-core 64-bit ARM Cortex-A55 processor operating up to 2.0 GHz. ARM Mali-G52 2EE GPU with support for OpenGL ES 3.2, OpenCL 2.0, and Vulkan 1.1. Integrated NPU delivering up to 1 TOPS AI computing performance. Supports DDR3, DDR3L, DDR4, LPDDR3, LPDDR4, and LPDDR4X memory. Hardware video decoding up to 4K@60fps for H.264, H.265, and VP9 formats. Hardware video encoding up to 1080p@60fps for H.264 and H.265. Built-in 8MP ISP with HDR image processing support. Multiple display interfaces including HDMI 2.0, eDP, MIPI-DSI, LVDS, RGB, and E-Ink. High-speed connectivity with USB 3.0, USB 2.0, PCIe, SATA, Gigabit Ethernet, SDIO, and eMMC 5.1. Rich peripheral support including UART, SPI, I²C, PWM, ADC, I²S, PDM, and GPIO. Optimized for Android, Linux, industrial HMI, smart home, edge computing, and AIoT applications. Manufactured using a 22 nm process for improved power efficiency. #RK3566 #Rockchip #ARMCortexA55 #MaliG52 #AIoT #EmbeddedSystems #SingleBoardComputer #Linux #Android #IndustrialControl #SmartDisplay #EdgeComputing #SoC #Processor #NPU #4KVideo #IoT #Electronics #HardwareDesign #PCBDesign

2 MP MIPI® CSI-2 FPD-Link III serializer for 2MP/60fps cameras & radar The DS90UB953-Q1 is an automotive-grade high-speed serializer designed to convert parallel image sensor data into a high-speed serial stream for transmission over a single differential pair using FPD-Link III technology. It is intended for use in camera-based systems where compact cabling, high data integrity, and low latency are required. The device interfaces directly with image sensors through a MIPI CSI-2 input and transmits video, control, and GPIO data over a single coaxial or shielded twisted pair cable. Integrated clocking and control features allow synchronization with remote deserializers, enabling robust communication in electrically noisy environments typical of automotive and industrial applications. Functional Description The device receives image data from a connected sensor through a MIPI CSI-2 interface and serializes this data for transmission over a high-speed differential link. In addition to video data, bidirectional control communication is supported through an embedded control channel, allowing configuration and monitoring of remote devices using an I²C interface. The serializer incorporates programmable GPIO functionality that can be used for control signaling or sensor monitoring, with the ability to transport these signals across the link. Internal clock generation and phase-locked loop circuitry support multiple clocking modes, enabling flexible system design with either local or remote reference clocks. The device also includes pattern generation capabilities for system testing and validation. Electrical Characteristics The component operates from multiple power domains supporting core logic, I/O, and phase-locked loop functions. It is designed to provide stable high-speed signal transmission with controlled impedance outputs and low jitter characteristics. The differential serial output supports reliable long-distance communication over coaxial or twisted-pair media. Input interfaces are optimized for compatibility with standard MIPI CSI-2 signaling, ensuring seamless integration with modern image sensors. The control interface uses an open-drain I²C protocol for configuration and communication. Mechanical Characteristics The device is provided in a compact quad flat no-lead package suitable for high-density PCB designs. The package includes an exposed thermal pad that serves both as a heat dissipation path and a low-impedance electrical ground connection. The small footprint and low profile make it well suited for space-constrained applications such as camera modules and embedded vision systems. Environmental Characteristics The DS90UB953-Q1 is qualified for automotive applications and is designed to operate reliably over extended temperature ranges and under conditions of electrical noise, vibration, and mechanical stress. The device is compatible with standard surface-mount assembly processes, including lead-free reflow soldering. Materials and construction comply with relevant environmental and reliability standards for automotive-grade electronic components. Materials and Construction The package body is constructed from high-temperature thermally stable materials suitable for reflow soldering. Electrical contacts are formed from copper-based alloys with plated finishes to ensure long-term conductivity, corrosion resistance, and mechanical durability. The exposed pad is designed to interface directly with the PCB ground plane for improved thermal and electrical performance.

CCD LINEAR IMAGE SENSOR CCD(Charge Coupled Device) #CommonPartsLibrary #IntegratedCircuit

The onsemi AR2020 is a stacked 1/1.8-inch back side illuminated (BSI) CMOS active-pixel digital image sensor with a pixel array of 5120H x 3840V (5136H x 3856V including border pixels). The AR2020 has enhanced NIR response. It incorporates sophisticated on-chip camera functions such as Wake on Motion (WOM), context switching and multiple subsampling modes. It is programmable through a simple I2C interface and has very low power consumption. The AR2020 digital image sensor features onsemi's breakthrough low-noise CMOS imaging technology. The AR2020 sensor can generate full resolution image at up to 60 frames per second (fps) in 10-bit linear mode. AR2020 can achieve 30 fps in line interleaved high dynamic range (LI-HDR) and enhanced Dynamic Range (eDR) modes. #sensor #Transducer #Optical-Sensor #Image-Sensor #Hyperlux™ LP

FLYTO MM238RW 5.8G 4.9G 6.0G Wireless FPV Video Transmission Open-Source Receiver with SPI High Sensitivity The MM238RW is a high-sensitivity analog FPV (First-Person View) video receiver module designed for wireless image transmission systems operating in the 4.9 GHz, 5.8 GHz, and 6.0 GHz bands. It supports SPI control for frequency configuration and integration into custom embedded systems, FPV goggles, ground stations, and video receivers. The module provides low-latency CVBS video output, strong anti-interference performance, and wide compatibility with analog FPV video transmitters. Key Features Wide receiving frequency range: 4900 MHz to 5945 MHz SPI interface for channel and frequency control High receiver sensitivity of up to −90 dBm Low-latency analog CVBS video output FM/PLL demodulation architecture Excellent anti-interference performance 50 Ω RF input impedance Supply voltage: 3.3 V to 5.0 V Typical current consumption: 220 mA Compact module suitable for FPV goggles, monitors, and ground stations Supports custom firmware and open-source development platforms Applications FPV racing drones UAV and aerial photography systems Ground station receivers FPV goggles Wireless analog video monitoring Custom RF video receiver designs Hashtags: #MM238RW #FPV #VideoReceiver #5_8GHz #SPIInterface #DroneElectronics #WirelessVideo #CVBS #RFModule #UAV #FPVGoggles #EmbeddedSystems #AerialPhotography #LowLatency #OpenSourceFPV

Varistors V275LA10P RES-TH_L12.5-W5.6-P8.50-D0.9-430 V 2.5 kA Varistor 1 Circuit Through Hole Disc 10mm Image MOV varistor for 2275VAC mains input V275LA10P

ARM® Cortex®-M0+ - Microcontroller IC 32-Bit Dual-Core 133MHz External Program Memory 56-QFN (7x7) Part Description The RP2040 by Raspberry Pi is an ARM® Cortex®-M0+ microcontroller featuring a 32-Bit Dual-Core processor capable of running at 133MHz. It supports external program memory and integrates a comprehensive set of peripherals including I2C, IrDA, QSPI, SPI, UART/USART, USB, and more. This IC is packaged in a 56-pin QFN (7x7) with exposed pads, making it ideal for surface-mount applications and high-density designs. Additional features include integrated data converters (4x12b SAR A/D), 264K x 8 RAM, and robust connectivity along with peripherals like brown-out detection, DMA, I2S, LCD control, POR, PWM, and Watchdog Timer. Note that the image is a representation only; exact specifications must be confirmed via the product datasheet. Manufacturer Lead Time: 8 Weeks Packaging Options: Tape & Reel (TR) Cut Tape (CT) Digi-Reel® Hashtags #RP2040 #ARM #CortexM0Plus #DualCore #133MHz #Microcontroller #Embedded #RaspberryPi #56QFN #SurfaceMount #ExternalMemory #TapeAndReel #CutTape #DigiReel

The BOSCH BMM350 is a high-performance 3-axis magnetic sensor designed for a wide range of consumer applications, including magnetic compass functionality, virtual/augmented/mixed reality applications, high-end gaming, platform stabilization for image stabilization, and indoor navigation and dead-reckoning in robotics. Manufactured by Bosch Sensortec, this component leverages Tunnel Magneto Resistance (TMR) technology to provide precise magnetic-to-digital conversion. The BMM350 is housed in an ultra-small Wafer Level Chip Scale Package (WLCSP) measuring 1.28mm x 1.28mm x 0.5mm, making it ideally suited for mobile applications where space is at a premium. It features digital interfaces (I2C, I3C) for flexible system integration and operates across a wide voltage range from 1.72V to 3.6V. This sensor is designed to deliver high performance with an excellent temperature behavior characterized by low temperature coefficients for offset (TCO) and sensitivity (TCS), ensuring reliability and accuracy across its operational temperature range of -40°C to +85°C. Each device is tested and calibrated, ready for integration into a variety of applications, supported by an API for quick system development.

# Markdown syntax guide ## Headers # This is a Heading h1 ## This is a Heading h2 ###### This is a Heading h6 ## Emphasis *This text will be italic* _This will also be italic_ **This text will be bold** __This will also be bold__ _You **can** combine them_ ## Lists ### Unordered * Item 1 * Item 2 * Item 2a * Item 2b ### Ordered 1. Item 1 1. Item 2 1. Item 3 1. Item 3a 1. Item 3b ## Images  ## Links You may be using [Markdown Live Preview](https://markdownlivepreview.com/). ## Blockquotes > Markdown is a lightweight markup language with plain-text-formatting syntax, created in 2004 by John Gruber with Aaron Swartz. > >> Markdown is often used to format readme files, for writing messages in online discussion forums, and to create rich text using a plain text editor. ## Tables | Left columns | Right columns | | ------------- |:-------------:| | left foo | right foo | | left bar | right bar | | left baz | right baz | ## Blocks of code ``` let message = 'Hello world'; alert(message); ``` ## Inline code This web site is using `markedjs/marked`.

Bluetooth, WiFi 802.11b/g/n, Bluetooth v5.0 Transceiver Module 2.4GHz PCB Trace Surface Mount The ESP32-S3-WROOM-1-N8R8 is a high-performance Wi-Fi and Bluetooth Low Energy (BLE) module from Espressif Systems, designed for advanced IoT, edge AI, smart devices, industrial automation, and embedded applications. It is based on the ESP32-S3 SoC featuring a dual-core Xtensa® LX7 processor running up to 240 MHz, integrated wireless connectivity, and enhanced AI acceleration capabilities. The N8R8 variant includes 8 MB Flash memory and 8 MB Octal SPI PSRAM, making it suitable for memory-intensive applications such as machine learning, image processing, graphical user interfaces, and data logging. Key Features Dual-core 32-bit Xtensa LX7 CPU operating up to 240 MHz Integrated 2.4 GHz Wi-Fi (802.11 b/g/n) Bluetooth 5 LE (Low Energy) support 8 MB Flash memory 8 MB Octal SPI PSRAM Vector instructions and hardware acceleration for AI/ML workloads Integrated PCB trace antenna USB OTG and USB Serial/JTAG support Rich peripheral set including: GPIO ADC UART SPI I²C I²S PWM USB Operating voltage: 3.0 V to 3.6 V Wireless data rates up to 150 Mbps RF output power up to 20.5 dBm High receiver sensitivity down to –104.5 dBm Surface-mount 41-pin module package Industrial operating temperature range up to -40°C to +85°C (module-dependent specification) #Module #RF-Transceiver #Esp32

The ESP32-CAM Ai-Thinker is a compact, low-cost Wi-Fi and Bluetooth-enabled camera development module based on the ESP32-S dual-core microcontroller. It integrates an OV2640 2MP camera sensor, onboard Flash memory, PSRAM, and a MicroSD card slot, making it suitable for IoT vision applications, wireless surveillance, image capture, video streaming, face recognition, and smart home projects. The module combines wireless connectivity and image processing capabilities in a small form factor while maintaining low power consumption. Key Features ESP32-S Dual-Core Processor Tensilica Xtensa LX6 dual-core 32-bit CPU Operating frequency up to 240 MHz Computing performance up to 600 DMIPS Integrated Camera Equipped with OV2640 CMOS image sensor Maximum image resolution: 1600 × 1200 (UXGA, 2MP) Supports JPEG image compression and video streaming Memory 4 MB Flash memory External PSRAM for frame buffering and image processing 520 KB internal SRAM Wireless Connectivity 2.4 GHz Wi-Fi (802.11 b/g/n) Bluetooth 4.2 BR/EDR and BLE support Storage Built-in MicroSD/TF card slot Supports local storage of images, videos, and data logs Peripheral Interfaces UART SPI I²C PWM ADC DAC GPIO expansion pins Power Supply Operating voltage: 5 V Low-power operation with deep-sleep capability for battery-powered applications Compact Design Module size approximately 27 mm × 40.5 mm PCB antenna onboard Optional external antenna connection on some variants

Image Sensors AR0135CS2M00SUEA0-DRBR IBGA-63_L9.0-W9.0-P1.00_AR0135 LCSC Part Number: C606070 JLCPCB Part Class: Extended Part Manufactured by onsemi(安森美)

Image Sensors NOIP1SN1300A-QTI LCC-48_L14.2-W14.2-P1.00-L LCSC Part Number: C556457 JLCPCB Part Class: Extended Part Manufactured by onsemi(安森美)

Image Sensors AP0101AT2L00XPGA0-DR VFBGA-81_L6.5-W6.5-R9-C9-P0.65-TL LCSC Part Number: C512867 JLCPCB Part Class: Extended Part Manufactured by onsemi(安森美)

Image Sensors AR0135CS2M00SUEA0-DPBR IBGA-63_L9.0-W9.0-P1.00_AR0132AT6C00XPEA0-DRBR LCSC Part Number: C603157 JLCPCB Part Class: Extended Part Manufactured by onsemi(安森美)

Sensor Evaluation Boards RoHS The OV2640 Camera Board integrates the OV2640 2MP CameraChip™ sensor with onboard circuitry to simplify interfacing with microcontrollers. It captures images up to UXGA resolution (1622 × 1200 / 1632 × 1232 depending on configuration) and supports both raw and compressed output formats. The sensor also includes an internal image signal processor (ISP), allowing direct JPEG compression without external processing. This makes it especially suitable for low-cost embedded systems where bandwidth and MCU resources are limited. ⭐ Key Features 📸 Image Performance 2 Megapixel CMOS sensor (OV2640) Max resolution: UXGA (up to ~1600 × 1200 class) Frame rates (typical): UXGA / SXGA: up to ~15–30 fps (depending on mode) SVGA: up to 30 fps CIF: up to 60 fps 🎨 Output Formats Supports multiple image data formats: JPEG (hardware compressed) YUV 422 / 420 RGB565 / RGB555 YCbCr 4:2:2 8-bit raw / compressed output modes ⚡ Electrical Characteristics Supply voltage: 3.3V I/O voltage range: 1.7V – 3.3V Low-power CMOS design optimized for embedded devices

Image Sensors OV02735-H66A-1B CSP-66_L7.0-W6.0-R7-C11-P0.60-TL LCSC Part Number: C114922 JLCPCB Part Class: Extended Part Manufactured by OmniVision(豪威科技)