Hirose DF17 Series, 0.5mm Pitch 20 Way 2 Row Straight PCB Header, Solder Termination, 0.3A 20 Position Connector Header, Outer Shroud Contacts Surface Mount Gold #CommonPartsLibrary #Connector #Rectangular-Connector #Array #Edge-Type #Mezzanine #DF17(4.0)

10 (8 + 2) Position Card Connector Secure Digital - microSD™ Surface Mount, Right Angle Gold microSD socket push push The DM3AT-SF-PEJM5 is a low-profile, surface-mount microSD card connector from Hirose Electric featuring a push-push insertion and ejection mechanism. Designed for compact and portable electronic devices, it supports standard microSD, microSDHC, and microSDXC cards. The connector provides reliable electrical contact through gold-plated copper alloy terminals and is rated for up to 10,000 insertion/removal cycles, ensuring long-term durability. With a right-angle SMT configuration, integrated card detection switch, and robust mechanical retention, this connector is well-suited for applications such as embedded systems, IoT devices, consumer electronics, and industrial equipment where space efficiency and dependable card interfacing are critical. Product Category: Memory Card Connectors Product Type: Card Connector Subcategory: Memory Connectors & Sockets Card Type: microSD Number of Contacts: 8 Number of Rows: 1 Pitch: 1.1 mm Mounting Type: PCB Mount Mounting Style: Standard Orientation: Right Angle Termination Style: SMD/SMT Insertion / Extraction Style: Push-Push Mating Cycles: 10,000 Current Rating: 500 mA Voltage Rating: 125 VAC Contact Material: Copper Contact Plating: Gold Housing Material: Liquid Crystal Polymer (LCP) Insulation Resistance: 1 GΩ Height: 1.68 mm Length: 13.85 mm Operating Temperature Range: -25°C to +85°C Color: Black Packaging Options: Reel, Cut Tape, MouseReel Factory Pack Quantity: 1500 RoHS Compliance: Yes Country of Origin: China Country of Assembly: China Country of Diffusion: China Unit Weight: 0.003527 oz #commonpartslibrary #connector #memory #cardsocket #microsd

20 Position Connector Header, Center Strip Contacts Surface Mount Gold DF30FC-20DP-0.4V(81) is a 20-position, 0.4 mm pitch, surface-mount (SMT) board-to-board mezzanine connector from the Hirose DF30 series. It is the plug/header (DP) side of the connector pair and is designed for ultra-low-profile, high-density PCB stacking applications commonly found in compact embedded systems, cameras, wireless modules, industrial electronics, and portable devices. The connector features gold-plated contacts for reliable electrical performance and supports a mating height of approximately 0.9 mm when paired with the corresponding receptacle. 20 contacts / positions 0.4 mm fine pitch for high-density designs Board-to-board (mezzanine) connector Surface-mount (SMT) mounting Ultra-low mating height (~0.9 mm) Gold-plated contacts for improved reliability Straight orientation Compact footprint for space-constrained applications Rated for approximately 50 mating cycles Operating temperature range: -35°C to +85°C RoHS compliant Typical Applications Embedded computing modules Camera and imaging systems Industrial control equipment IoT devices Portable electronics Wireless communication modules #Hirose #DF30Series #BoardToBoardConnector #MezzanineConnector #SMTConnector #HighDensityConnector #0p4mmPitch #EmbeddedSystems #IoT #ElectronicsDesign #PCBDesign #CompactElectronics #ConnectorSolutions

FFC,0.5mm Pitch,Bottom Contact,40way Hirose FH12 Series 0.5mm Pitch 40 Way 1 Row Right Angle SMT Female FPC Connector, Gold Plated Contacts

DF1132DS2DSA05 Hirose DF11 Series, 2mm Pitch 32 Way 2 Row Straight PCB Header, Solder Termination, 2A 6.5 798-DF11-32DS-2DSA05 Hirose DF11-32DS-2DSA(05)

70 Position Connector Receptacle, Center Strip Contacts Surface Mount Gold HIROSE

# DF40C-100DS-0.4V(51) ## General Description The DF40C-100DS-0.4V(51) is a high-density board-to-board mezzanine connector manufactured by Hirose Electric. It belongs to the DF40 series of ultra-fine pitch connectors designed for compact electronic systems requiring reliable signal transmission and high interconnection density. The connector features a precision contact system, low-profile construction, and surface-mount configuration, making it suitable for embedded systems, industrial electronics, communication equipment, medical devices, portable electronics, computing platforms, and advanced IoT products. Its robust mechanical design ensures secure mating, excellent signal integrity, and dependable long-term performance in applications where board space is limited and connection reliability is critical. ## Key Features ### Connector Architecture * Board-to-board mezzanine connector design * High-density interconnection capability * Fine-pitch contact arrangement * Precision mating structure * Low-profile configuration * Optimized for compact electronic assemblies ### Electrical Characteristics * Reliable signal transmission * Low contact resistance * Stable electrical performance * High signal integrity capability * Suitable for high-speed digital interfaces * Consistent connection reliability ### Mechanical Characteristics * Surface-mount mounting configuration * Precision alignment structure * Secure mating retention mechanism * Compact footprint design * High-density PCB integration support * Automated assembly compatible ### Contact System * High-reliability contact construction * Gold-plated contact surfaces * Corrosion-resistant interface * Enhanced mating durability * Reliable electrical continuity * Stable long-term performance ### Material Construction * High-strength thermoplastic housing * Precision metal contact system * RoHS-compliant materials * Lead-free compatible construction * Industrial-grade manufacturing quality ### Environmental Characteristics * Long operational service life * Suitable for industrial and commercial applications * Reliable performance under continuous operation * Resistant to mechanical stress and vibration * Stable operation across standard environmental conditions ### Application Areas * Embedded Computing Systems * Industrial Automation Equipment * Medical Electronics * Communication Devices * Portable Electronic Products * Human-Machine Interfaces * Consumer Electronics * Data Acquisition Systems * IoT Devices * Wireless Communication Modules * Control Systems * High-Density PCB Assemblies ### Compliance * RoHS Compliant * Lead-Free Compatible * High-Density Interconnect Solution ## Manufacturer Hirose Electric Co., Ltd. ## Product Family DF40 Series Board-to-Board Connectors #DF40C100DS04V51 #Hirose #DF40Series #BoardToBoardConnector #MezzanineConnector #HighDensityConnector #PCBConnector #EmbeddedSystems #IndustrialElectronics #CommunicationEquipment #MedicalElectronics #IoTDevices #ElectronicsEngineering #PCBDesign #SurfaceMountConnector

DF40C-90DS-0.4V https://www.hirose.com/product/en/download_file/key_name/DF40C-90DS-0.4V%2851%29/category/Drawing%20(2D)/doc_file_id/46856/?file_category_id=6&item_id=06844124851&is_series= HIROSE(HRS) - DF40C-90DS-0.4V(51) - CONNECTOR, STACKING, RCPT, 90POS, 2ROW Hirose DF40C-90DS-0.4V(51) 798-DF40C90DS0.4V51 https://www.mouser.co.uk/ProductDetail/Hirose-Connector/DF40C-90DS-04V51?qs=1RUxC5ic%2FMrFVUc5ctaeag%3D%3D

50 Position Connector Receptacle, Center Strip Contacts Surface Mount Gold The DF12C(3.0)-50DS-0.5V(81) is a high-density, board-to-board mezzanine connector from Hirose Electric’s DF12 series. It features a 0.5 mm pitch with 50 contacts in a dual-row configuration, designed for compact PCB layouts requiring reliable high-speed and high-signal-count interconnections. This connector is optimized for applications such as embedded systems, industrial electronics, communication devices, and portable equipment where space-saving and robust mating performance are critical. Manufacturer Information Manufacturer: Hirose Electric Co., Ltd. Series: DF12 Part Number: DF12C(3.0)-50DS-0.5V(81) Mechanical Specifications Connector Type: Board-to-Board (Mezzanine) Mounting Type: Surface Mount (SMT) Contact Configuration: Dual Row Number of Positions: 50 Pitch: 0.5 mm Stacking Height: 3.0 mm Mating Style: Receptacle (Socket) Contact Plating: Gold over Nickel Termination Style: Solder (SMT pads) Board Retention: None (standard SMT anchoring) Electrical Specifications Rated Current: 0.5 A per contact (typical) Rated Voltage: 50 V AC/DC Contact Resistance: ≤ 100 mΩ (initial) Insulation Resistance: ≥ 100 MΩ Withstanding Voltage: 250 V AC for 1 minute Material Specifications Insulator Material: LCP (Liquid Crystal Polymer), UL94V-0 rated Contact Material: Copper Alloy Plating: Gold plating on contact area, Tin on solder tails Environmental Specifications Operating Temperature Range: -35°C to +85°C Storage Temperature Range: -10°C to +60°C Humidity: Up to 85% RH (non-condensing) Packaging Information Packaging Type: Tape and Reel Reel Quantity: Typically 1,000–2,000 pcs per reel Applications Embedded systems Industrial control equipment Communication devices Portable electronics High-density PCB interconnections Compliance & Standards RoHS Compliant: Yes Halogen-Free: Yes UL Flammability Rating: UL94V-0 Mating Connector Compatible with DF12 series plug connectors with 3.0 mm stacking height and 0.5 mm pitch #commonpartslibrary #connector