Connector Header Through Hole 22 position 0.100" (2.54mm) Pin Header 02x22 2.54mm Vertical The 77313-118-22LF is a 2.54 mm pitch unshrouded vertical pin header connector from the Amphenol ICC (FCI) BergStik® series. It is designed for board-to-board and wire-to-board interconnections in embedded systems, industrial electronics, prototyping, and general PCB applications. The connector features a double-row, 22-position through-hole configuration with gold-plated phosphor bronze contacts for reliable electrical performance and durability. Key Features 22-position dual-row header 2.54 mm (0.100") pitch Vertical through-hole mounting Unshrouded male pin header BergStik® series Gold-plated contacts for improved conductivity and corrosion resistance Phosphor bronze contacts with thermoplastic housing Current rating: up to 3 A per contact Operating temperature: −65°C to +130°C UL94 V-0 flame-rated housing RoHS compliant Suitable for: MCU and development boards Mezzanine board stacking Ribbon cable interfaces General-purpose PCB interconnects #CommonPartsLibrary #Connector #Header

1 µF ±10% 16V Ceramic Capacitor X7R 0603 (1608 Metric) The CGA3E1X7R1C105K080AC is a multilayer ceramic chip capacitor designed for high-reliability electronic applications requiring stable capacitance characteristics, compact form factor, and dependable performance under varying operating conditions. The component utilizes advanced ceramic dielectric technology to provide consistent electrical behavior with low losses and high insulation resistance suitable for signal filtering, decoupling, bypassing, and general-purpose circuit stabilization. The capacitor is constructed with a multilayer monolithic structure that enables high capacitance density while maintaining excellent mechanical integrity and thermal stability. Its surface-mount configuration supports automated assembly processes and high-density printed circuit board layouts commonly used in industrial, automotive, telecommunications, and consumer electronic systems. The dielectric system is engineered to maintain capacitance stability across a broad temperature range and varying electrical conditions while minimizing impedance and noise within electronic circuits. The component exhibits reliable frequency response characteristics and supports efficient suppression of voltage fluctuations and electromagnetic interference in high-speed and high-frequency applications. External terminations are designed to provide strong solderability, mechanical durability, and resistance to thermal cycling stresses during assembly and operation. The component is compatible with standard reflow soldering processes and is intended for long-term operation in environments subject to temperature variation, vibration, and electrical loading. The CGA3E1X7R1C105K080AC is suitable for use in power management circuits, communication equipment, embedded control systems, automotive electronics, and other applications requiring compact passive components with stable electrical performance and high reliability. #CommonPartsLibrary #CeramicCapacitors

USB-C (USB TYPE-C) Receptacle Connector 24 (6+18 Dummy) - Power Only 6 Pin Position Surface Mount, Right Angle; Through Hole The 2479774-2 specification defines the engineering requirements for a high-density electronic connector assembly intended for board-to-cable or board-to-board interconnection in advanced electronic systems. This specification establishes the functional, mechanical, electrical, environmental, and quality requirements necessary to ensure reliable signal transmission, stable mechanical engagement, and long-term durability in demanding electronic applications. The component is intended for use in systems requiring compact interconnect solutions with high signal integrity and robust mechanical retention. It is suitable for applications such as industrial electronics, communication systems, embedded control units, and high-performance electronic assemblies where reliable connectivity and repeatable mating performance are required. Engineering Requirements The connector assembly shall be manufactured using precision-formed conductive materials and high-strength insulating housing materials to ensure stable electrical performance and mechanical reliability. The design shall support secure mating engagement and consistent signal continuity across repeated connection cycles. Electrical characteristics shall ensure low contact resistance, stable signal integrity, and reliable conductivity under defined operating conditions. The connector shall maintain performance under mechanical vibration, thermal variation, and environmental stress conditions typical of industrial and embedded system applications. Mechanical construction shall ensure accurate alignment between mating interfaces, secure locking engagement, and resistance to accidental disconnection. The design shall support repeated mating cycles without degradation of electrical or mechanical performance. Workmanship shall be free from defects such as contamination, deformation, plating irregularities, or structural inconsistencies that could impact reliability or functionality. Manufacturing and inspection shall be conducted under controlled quality systems using calibrated equipment to ensure compliance with engineering requirements. Any deviation from this specification shall require formal engineering review, documented justification, and approval through established engineering change control procedures prior to implementation. Documentation Supporting documentation shall include engineering drawings, connector datasheets, material declarations, inspection records, qualification test reports, and revision-controlled manufacturing documentation. All documentation shall be maintained under formal configuration management and quality assurance systems. Revision Control All changes to this specification shall be managed through formal engineering change control procedures. Each revision shall undergo technical evaluation, validation, and approval prior to release to ensure continued compliance with design intent and applicable standards. #EngineeringSpecification #Connector #HighDensityInterconnect #ElectronicComponents #SignalIntegrity #EmbeddedSystems #IndustrialElectronics #Manufacturing #QualityAssurance #EngineeringDocumentation

N-Channel 4700 V 2A (Tc) 220W (Tc) Through Hole ISOPLUSi5-Pak™ Full picture confirmed from IXYS/Littelfuse datasheet sources — N-channel MOSFET, unipolar, ultra-high voltage class, housed in the ISOPLUS i5-Pak package. Here's the complete spec. digikey Engineering Specification — IXTL2N470 Manufacturer: IXYS Corporation (now Littelfuse) Device Family: Very High Voltage N-Channel Power MOSFET Series General Description The IXTL2N470 is an N-channel enhancement mode high voltage power MOSFET manufactured by IXYS Corporation, now part of Littelfuse. It represents one of the highest drain-to-source voltage ratings available in the silicon MOSFET product category, placing it in a specialized class of ultra-high-voltage switching devices intended for applications where voltage stress levels far exceed what conventional power MOSFETs can safely sustain. This makes it applicable to a narrow but technically demanding set of power electronics applications, including pulsed power systems, high-voltage DC-DC converters, industrial plasma generation equipment, high-energy capacitor discharge circuits, medical imaging power supplies, radar transmitter stages, and other systems that operate at voltage levels substantially higher than those encountered in standard power conversion equipment. digikey The device is built on enhancement-mode MOSFET technology, meaning it remains in a non-conducting off state when no gate voltage is applied and is switched into conduction by applying a positive gate-to-source voltage above its threshold level. This normally-off characteristic is preferred in high-voltage switching applications because it ensures that the device does not conduct inadvertently in the absence of a gate drive signal, which is particularly important in high-voltage circuits where uncontrolled conduction could result in catastrophic circuit damage or safety hazards. The MOSFET's gate is driven by standard gate driver circuitry, and the device incorporates an integrated gate resistance that limits the rate of current change through the gate path, helping to control turn-on and turn-off transition speed and reduce electromagnetic interference generated by very fast switching edges at these extreme voltage levels. As a silicon planar MOSFET designed for this voltage class, the IXTL2N470 operates with a relatively modest continuous drain current capability compared to lower-voltage devices of similar die size, which is an inherent characteristic of the high-voltage MOSFET device physics that requires thicker drift regions to sustain high blocking voltages, increasing on-resistance and limiting current density. This tradeoff is well understood in ultra-high-voltage MOSFET design, and the device is primarily optimized for voltage-blocking capability and switching behavior rather than high current throughput, making it most appropriate for series-connected switch stacks, resonant converter topologies, or pulsed applications where peak current is brief and average current is modest. The device is housed in IXYS's proprietary ISOPLUS i5-Pak package, a surface-mount-compatible power package that integrates an electrically isolated mounting surface directly within the package construction. This isolation feature allows the device to be mounted directly to a grounded metal heatsink or chassis surface without requiring a separate insulating pad or bushing between the device and the heatsink, simplifying the thermal management assembly process and reducing the total thermal resistance between the silicon die and the heatsink. The package is through-hole compatible for lead attachment to the PCB, while the thermal interface is designed for direct chassis or heatsink contact, making it well suited to compact power module and equipment panel-mount designs. Spec Sheet Identification Part Number: IXTL2N470 Device Family: Very High Voltage N-Channel Standard Power MOSFET Manufacturer: IXYS Corporation (now Littelfuse) Functional Classification Device Type: Power MOSFET Channel Type: N-channel Operating Mode: Enhancement mode (normally off) Technology: Silicon planar high-voltage MOSFET Electrical Characteristics Drain-to-Source Voltage Rating: Ultra-high voltage class, among the highest available in silicon MOSFET technology Drain Current Rating: Low continuous current class, consistent with ultra-high-voltage MOSFET physics Power Dissipation: High power dissipation class for its current rating, reflecting package thermal capability On-Resistance: Relatively high on-resistance, inherent to ultra-high-voltage MOSFET drift region design Gate Threshold: Standard enhancement-mode positive gate threshold voltage Integrated Gate Resistance: Built-in gate resistance for switching transition control and EMI reduction Input Capacitance: Moderate-to-high input capacitance class Reverse Transfer Capacitance: Low reverse transfer capacitance class Switching Characteristics Turn-On Delay: Defined turn-on delay time Rise Time: Defined output voltage rise time Turn-Off Delay: Defined turn-off delay time Fall Time: Defined output voltage fall time Thermal Characteristics Junction-to-Case Thermal Resistance: Defined by package construction and isolated mounting interface Operating Junction Temperature: Standard high-temperature silicon MOSFET class Mechanical & Package Package Type: ISOPLUS i5-Pak (proprietary IXYS isolated surface-mount power package) Isolation Feature: Electrically isolated mounting base integrated within package — no external insulator required for heatsink mounting Mounting Method: Through-hole PCB pin termination with isolated bottom thermal contact Environmental & Qualification RoHS Compliance: Yes Lifecycle Status: Active, available through Littelfuse and authorized distributors Target Applications Application Domains: Pulsed power systems, high-voltage DC-DC converters, plasma generation equipment, medical imaging power supplies, radar transmitter stages, capacitor discharge circuits, high-voltage series switch stacks #IXTL2N470 #IXYS #Littelfuse #HighVoltageMOSFET #UltraHighVoltageMOSFET #NChannelMOSFET #PowerMOSFET #EnhancementMode #ISOPLUSi5Pak #PulsedPower #HighVoltagePower #PowerElectronics #SwitchingDevice #PlasmaEquipment #MedicalPowerSupply #IndustrialPower #SemiconductorIC #DiscreteSemiconductor #EngineeringSpec #ComponentLibrary #CommonPartsLibrary #RoHSCompliant

ARM® Cortex®-M0+ MSPM0 C Microcontroller IC 32-Bit 24MHz 16KB (16K x 8) FLASH 8-DSBGA (0.86x1.6) MSPM0C110x microcontrollers (MCUs) are part of the MSP highly-integrated ultra-low-power 32-bit MCU family based on the enhanced Arm® Cortex®-M0+ core platform operating at up to 24MHz frequency. These costoptimized MCUs offer high-performance analog peripheral integration, support extended temperature ranges from -40°C to 125°C, and operate with supply voltages from 1.62V to 3.6V. The MSPM0C110x devices provide up to 16KB embedded flash program memory with 1KB SRAM. These MCUs incorporate a high-speed on-chip oscillator with an accuracy from -2% to +1.2%, eliminating the need for an external crystal. Additional features include a 1-channel DMA, CRC-16 accelerator, and a variety of highperformance analog peripherals such as one 12-bit 1.5Msps ADC with VDD as the voltage reference, and an on-chip temperature sensor. These devices also offer intelligent digital peripherals such as one 16-bit advanced timer, two 16-bit general purpose timer, one windowed watchdog timer, and a variety of communication peripherals including one UART, one SPI, and one I2C. These communication peripherals offer protocol support for LIN, IrDA, DALI, Manchester, smart card, SMBus, and PMBus. The TI MSPM0 family of low-power MCUs consists of devices with varying degrees of analog and digital integration let customers find the MCU that meets their project needs. The architecture combined with extensive low-power modes is optimized to achieve extended battery life in portable measurement applications. MSPM0C110x MCUs are supported by an extensive hardware and software ecosystem with reference designs and code examples to get the design started quickly. Development kits include a LaunchPad™ kit available for purchase and design files for a target-socket board. TI also provides a free MSP Software Development Kit (SDK), which is available as a component of Code Composer Studio™ IDE desktop and cloud version within the TI Resource Explorer. MSPM0 MCUs are also supported by extensive online collateral, training with MSP Academy, and online support through the TI E2E™ support forums. Features • Core – Arm® 32-bit Cortex®-M0+ CPU, frequency up to 24MHz • Operating characteristics – Extended temperature: –40°C to 125°C – Wide supply voltage range: 1.62V to 3.6V • Memories – Up to 16KB of flash – 1KB of SRAM • High-performance analog peripherals – One analog-to-digital converter (ADC) with up to 10 total external channels, 1.7Msps at 10 bit or 1.5Msps at 12 bit with VDD as the voltage reference – Configurable 1.4V or 2.5V internal ADC voltage reference (VREF) – Integrated temperature sensor – Integrated supply monitor • Optimized low-power modes – RUN: 87µA/MHz – STOP: 609µA at 4MHz, 311µA at 32kHz – STANDBY: 5µA with SRAM retention – SHUTDOWN: 200nA • Intelligent digital peripherals – 1-channel DMA controller dedicated for ADC – Three timers supporting up to 14 PWM channels • One 16-bit advanced timers with deadband support up to 8 PWM channels • One 16-bit general purpose timer with 4 capture/compares • One 16-bit general purpose timer with 2 capture/compares – Windowed watchdog timer – BEEPER generating 1kHz, 2kHz, 4kHz, or 8kHz square wave to drive the external beeper • Enhanced communication interfaces – One UART interface supporting LIN, IrDA, DALI, smart card, Manchester and low-power operation in STANDBY mode – One I2C interface supporting FM+ (1Mbps), SMBus, PMBus, and wakeup from STOP mode – One SPI supporting up to 12Mbps • Clock system – Internal 24MHz oscillator with an accuracy from -2% to +1.2% (SYSOSC) – Internal 32kHz low-frequency oscillator (LFOSC) • Data integrity – Cyclic redundancy checker (CRC-16) • Flexible I/O features – Up to 18 GPIOs – Two 5V-tolerant open-drain IOs • Development support – 2-pin serial wire debug (SWD) • Package options – 20-pin TSSOP (PW) – 20-pin VSSOP (DGS) – 20-pin WQFN (RUK) – 16-pin SOT (DYY) – 8-pin SOT (DDF) – 8-pin WSON (DSG) – 8-pin DSBGA (YCJ) • Family members (also see Device Comparison) – MSPS003F4: 16KB of flash, 1KB of RAM – MSPS003F3: 8KB of flash, 1KB of RAM – MSPM0C1104: 16KB of flash, 1KB of RAM – MSPM0C1103: 8KB of flash, 1KB of RAM • Development kits and software (also see Tools and Software) – LP-MSPM0C1104 LaunchPad™ development kit – MSP Software Development Kit (SDK) 2 Applications • Battery charging and management • Power supplies and power delivery • Personal electronics • Building security and fire safety • Connected peripherals and printers • Grid infrastructure • Smart metering • Communication modules • Medical and healthcare • Lighting #MSPM0C1104S8YCJR #MSPM0C1104 #TexasInstruments #CortexM0Plus #Microcontroller #EmbeddedSystems #LowPowerMCU #IoT #WearableDevices #IndustrialControl #ConsumerElectronics #ADC #UART #SPI #I2C #PWM #TI #ElectronicsDesign #PCBDesign #EmbeddedDevelopment

Temperature Sensor Digital, Local -40°C ~ 125°C 16 b 4-PICOSTAR (0.76x0.76) The TMP114NCIYMTR is a high-accuracy digital temperature sensor designed for precision thermal monitoring applications in industrial, automotive, medical, and embedded electronic systems. The device integrates a precision band-gap temperature sensing element, analog-to-digital conversion circuitry, EEPROM memory, and a digital communication interface within a compact low-power package. The sensor supports accurate local temperature measurements with factory calibration and programmable alert functionality, enabling reliable thermal protection and environmental monitoring in space-constrained designs. Engineering Specification Manufacturer: Texas Instruments Manufacturer Part Number: TMP114NCIYMTR Device Type: Digital Temperature Sensor Temperature Measurement Method: Local Semiconductor Temperature Sensing Interface Type: I²C-Compatible Serial Interface Supply Voltage Range: Ultra-Low Voltage Operation Compatible with Battery-Powered Systems Temperature Measurement Range: Industrial Temperature Range Support Accuracy: High-Precision Factory-Calibrated Temperature Measurement Resolution: High-Resolution Digital Temperature Output Conversion Architecture: Integrated Sigma-Delta Analog-to-Digital Conversion Programmable Features: High and low temperature alert thresholds EEPROM-stored configuration settings Programmable conversion rate Offset correction calibration Alert and interrupt functionality Power Consumption: Optimized for Low-Power Embedded Applications Communication Speed: Standard and Fast-Mode I²C Support Package Type: Small Outline Leadless Package Mounting Type: Surface Mount Technology Operating Environment: Suitable for Industrial and Embedded Control Systems Protection Features: Integrated thermal monitoring alerts Nonvolatile configuration retention Robust digital communication interface Applications: Industrial temperature monitoring Medical instrumentation Battery-powered electronics Thermal management systems Precision embedded sensing Data acquisition equipment Environmental monitoring devices #commonpartslibrary #integratedcircuit #temperaturesensor #digital

ARM® Cortex®-M0+ STM32U0 Microcontroller IC 32-Bit 56MHz 256KB (256K x 8) FLASH 48-LQFP (7x7) # STM32U083CCT6 ## General Description The STM32U083CCT6 is an ultra-low-power microcontroller from STMicroelectronics based on the Arm Cortex-M0+ core. It is specifically designed for energy-efficient embedded applications requiring long battery life, advanced peripheral integration, secure operation, and reliable real-time performance. The device combines low-power processing, embedded Flash memory, SRAM, analog peripherals, communication interfaces, and hardware security features within a compact package. Its architecture makes it ideal for smart sensors, industrial monitoring systems, medical devices, wearable electronics, smart metering, home automation products, and Internet of Things applications where power efficiency is a primary design requirement. ## Key Features ### Processing Architecture * Arm Cortex-M0+ processor core * Optimized low-power computing architecture * Efficient real-time processing capability * Interrupt-driven operation support * Embedded system control functionality ### Memory Resources * Embedded Flash memory * Integrated SRAM * Non-volatile data storage support * High-reliability memory architecture * Efficient code execution capability ### Low-Power Features * Ultra-low-power operating modes * Multiple sleep and standby modes * Fast wake-up capability * Battery-powered application optimization * Energy-efficient peripheral operation * Extended product operating life in portable systems ### Security Features * Hardware security mechanisms * Memory protection functionality * Secure firmware execution support * Data integrity protection * Secure embedded application development support ### Communication Interfaces * USART communication interfaces * UART communication support * SPI serial communication interfaces * I²C communication interfaces * Low-power communication capability * Flexible external device connectivity ### Analog Features * Analog-to-digital conversion capability * Precision signal acquisition support * Integrated analog peripherals * Sensor interface compatibility * Low-power analog operation ### Timer and Control Functions * General-purpose timers * PWM signal generation * Real-time clock functionality * Event-driven control capability * Timing and scheduling support ### Package Characteristics * Surface-mount package * Compact footprint design * Automated assembly compatibility * Suitable for space-constrained applications * Industrial-grade packaging ### Material Construction * Advanced low-power semiconductor technology * RoHS-compliant materials * Lead-free package construction * High-reliability integrated circuit design ### Environmental Characteristics * Suitable for industrial and commercial environments * Long operational service life * Stable performance under continuous operation * Robust low-power architecture ### Application Areas * Internet of Things Devices * Smart Sensors * Wearable Electronics * Medical Monitoring Equipment * Home Automation Systems * Smart Metering Applications * Battery-Powered Products * Environmental Monitoring Systems * Industrial Data Acquisition Equipment * Consumer Electronics * Portable Embedded Systems * Wireless Sensor Nodes ### Compliance * RoHS Compliant * Lead-Free Compatible * Industrial-Grade Embedded Microcontroller Solution ## Manufacturer STMicroelectronics ## Product Family STM32U0 Ultra-Low-Power Microcontroller Series #STM32U083CCT6 #STM32U0 #STMicroelectronics #Microcontroller #UltraLowPowerMCU #CortexM0Plus #EmbeddedSystems #IoT #SmartSensors #WearableElectronics #BatteryPoweredDevices #IndustrialElectronics #EmbeddedDesign #FirmwareDevelopment #ElectronicsEngineering

0.2 mOhms ±1% 9W Chip Resistor Nonstandard Anti-Sulfur, Automotive AEC-Q200, Current Sense, Moisture Resistant, Pulse Withstanding Metal Element The WSLP3921L2000FEA is a power metal strip current sense resistor manufactured by Vishay Dale, designed specifically for precision current measurement applications in power electronics circuits. It belongs to the WSL/WSLP family, a line of low-resistance, high-power surface-mount resistors built using a metal strip element rather than conventional thick-film or thin-film resistive technology, giving it characteristics that are particularly well suited to current sensing rather than general-purpose resistive applications. The defining characteristic of this component is its very low resistance value, which allows it to be placed in series with a current path while introducing minimal voltage drop and power loss, while still producing a measurable voltage signal proportional to the current flowing through it. This voltage signal can then be read by current-sense amplifiers, comparators, or analog-to-digital converters to provide accurate real-time current feedback for power supply regulation, overcurrent protection, battery management, motor control, and similar applications where knowing the instantaneous current is essential to safe and efficient operation. The metal strip construction used in this series offers a low temperature coefficient of resistance compared to thick-film alternatives, meaning the resistor's value remains more stable across varying operating temperatures, which directly improves the accuracy of current measurements taken over a wide thermal range. The element is also engineered for low thermal EMF and minimal self-inductance, both of which are important for maintaining measurement fidelity in fast-switching power conversion circuits where parasitic effects can otherwise distort the sensed signal. This particular part is qualified to automotive component reliability standards, reflecting its suitability for use in vehicle electrical systems, battery packs, and other safety- or reliability-critical power applications where component robustness under thermal cycling, vibration, and long-term stress must be assured. The device also features moisture-resistant and pulse-withstanding construction, along with a nonstandard anti-sulfuration design intended to resist corrosion-related resistance drift that can occur in resistors exposed to sulfur-containing environmental contaminants over time, a known failure mode in some conventional thick-film resistor technologies. The component is housed in a surface-mount package and is supplied on tape-and-reel packaging suitable for automated assembly, with construction compliant to RoHS material restrictions. Spec Sheet Identification Part Number: WSLP3921L2000FEA Series: WSLP Manufacturer: Vishay Dale Functional Classification Device Type: Current sense resistor Construction: Power metal strip element Application Role: Series current-sensing element for analog current measurement Electrical Characteristics Resistance Value: Ultra-low resistance class, optimized for current sensing Resistance Tolerance: Tight tolerance class for measurement accuracy Power Rating: High power dissipation class for its footprint Temperature Coefficient of Resistance: Low TCR for stable measurement across temperature Thermal EMF: Low thermal EMF construction Self-Inductance: Low parasitic inductance, suited to fast-switching circuits Reliability & Environmental Features Anti-Sulfuration: Nonstandard anti-sulfur construction for corrosion resistance Moisture Resistance: Moisture-resistant build Pulse Withstanding: Rated for pulse-load withstanding capability Automotive Qualification: AEC-Q200 qualified RoHS Compliance: Yes Mechanical Specifications Case Size Class: 3921 surface-mount footprint Mounting Method: Surface mount technology (SMT) Terminal Construction: Metal strip element with welded or clad terminations per series design Packaging Packaging Format: Tape-and-reel Packaging Code Meaning: Suffix denotes lead-free, standard reel quantity packaging #WSLP3921 #VishayDale #Vishay #CurrentSenseResistor #MetalStripResistor #PowerResistor #ShuntResistor #AECQ200 #CurrentSensing #PowerElectronics #SMTResistor #BatteryManagement #MotorControl #OvercurrentProtection #ResistorDatasheet #EngineeringSpec #ComponentLibrary #CommonPartsLibrary #RoHSCompliant #PassiveComponent

2 Position Terminal Block Header, Male Pins, Shrouded (4 Side) 0.300" (7.62mm) 90°, Right Angle Through Hole The 1728853 is a PCB-mounted terminal block header from Phoenix Contact, part of the COMBICON GMSTBA series. It is designed for secure and reliable wire-to-board connections in industrial and electronic applications. This component is a 2-position pluggable terminal block header with male pins, typically used together with a mating plug connector to allow easy wiring and maintenance. It is mounted on a PCB using through-hole soldering and features a right-angle orientation for compact layouts. Key Features Connector Type: PCB terminal block header (male pins) Number of Positions: 2 pins (single row) Pitch: 7.62 mm (0.300") Mounting Type: Through-hole (wave soldering) Orientation: Right-angle (90°) Rated Current: up to 16 A Rated Voltage: up to 630 V (IEC) Contact Material/Finish: Tin-plated contacts Housing Material: Polyamide (PA), green color Flammability Rating: UL94 V-0 Connection System: Pluggable (mates with compatible COMBICON plugs) Typical Applications Industrial control systems Power distribution boards Embedded and automation electronics Devices requiring detachable wiring connections

Isolated Module DC DC Converter 1 Output 5.1V 6A 9V - 36V Input The TEN 30WIN series is a family of high performance 30W DC/DC converter modules featuring ultra wide 4:1 input voltage ranges in a compact low profile case with industry-standard footprint. Standard features include remote On/Off, output voltage trimming, over voltage protection, under voltage lockout, over temperature and short circuit protection. Typical applications for these products are battery operated equipment and distributed power architectures in communication and industrial electronics, everywhere where isolated, tightly regulated voltages are required and space is limited on the PCB. • 2“ x 1“ x 0.4“ shielded metal package • Ultra wide 4:1 input voltage range • Single- dual- and triple output models • Very high efficiency up to 91 % • Operating temperature range –40 °C to +75 °C • Over temperature protection • I/O isolation 1600 VDC • Remote On/Off • Adjustable output voltage #TRACOPower #TEN302411WIN #DCDCConverter #IsolatedPowerSupply #PowerModule #IndustrialElectronics #EmbeddedSystems #TelecomPower #BatteryPoweredDevices #PowerManagement #ElectronicsDesign #PCBDesign #DCDCModule #WideInputRange #IndustrialAutomation

Connector Header Through Hole 26 position 0.100" (2.54mm) The 827881-1 is a TE Connectivity board-to-board / wire-to-board connector component (AMP series header/socket depending on configuration) designed for reliable electrical interconnection in compact electronic assemblies. It is commonly used in industrial, automotive, and consumer electronic applications where stable signal or power transmission between PCBs or wiring harnesses is required. Key Features Manufacturer: TE Connectivity (AMP) Connector Type: PCB header / receptacle (depends on mating part) Contact Arrangement: Multi-position (varies by variant) Mounting Style: Through-hole or board mount (variant dependent) Contact Material: High-reliability copper alloy with plating for corrosion resistance Current Rating: Suitable for signal-level and moderate power applications (varies by configuration) Voltage Rating: Designed for standard low-voltage electronic systems Durability: High mating cycle life for repeated connections Polarization: Mechanical keying to prevent mismating Locking Feature: Secure retention for vibration resistance Application Areas: Industrial control boards Automotive electronics Communication modules Embedded systems and PCB interconnects #CommonPartsLibrary #Connector

Charger IC Multi-Chemistry 32-QFN (4x4) The BQ25730RSNR is a highly integrated synchronous buck battery charger and system power management IC developed by Texas Instruments for applications requiring efficient charging of multi-cell lithium-ion and lithium-polymer batteries. The device is optimized for USB Type-C, USB Power Delivery, industrial, and portable embedded systems where high charging efficiency, flexible power management, and compact implementation are required. The charger integrates high-side and low-side MOSFET gate drivers along with advanced power path management features, enabling efficient battery charging while simultaneously powering the system load. The architecture supports NVDC power path operation, allowing stable system voltage regulation even when the battery is deeply discharged or absent. The device supports a wide operating input voltage range and programmable charging parameters suitable for various battery chemistries and capacities. Integrated input current optimization and dynamic power management help maximize available adapter power while preventing overload conditions. The BQ25730RSNR communicates with the host processor through an I²C interface, enabling software configuration, telemetry monitoring, and fault management. Internal ADC functionality provides real-time monitoring of charging voltage, current, temperature, and system operating conditions. Its high integration level reduces external component count and PCB area, making it suitable for compact industrial and portable power applications. Electrical Characteristics Wide input voltage operating range compatible with USB PD adapters and industrial power sources. Supports multi-cell lithium-ion and lithium-polymer battery charging configurations. High-efficiency synchronous buck charging architecture. Programmable charge current and charge voltage through digital control interface. Integrated ADC for system telemetry and power monitoring. Dynamic power management optimizes adapter utilization and system stability. Low standby current operation for battery-powered systems. Charging Features Constant current and constant voltage charging modes. Programmable input current limiting for USB and adapter compliance. Battery preconditioning and charge termination functionality. Support for fast charging operation with thermal regulation. Power path management enables simultaneous battery charging and system operation. Automatic recharge and battery maintenance functionality. Protection Features Input overvoltage protection. Battery overvoltage and overcurrent protection. Thermal regulation and thermal shutdown protection. Short-circuit and fault condition protection. Battery temperature monitoring support using external NTC thermistors. Reverse current protection and adapter isolation. Interface and Control I²C serial communication interface for configuration and monitoring. Programmable charging profiles and operating parameters. Interrupt and status reporting capabilities. Integrated telemetry reporting for voltage, current, and temperature measurements. Autonomous operation capability with minimal host intervention. Package Information Package type is WQFN. Compact thermally enhanced surface-mount package. Optimized for automated PCB assembly and high-density layouts. Applications USB Type-C and USB Power Delivery systems. Industrial portable electronics. Embedded computing platforms. Portable medical and instrumentation equipment. Battery-powered industrial controllers. Handheld terminals and data acquisition systems. Portable consumer and commercial electronics. #commonpartslibrary #integratedcircuit #powermanagement #batterycharger

1.5A, 2.5A Gate Driver Magnetic Coupling 5000Vrms 2 Channel 16-SSOP # TPSI3100QDVXRQ1 ## General Description The TPSI3100QDVXRQ1 is an automotive-qualified isolated switch driver manufactured by Texas Instruments and specifically designed for driving solid-state relay architectures based on silicon carbide and gallium nitride power devices. The device integrates an isolated power supply and gate-driver functionality into a compact solution, eliminating the need for external isolated bias supplies in many applications. Its advanced architecture enables reliable control of high-voltage switching systems while providing reinforced isolation, fast switching performance, and enhanced system efficiency. The component is optimized for automotive, industrial automation, energy storage, renewable energy, electric vehicle infrastructure, and high-voltage power conversion applications requiring robust isolation and dependable switching control. ## Key Features ### Isolation Architecture * Integrated isolated switch driver solution * Reinforced isolation technology * High-voltage system compatibility * Enhanced safety and system protection * Reliable signal transfer across isolation barriers * Reduced external component requirements ### Driver Characteristics * Optimized gate-drive functionality * Fast switching performance * Efficient control of solid-state switching devices * Stable drive capability * Low-power control operation * High reliability switching support ### Power Management Features * Integrated isolated power supply * Simplified system architecture * Reduced design complexity * Improved power conversion efficiency * Lower overall component count * Optimized power consumption ### Protection Features * Enhanced electrical isolation * Improved system safety * Reliable operation in high-voltage environments * Robust transient immunity * Stable operation during fault conditions * Protection against electrical stress ### Electrical Characteristics * High-speed switching capability * Low standby power requirements * Reliable signal integrity * Stable operation across operating conditions * Suitable for demanding power electronics applications ### Package Characteristics * Compact surface-mount package * High-density PCB layout support * Automated assembly compatible * Industrial and automotive system integration * Space-efficient implementation ### Material Construction * Advanced semiconductor technology * Automotive-grade manufacturing quality * RoHS-compliant materials * Lead-free package construction * High-reliability integrated circuit architecture ### Environmental Characteristics * Automotive-qualified reliability * Suitable for harsh operating environments * Long operational service life * Stable thermal performance * Reliable continuous-duty operation ### Application Areas * Solid-State Relays * Automotive Electronics * Electric Vehicle Systems * Battery Energy Storage Systems * Renewable Energy Equipment * Industrial Automation Systems * High-Voltage Power Conversion * Motor Drive Systems * Charging Infrastructure * Power Distribution Equipment * Industrial Power Supplies * Advanced Power Electronics ### Compliance * Automotive Qualified * RoHS Compliant * Lead-Free Compatible * Industrial and Automotive Grade Isolated Driver Solution ## Manufacturer Texas Instruments ## Product Family TPSI Isolated Switch Driver Series #TPSI3100QDVXRQ1 #TexasInstruments #IsolatedDriver #SolidStateRelay #GateDriver #AutomotiveElectronics #PowerElectronics #SiliconCarbide #GalliumNitride #IndustrialAutomation #EnergyStorage #ElectricVehicles #PowerConversion #EmbeddedSystems #ElectronicsEngineering

Headers & Wire Housings PICOFLEX 10P HDR LOPRO SN Connector Header Through Hole 10 position 0.050" (1.27mm) The 0903250010 is a 10-position vertical through-hole header connector from the Picoflex PF-50 series by Molex. It features a 1.27 mm pitch, straight orientation, and is designed for reliable board-to-cable interconnections in compact electronic equipment. The connector is commonly used with Picoflex ribbon cable assemblies in industrial, consumer, telecommunications, and embedded electronic applications. It provides a space-saving solution while maintaining dependable electrical and mechanical performance. Key Features 10 contacts (single-row configuration) 1.27 mm (0.050") contact pitch Vertical (straight) through-hole mounting Male header design Compatible with Molex Picoflex cable connectors Current rating up to 1.2 A per contact Voltage rating up to 250 V Operating temperature range: -40°C to +105°C Low contact resistance (15 mΩ max) High insulation resistance (1000 MΩ min) RoHS compliant Compact footprint for high-density PCB designs Suitable for signal and low-power applications #CommonPartsLibrary #0903250010 #Molex #Picoflex #Connector #HeaderConnector #ThroughHole #PCBConnector #BoardToCable #Interconnect #Electronics #EmbeddedSystems #IndustrialElectronics #RibbonCable #1_27mmPitch #ElectronicComponents

Fuse Holder 20 A 250V 1 Circuit Cartridge Through Hole The 696309001002 is a vertical PCB terminal block connector manufactured by Wurth Elektronik. It is designed for reliable wire-to-board connections in industrial control, power distribution, embedded electronics, and automation systems. The connector features a compact through-hole design with screw clamp wire termination for secure electrical and mechanical contact. Its modular construction supports easy field wiring and dependable long-term operation in demanding environments. Engineering Specification Manufacturer: Wurth Elektronik Manufacturer Part Number: 696309001002 Product Type: PCB Terminal Block Connector Style: Wire-to-Board Mounting Type: Through Hole Orientation: Vertical Number of Positions: 2 Pitch: 5.00 mm Wire Termination Method: Screw Clamp Wire Entry Direction: Top Entry Contact Material: Copper Alloy Contact Plating: Tin Housing Material: High Temperature Thermoplastic Housing Color: Green Rated Voltage: 300 V Rated Current: 16 A Supported Wire Gauge: 24 AWG to 12 AWG Operating Temperature Range: -40°C to +105°C Flammability Rating: UL94 V-0 RoHS Compliance: Yes Applications: Industrial controls, power interfaces, embedded systems, automation equipment, power supply connections, signal and low-voltage wiring systems. #commonpartslibrary #circuitprotection #fuseholder

8 Position FFC, FPC Connector Contacts, Bottom 0.039" (1.00mm) Surface Mount, Right Angle The Molex Easy-On connector is a compact surface-mount FPC/FFC interconnect solution designed for reliable board-to-cable connections in space-constrained electronic systems. Featuring a bottom-contact configuration with a flip-lock actuator, it provides secure retention of flexible printed circuits while supporting repeated insertion and removal cycles. Its low-profile construction and robust locking mechanism make it suitable for consumer electronics, industrial controls, embedded systems, displays, and portable devices where dependable signal transmission and compact form factors are required. Engineering Specifications Manufacturer: Molex Series: Easy-On FD19 Part Number: 2005280080 Connector Type: FFC/FPC Connector Contact Configuration: Bottom Contact Actuator Type: Flip-Lock ZIF Mounting Style: Surface Mount Orientation: Right Angle Circuit Count: Eight Positions Pitch: One Millimeter Cable Type: Flexible Flat Cable / Flexible Printed Circuit Contact Material: Copper Alloy Contact Finish: Gold over Nickel Housing Material: High-Temperature Thermoplastic Operating Temperature Range: Industrial Grade RoHS Compliant: Yes Halogen Free: Yes Application Areas: LCD Interfaces, Touch Panels, Embedded Electronics, Industrial Equipment, Portable Devices, Consumer Electronics #Molex #EasyOn #FD19 #FFCConnector #FPCConnector #FlipLock #BottomContact #ZIFConnector #SMTConnector #ElectronicComponents #Interconnect #PCBDesign #EmbeddedSystems #DisplayInterface #IndustrialElectronics

Infrared (IR), Visible Emitter 536nm, 660nm, 950nm 1.3V, 1.9V, 2.3V 40mA, 80mA, 200mA 3.7mW/sr @ 80mA 120° 8-SMD, No Lead The SFH 7018A is a high-performance 3-in-1 multi-emitter LED module from ams OSRAM designed for optical vital-sign monitoring applications. It integrates green, red, and infrared LEDs into a compact reflective QFN package optimized for wearable health devices such as smartwatches, fitness bands, pulse oximeters, and medical monitoring equipment. The device features a dual-cavity optical structure that minimizes optical interference between emitters, improving heart-rate and SpO₂ measurement accuracy. Key Features Integrated green, red, and infrared LEDs in one package Wavelengths: Green: 536 nm Red: 660 nm Infrared: 950 nm Optimized for: Heart-rate monitoring SpO₂ sensing PPG (photoplethysmography) Highly reflective QFN SMT package Advanced 2-cavity design for reduced optical crosstalk Low forward voltage operation optimized for battery-powered devices Can operate without a boost converter in many designs Wide viewing angle: 120° Surface-mount package: 8-SMD, no lead Operating temperature range: −40°C to +85°C Emitters can be driven independently Suitable for compact wearable and medical electronics #CommonPartsLibrary #LED #Infrared

24 Position Receptacle Connector 0.039" (1.00mm) Surface Mount Gold CLM-112-02-L-D-A is a 24-position, dual-row, 1.00 mm pitch surface-mount female socket connector from the Samtec CLM series. It is designed for high-density board-to-board interconnections and features Samtec's Tiger Claw™ dual-wipe contact system, providing reliable electrical performance and secure mating in compact electronic designs. The low-profile construction makes it ideal for space-constrained applications such as embedded systems, industrial controls, communication equipment, and portable electronics. Key Features 1.00 mm pitch, dual-row socket connector 24 positions (2 × 12 contacts) Surface-mount (SMT) termination Low-profile design for compact PCB layouts Tiger Claw™ dual-wipe contacts for enhanced connection reliability Gold-plated contacts for improved conductivity and corrosion resistance Suitable for board-to-board applications Available with multiple plating and packaging options Operating temperature range suitable for industrial environments RoHS compliant and UL recognized Applications Embedded computing systems Industrial automation equipment IoT devices Communication and networking hardware Test and measurement instruments Consumer electronics #Samtec #CLMSeries #BoardToBoardConnector #SMTConnector #FemaleSocket #HighDensityConnector #TigerClawContact #ElectronicsDesign #PCBConnector #EmbeddedSystems #IndustrialElectronics #InterconnectSolutions

Isolated Module DC DC Converter 1 Output 12V 2.5A 9V - 36V Input The TEN 30WIN series is a family of high performance 30W DC/DC converter modules featuring ultra wide 4:1 input voltage ranges in a compact low profile case with industry-standard footprint. Standard features include remote On/Off, output voltage trimming, over voltage protection, under voltage lockout, over temperature and short circuit protection. Typical applications for these products are battery operated equipment and distributed power architectures in communication and industrial electronics, everywhere where isolated, tightly regulated voltages are required and space is limited on the PCB. • 2“ x 1“ x 0.4“ shielded metal package • Ultra wide 4:1 input voltage range • Single- dual- and triple output models • Very high efficiency up to 91 % • Operating temperature range –40 °C to +75 °C • Over temperature protection • I/O isolation 1600 VDC • Remote On/Off • Adjustable output voltage #TRACOPower #TEN302412WIN #DCDCConverter #IsolatedPowerSupply #PowerModule #IndustrialElectronics #EmbeddedSystems #TelecomPower #BatteryPoweredDevices #PowerManagement #ElectronicsDesign #PCBDesign #DCDCModule #WideInputRange #IndustrialAutomation

Accelerometer X, Y, Z Axis ±3g 1.6kHz (X,Y), 550Hz (Z) 16-LFCSP-LQ (4x4) The ADXL335BCPZ-RL7 is a low-power, complete 3-axis accelerometer with analog voltage outputs proportional to acceleration. It measures acceleration along the X, Y, and Z axes with a full-scale range of ±3 g. This device integrates a micro-electromechanical system (MEMS) sensor with signal conditioning circuitry, enabling direct analog output without the need for external amplification. The RL7 suffix indicates tape-and-reel packaging for automated assembly. The ADXL335BCPZ-RL7 is designed for compact, battery-powered, and motion-sensitive applications where low power consumption and ease of integration are critical. Functional Overview The accelerometer operates using a capacitive sensing structure. Acceleration causes displacement of an internal mass, changing capacitance, which is converted into a proportional analog voltage output. Each axis operates independently and provides a continuous analog signal that can be read by a microcontroller’s ADC. External capacitors allow the user to configure bandwidth per axis, enabling optimization for noise or response speed. Electrical Characteristics Supply Voltage Range: 1.8 V to 3.6 V Supply Current: Typical: 350 µA Measurement Range: ±3 g Sensitivity (Typical): 300 mV/g Zero-g Bias Level: Approximately VCC / 2 Bandwidth: Adjustable via external capacitors Typical limits: X, Y axes: up to 1600 Hz Z axis: up to 550 Hz Output Characteristics Output Type: Analog (ratiometric to supply voltage) Axes: Three independent outputs (XOUT, YOUT, ZOUT) Output Impedance: Approximately 32 kΩ Noise Density: X/Y axes: ~150 µg/√Hz Z axis: ~300 µg/√Hz Mechanical Characteristics Package Type: 16-lead LFCSP Package Dimensions: Approximately 4 mm × 4 mm × 1.45 mm Mounting: Surface mount Packaging Option: Tape and reel (RL7) Environmental Specifications Operating Temperature Range: −40°C to +85°C Storage Temperature Range: −65°C to +150°C Shock Survival: Up to 10,000 g Interface Requirements External Components: Capacitors required for bandwidth selection (one per axis) Interface Type: Analog voltage outputs compatible with ADC inputs Pin Description (Summary) ST: Self-test input XOUT: X-axis analog output YOUT: Y-axis analog output ZOUT: Z-axis analog output VCC: Power supply GND: Ground NC: No connection / reserved Applications Tilt and orientation sensing Motion and vibration detection Portable electronics Gaming controllers Wearable devices Industrial monitoring systems Key Features Three-axis acceleration measurement Low power consumption Analog output for simple interfacing Compact MEMS package Adjustable bandwidth Wide temperature operating range Tape-and-reel packaging for automated manufacturing #commonpartslibrary #integratedcircuit #sensor #accelerometer

Headers & Wire Housings HEADER 2POS 2.5MM Connector Header Through Hole, Right Angle 2 position 0.098" (2.50mm) IL-2P-S3FP2-1 is a 2-position, 2.50 mm pitch right-angle through-hole header connector from the IL Series by JAE Electronics. It is designed for board-to-wire connections in compact electronic equipment and features a friction-lock mechanism to ensure reliable cable retention. The connector uses gold-plated brass contacts for enhanced conductivity and corrosion resistance, making it suitable for industrial, consumer, and embedded electronic applications. Key Features 2-position male header connector 2.50 mm pitch Right-angle through-hole mounting Board-to-wire connection style Friction-lock mating system for secure connection Gold-plated brass contacts for reliable electrical performance Shrouded design with one protective wall Polyamide (PA66/Nylon 6/6) housing UL94 V-0 flame-retardant material Compact single-row configuration Operating temperature range: -40°C to +85°C RoHS compliant and lead-free version available Suitable for power and signal connections in electronic equipment #CommonPartsLibrary #JAE #Connector #HeaderConnector #WireToBoard #ThroughHole #RightAngleConnector #ILSeries #2p50mmPitch #FrictionLock #ElectronicComponents #EmbeddedSystems #PCBDesign #HardwareDesign #RoHSCompliant

The A767KN476M1HLAE029 is a surface-mount aluminum electrolytic capacitor designed for bulk energy storage, power supply filtering, ripple current suppression, and voltage stabilization applications. This capacitor utilizes aluminum electrolytic technology to provide high capacitance density in a compact package, making it suitable for modern power management and industrial electronic systems. The device is optimized for applications requiring stable capacitance performance, long operational life, and reliable operation under varying electrical and environmental conditions. It is commonly used in switching power supplies, DC-DC converters, industrial control equipment, communication systems, consumer electronics, and embedded power distribution networks. Its low impedance characteristics and high ripple current capability support efficient power filtering and transient response improvement in electronic circuits. The surface-mount construction enables automated assembly processes and compact PCB integration in high-density designs. Engineering Specification Device Type Aluminum electrolytic capacitor Capacitor Technology Surface-mount aluminum electrolytic construction Capacitance Characteristics High-capacitance energy storage and filtering capability Electrical Characteristics Optimized for power supply filtering and voltage stabilization Impedance Performance Low impedance design for efficient ripple suppression Ripple Current Capability Suitable for high-ripple-current power applications Thermal Characteristics Stable operation across industrial electronic operating conditions Reliability Features Long operational lifetime and robust electrical performance Mounting Style Surface mount technology Package Structure Chip-type aluminum electrolytic capacitor Environmental Characteristics Designed for commercial and industrial electronic environments Applications Switching power supplies DC-DC converters Power management systems Industrial automation Communication equipment Embedded systems Consumer electronics Voltage filtering circuits Energy storage applications Power distribution networks Manufacturer Commonly associated with KEMET aluminum electrolytic capacitor product families #commonpartslibrary #electrolyticcapacitor #aluminumcapacitor #passivecomponents #powerelectronics #powersupply #filtercapacitor #energystorage #surfaceountcomponents #embeddedhardware #electronicsdesign #dcdcconverter #industrialelectronics #powermanagement #ripplefiltering

Recom REM30-W 30W Isolated DC-DC Converter Through Hole, Voltage in 9 36 V dc, Voltage out 5V dc Medical Isolated Module DC DC Converter 1 Output 5V 6A 9V - 36V Input REM30-2405SW is a 30W isolated DC-DC converter from RECOM's REM30-W medical-grade series. It converts a 9V to 36V DC input into a regulated 5V DC output with up to 6A of output current. Designed for medical, industrial, and embedded applications, it features 5kVAC reinforced isolation, high efficiency, and comprehensive protection functions, making it suitable for powering sensitive electronic systems in demanding environments. Key Features 30W isolated DC-DC converter Wide 9V to 36V DC (4:1) input voltage range Regulated 5V DC output at up to 6A 5kVAC reinforced isolation for enhanced safety High efficiency of up to 88% Medical-grade design with low leakage current Built-in overcurrent (OCP), overvoltage (OVP), overtemperature (OTP), short-circuit (SCP), and undervoltage lockout (UVLO) protection Through-hole 2" × 1" DIP module package Wide operating temperature range of -40°C to +105°C (with derating) Suitable for medical equipment, industrial automation, instrumentation, telecommunications, and embedded power systems. #REM30_2405SW #RECOM #DCDCConverter #IsolatedPowerModule #MedicalPower #PowerSupply #IndustrialElectronics #EmbeddedSystems #ThroughHole #Electronics