The W25Q02JVSFIM from Winbond Electronics is a 2G-bit (256M x 8) Serial NOR Flash Memory device designed for high-density non-volatile data storage applications. It supports high-speed SPI, Dual/Quad SPI, QPI, and DTR interfaces, providing fast data transfer and efficient memory access for embedded systems. The device operates from a 2.7V to 3.6V supply voltage and is available in a 16-pin SOIC surface-mount package. It is suitable for applications such as firmware storage, boot code memory, industrial controllers, IoT devices, automotive electronics, and embedded systems requiring large-capacity reliable flash memory. Key Features Memory Density: 2G-bit Serial NOR Flash (256M x 8) Flash Technology: Single-Level Cell (SLC) NOR Flash Interface Support: Standard SPI, Dual SPI, Quad SPI, QPI, and DTR modes High-Speed Clock Frequency: Up to 133 MHz operation Fast Access Time: Approximately 7.5 ns Supply Voltage Range: 2.7V to 3.6V Non-Volatile Data Storage: Retains stored data without power Memory Organization: 256M x 8-bit architecture Package Type: 16-pin SOIC (7.50 mm width) surface-mount package Operating Temperature Range: -40°C to +85°C Page Program Time: Approximately 3.5 ms Applications: Embedded firmware storage, BIOS/boot memory, industrial equipment, IoT devices, and consumer electronics Hashtags #W25Q02JVSFIM #Winbond #SerialFlashMemory #NORFlash #SPIFlash #QuadSPI #QPI #DTR #EmbeddedSystems #NonVolatileMemory #FlashMemory #FirmwareStorage #IoT #IndustrialElectronics #Semiconductor #MemoryIC

FLASH - NOR Memory IC 128Mb (16M x 8) SPI - Quad I/O, QPI, DTR 133 MHz 8-SOIC 128M-bit Serial Flash Memory with uniform 4KB sectors and Dual/Quad SPI Winbond W25Q128JV is a 128-Mbit (16 MB) serial NOR Flash memory device designed for code and data storage in embedded systems. It supports standard SPI, Dual SPI, Quad SPI (QSPI), and Dual/Quad Peripheral Interface (DPI/QPI) modes, enabling high-speed data transfer rates up to 133 MHz clock operation and up to 532 MB/s equivalent throughput in Quad I/O DTR mode. The device supports Execute-In-Place (XIP), allowing processors and microcontrollers to run code directly from external flash memory without copying it to RAM. Features include 4 KB sector erase, 32 KB and 64 KB block erase, page programming, hardware/software write protection, security registers, JEDEC identification, SFDP support, suspend/resume operations, and low-power standby modes. Suitable for microcontrollers, FPGA configuration storage, IoT devices, industrial controllers, networking equipment, consumer electronics, and embedded systems requiring reliable non-volatile memory. Search Keywords: W25Q128JV, Winbond flash memory, SPI NOR Flash, QSPI Flash, Quad SPI memory, Serial Flash memory, 128Mbit Flash, 16MB Flash memory, Execute In Place XIP, external MCU flash, ESP32 flash memory, FPGA configuration memory, NOR flash storage, W25Q128, Dual SPI Flash, Quad I/O Flash, embedded nonvolatile memory, serial flash IC Hashtags: #W25Q128JV #Winbond #NORFlash #SPIMemory #QSPI #SerialFlash #FlashMemory #EmbeddedSystems #Microcontroller #ESP32 #FPGA #NonVolatileMemory #XIP #IoT #ElectronicsDesign #MemoryIC #FirmwareStorage #QuadSPI #EmbeddedHardware #ElectronicComponents

SPI Flash Serial Flash Memory with Dual/Quad SPI The W25Q16JVUXIQ is a 16-Mbit (2-MByte) Serial NOR Flash memory device from Winbond. It is designed for embedded systems that require non-volatile code and data storage with minimal pin count, low power consumption, and high-speed access. The device supports standard SPI, Dual SPI, and Quad SPI interfaces, making it suitable for firmware storage, boot memory, IoT devices, microcontrollers, consumer electronics, and execute-in-place (XIP) applications. Key Features 16-Mbit (2-MByte) Flash Memory Capacity Operating Voltage: 2.7 V to 3.6 V Standard SPI, Dual SPI, and Quad SPI Interface Support Maximum SPI Clock Frequency: 133 MHz Equivalent Data Transfer Rates: 266 MHz (Dual SPI) 532 MHz (Quad SPI) Continuous Read and XIP (Execute-In-Place) Capability 4 KB Sector Erase, 32 KB Block Erase, 64 KB Block Erase, and Chip Erase 256-Byte Programmable Page Size Minimum 100,000 Program/Erase Cycles per Sector More Than 20 Years Data Retention Ultra-Low Power Consumption Typical power-down current below 1 µA 64-Bit Unique Serial Number Three 256-Byte Security Registers with OTP Protection JEDEC ID and SFDP Support Software and Hardware Write Protection Operating Temperature Options up to +85°C and +105°C Compact 8-Pad USON Package (2 mm × 3 mm) suitable for space-constrained designs #CommonPartsLibrary #IntegratedCircuit #Memory

SPI Flash Memory with Dual/Quad SPI The W25Q128JV (128M-bit) Serial Flash memory provides a storage solution for systems with limited space, pins and power. The 25Q series offers flexibility and performance well beyond ordinary Serial Flash devices. They are ideal for code shadowing to RAM, executing code directly from Dual/Quad SPI (XIP) and storing voice, text and data. The device operates on a single 2.7V to 3.6V power supply with current consumption as low as 1µA for power-down. All devices are offered in space-saving packages. The W25Q128JV array is organized into 65,536 programmable pages of 256-bytes each. Up to 256 bytes can be programmed at a time. Pages can be erased in groups of 16 (4KB sector erase), groups of 128 (32KB block erase), groups of 256 (64KB block erase) or the entire chip (chip erase). The W25Q128JV has 4,096 erasable sectors and 256 erasable blocks respectively. The small 4KB sectors allow for greater flexibility in applications that require data and parameter storage. (See Figure 2.) The W25Q128JV supports the standard Serial Peripheral Interface (SPI), Dual/Quad I/O SPI: Serial Clock, Chip Select, Serial Data I/O0 (DI), I/O1 (DO), I/O2 and I/O3. SPI clock frequencies of W25Q128JV of up to 133MHz are supported allowing equivalent clock rates of 266MHz (133MHz x 2) for Dual I/O and 532MHz (133MHz x 4) for Quad I/O when using the Fast Read Dual/Quad I/O. These transfer rates can outperform standard Asynchronous 8 and 16-bit Parallel Flash memories.  New Family of SpiFlash Memories – W25Q128JV: 128M-bit / 16M-byte – Standard SPI: CLK, /CS, DI, DO – Dual SPI: CLK, /CS, IO0, IO1 – Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3 – Software & Hardware Reset(1)  Highest Performance Serial Flash – 133MHz Single, Dual/Quad SPI clocks – 266/532MHz equivalent Dual/Quad SPI – 66MB/S continuous data transfer rate – Min. 100K Program-Erase cycles per sector – More than 20-year data retention  Efficient “Continuous Read” – Continuous Read with 8/16/32/64-Byte Wrap – As few as 8 clocks to address memory – Allows true XIP (execute in place) operation  Low Power, Wide Temperature Range – Single 2.7 to 3.6V supply – <1µA Power-down (typ.) – -40°C to +85°C operating range – -40°C to +105°C operating range Flexible Architecture with 4KB sectors – Uniform Sector/Block Erase (4K/32K/64K-Byte) – Program 1 to 256 byte per programmable page – Erase/Program Suspend & Resume  Advanced Security Features – Software and Hardware Write-Protect – Power Supply Lock-Down – Special OTP protection – Top/Bottom, Complement array protection – Individual Block/Sector array protection – 64-Bit Unique ID for each device – Discoverable Parameters (SFDP) Register – 3X256-Bytes Security Registers with OTP locks – Volatile & Non-volatile Status Register Bits  Space Efficient Packaging – 8-pin SOIC 208-mil – 16-pin SOIC 300-mil (additional /RESET pin) – 8-pad WSON 6x5-mm / 8x6-mm – 24-ball TFBGA 8x6-mm (6x4/5x5 ball array) – 24-ball WLCSP – Contact Winbond for KGD and other options #CommonPartsLibrary #IntegratedCircuit #Memory

NOR FLASH W25Q80BLSNIG SOP-8_L4.9-W3.9-P1.27-LS6.0-BL LCSC Part Number: C409017 JLCPCB Part Class: Extended Part Manufactured by Winbond Elec

W25Q32JWSSIQ TR SOIC-8_L5.3-W5.3-P1.27-LS7.9-BL LCSC Part Number: C2456252 JLCPCB Part Class: undefined Manufactured by WINBOND(华邦)

W25Q64JVSFIQ TR SOIC-16_L10.3-W7.5-P1.27-LS10.3-BL LCSC Part Number: C2456207 JLCPCB Part Class: undefined Manufactured by WINBOND(华邦)

W949D2DBJX5E VFBGA-90_L13.0-W8.0-R15-C6-P0.80-TL LCSC Part Number: C2641164 JLCPCB Part Class: undefined Manufactured by WINBOND(华邦)

W9751G6NB25I TR VFBGA-84_L12.5-W8.0-P0.80-TL_WINBOND_W9751G6NB LCSC Part Number: C2596032 JLCPCB Part Class: undefined Manufactured by WINBOND(华邦)

SDRAM W9725G6KB-25 WBGA-84_L12.5-W8.0-P0.80-TL_WINBOND_W9725G6KB LCSC Part Number: C571266 JLCPCB Part Class: undefined Manufactured by WINBOND(华邦)

W9725G6KB-25 TR WBGA-84_L12.5-W8.0-P0.80-TL_WINBOND_W9725G6KB LCSC Part Number: C2456216 JLCPCB Part Class: undefined Manufactured by WINBOND(华邦)

W29N01HVBINF VFBGA-63_L11.0-W9.0-P0.80-TL_WINBOND_W29N04GXBIBA LCSC Part Number: C2641201 JLCPCB Part Class: undefined Manufactured by WINBOND(华邦)

W25Q64JVTCIQ TFBGA-24_L8.0-W6.0-R4-C6-P1.00-BL LCSC Part Number: C2641171 JLCPCB Part Class: undefined Manufactured by WINBOND(华邦)

W25Q128JVBIQ TFBGA-24_L8.0-W6.0-P1.00-TL_WINBOND_W25Q128JVBXX LCSC Part Number: C2641218 JLCPCB Part Class: undefined Manufactured by WINBOND(华邦)

W94AD2KBJX5I VFBGA-90_L13.0-W8.0-R15-C6-P0.80-TL LCSC Part Number: C2641176 JLCPCB Part Class: undefined Manufactured by WINBOND(华邦)

W972GG6KB-18 WBGA-84_L12.5-W8.0-P0.80-TL_W972GG6KB LCSC Part Number: C2641278 JLCPCB Part Class: undefined Manufactured by WINBOND(华邦)

W9712G6KB-25 TFBGA-84_L12.5-W8.0-P0.80-TL_WINBOND_W9712G6KB LCSC Part Number: C2641157 JLCPCB Part Class: undefined Manufactured by WINBOND(华邦)

W9712G6KB25I TR TFBGA-84_L12.5-W8.0-P0.80-TL_WINBOND_W9712G6KB LCSC Part Number: C2456288 JLCPCB Part Class: undefined Manufactured by WINBOND(华邦)

W9425G6KH-5I TR TSOP-66_L22.2-W10.2-P0.65-LS11.8-BL LCSC Part Number: C2456263 JLCPCB Part Class: undefined Manufactured by WINBOND(华邦)

W631GG6MB-15 TR VFBGA-96_L13.0-W7.5-R16-C6-P0.80-TL_WINBOND_W631GG6MB LCSC Part Number: C2456213 JLCPCB Part Class: undefined Manufactured by WINBOND(华邦)

W631GG6MB15I TR VFBGA-96_L13.0-W7.5-P0.80-TL_WINBOND_W631GG6MBXXX LCSC Part Number: C2456247 JLCPCB Part Class: undefined Manufactured by WINBOND(华邦)

W631GG6MB-15 VFBGA-96_L13.0-W7.5-R16-C6-P0.80-TL_WINBOND_W631GG6MB LCSC Part Number: C2641161 JLCPCB Part Class: undefined Manufactured by WINBOND(华邦)

W632GG6NB-12 TR VFBGA-96_L13.0-W7.5-R16-C6-P0.80-TL_WINBOND_W631GG6MB LCSC Part Number: C2596694 JLCPCB Part Class: undefined Manufactured by WINBOND(华邦)

W631GG6MB12I TR VFBGA-96_L13.0-W7.5-P0.80-TL_WINBOND_W631GG6MBXXX LCSC Part Number: C2456248 JLCPCB Part Class: undefined Manufactured by WINBOND(华邦)

W632GG6NB15I TFBGA-96_L13.0-W7.5-R16-C6-P0.80-TL LCSC Part Number: C2641291 JLCPCB Part Class: undefined Manufactured by WINBOND(华邦)