Accelerometer, Gyroscope, Magnetometer, 9 Axis Sensor I2C, SPI, UART Output The BNO085 is a high-performance 9-axis absolute orientation sensor system-in-package (SiP) that integrates a 3-axis accelerometer, 3-axis gyroscope, 3-axis magnetometer, and a low-power ARM Cortex-M0+ microcontroller running CEVA/Hillcrest SH-2 sensor fusion firmware. It provides accurate real-time orientation, motion tracking, and activity detection while offloading complex sensor fusion calculations from the host processor. The device is widely used in robotics, AR/VR systems, wearables, drones, IoT devices, and navigation applications. Key Features 9-axis motion sensing with integrated accelerometer, gyroscope, and magnetometer Built-in SH-2 sensor fusion engine for accurate orientation tracking ARM Cortex-M0+ processor for onboard motion processing Outputs quaternion, rotation vector, linear acceleration, gravity vector, angular velocity, and magnetic field data Advanced motion detection including tap, step, shake, and significant motion detection Activity classification and stability detection capabilities Low-latency rotation vectors optimized for AR/VR applications Supports I²C, SPI, and UART communication interfaces Configurable output data rates and timestamps Low-power operation suitable for battery-powered devices Compact 28-pin LGA package (5.2 mm × 3.8 mm) Operating temperature range: -40°C to +85°C Backward compatible with BNO080 designs while adding support for future application-specific libraries Applications Robotics and autonomous systems Virtual Reality (VR) and Augmented Reality (AR) Wearable devices and fitness trackers Drones and UAVs Head-mounted displays (HMDs) Industrial motion tracking IoT and smart devices Navigation and positioning systems #BNO085 #IMU #9AxisSensor #MotionTracking #SensorFusion #OrientationSensor #Robotics #AR #VR #IoT #Wearables #EmbeddedSystems #CEVA #HillcrestLabs #MotionDetection #Quaternion #InertialMeasurementUnit

The TPS54331 device is a 28-V, 3-A nonsynchronous buck converter that integrates a low RDS(on) high-side MOSFET. To increase efficiency at light loads, a pulse skipping Eco-mode feature is automatically activated. Furthermore, the 1-μA shutdown supply-current allows the device to be used in battery-powered applications. Current mode control with internal slope compensation simplifies the external compensation calculations and reduces component count while allowing the use of ceramic output capacitors. A resistor divider programs the hysteresis of the input undervoltage lockout. An overvoltage transient protection circuit limits voltage overshoots during start-up and transient conditions. A cycle-by-cycle current-limit scheme, frequency foldback and thermal shutdown protect the device and the load in the event of an overload condition. The TPS54331 device is available in an 8-pin SOIC package and 8-pin SO PowerPAD integrated circuit package that have been internally optimized to improve thermal performance. • 3.5 to 28-V input voltage range • Adjustable output voltage down to 0.8 V • Integrated 80-mΩ high-side MOSFET supports up to 3-A continuous output current • High efficiency at light loads with a pulse skipping Eco-mode • Fixed 570-kHz switching frequency • Typical 1-μA shutdown quiescent current • Adjustable slow-start limits inrush currents • Programmable UVLO threshold • Overvoltage transient protection • Cycle-by-cycle current limit, frequency foldback, and thermal shutdown protection • Available in easy-to-use SOIC8 package or thermally-enhanced SOIC8 PowerPAD™ integrated circuit package • Create a custom design using the TPS54331 with the WEBENCH® Power Designer • Use TPS62933 for a 30 VIN converter with higher frequency, lower IQ and improved EMI #CommonPartsLibrary #IntegratedCircuit #PowerManagement

ARM® Cortex®-M7 S32K3 Microcontroller IC 32-Bit 160MHz 4MB (4M x 8) FLASH 172-QFP (16x16) S32K344EHT1VPBST is an automotive-grade 32-bit microcontroller from NXP Semiconductors based on the Arm Cortex-M7 core architecture. The device is designed for high-performance real-time automotive body, chassis, powertrain, and domain control applications requiring functional safety, security, and advanced communication interfaces. It integrates high-speed processing capability, extensive peripheral integration, hardware security acceleration, and deterministic control functions suitable for safety-critical embedded systems. The microcontroller operates with an Arm Cortex-M7 CPU core running at high frequency with floating-point support and DSP extensions for computationally intensive applications. Integrated flash memory and SRAM provide embedded program and data storage optimized for automotive embedded control systems. The device supports hardware-assisted security features including secure boot, cryptographic acceleration, and tamper protection for secure automotive network communication and firmware integrity. The S32K344EHT1VPBST includes multiple communication peripherals supporting CAN FD, FlexCAN, LIN, SPI, UART, I2C, and Ethernet interfaces for distributed automotive networking and gateway applications. Advanced analog integration includes ADC modules, timers, PWM generators, watchdogs, and motor-control-oriented peripherals enabling precision sensing and control functionality. The device supports functional safety development aligned with ISO 26262 requirements and includes error correction, memory protection, fault monitoring, and safety management features. Power management functionality supports low-power operating modes for energy-efficient automotive electronic control units. The microcontroller is housed in a thermally enhanced LQFP package suitable for automotive operating environments with extended temperature capability and AEC-Q100 qualification for automotive reliability standards. #commonpartslibrary #integratedcircuit #microcontroller #arm #m7

Buck Regulator Positive Output Step-Down DC-DC Controller IC 24-VQFN (3.5x5.5) The LM5148RGYR specification defines the engineering requirements for a synchronous buck controller integrated circuit designed for high-efficiency DC-DC power conversion applications. This specification establishes the functional, electrical, mechanical, thermal, environmental, and quality requirements necessary to ensure reliable voltage regulation, efficient power management, and long-term operational stability in industrial, automotive, telecommunications, and embedded electronic systems. The device is intended for use in high-performance power supply designs requiring wide input voltage capability, precise output voltage regulation, and high-current conversion efficiency. It controls external power MOSFETs to implement synchronous buck converter topologies suitable for distributed power architectures, industrial automation equipment, networking infrastructure, battery-powered systems, and embedded control applications. Engineering Requirements The controller shall be manufactured using qualified semiconductor fabrication processes and high-quality materials to ensure stable switching performance, low power consumption, and reliable long-term operation. The device shall maintain consistent functionality under specified operating voltage, temperature, and environmental conditions. Electrical characteristics shall provide accurate pulse-width modulation control, stable output voltage regulation, fast transient response, and reliable gate drive capability for external synchronous power MOSFETs. The controller shall maintain predictable switching performance during startup, shutdown, overload, and dynamic load conditions while supporting efficient power conversion. The integrated control architecture shall provide robust regulation, protection features, and compensation capability to ensure stable converter operation across varying input voltages and output load conditions. The device shall maintain operational integrity during power sequencing and fault recovery without compromising system reliability. Thermal performance shall support continuous operation within the specified junction temperature range while maintaining electrical performance and reliability. The package shall be suitable for automated surface-mount assembly and compatible with standard solder reflow manufacturing processes. Mechanical construction shall withstand thermal cycling, vibration, mechanical handling, and environmental exposure without degradation of functionality. Workmanship shall be free from defects including contamination, package cracking, bond failures, lead deformation, or structural inconsistencies that could adversely affect electrical or mechanical performance. Inspection, validation, and testing shall be performed using calibrated equipment and controlled quality procedures to verify compliance with engineering and manufacturing requirements. Any deviation from this specification shall require formal engineering evaluation, documented technical justification, and approval through the established engineering change control process before implementation. Documentation Supporting documentation shall include engineering drawings, electrical performance specifications, application guidelines, thermal characterization reports, qualification records, inspection reports, material declarations, reliability data, and revision-controlled manufacturing documentation. All documentation shall be maintained under formal configuration management and quality assurance systems to ensure complete product traceability. Revision Control Any modification to this specification shall be managed through the formal engineering change management process. All revisions shall undergo technical review, validation, and approval before release to ensure continued compliance with design intent and applicable engineering standards. #EngineeringSpecification #BuckController #DCDCConverter #PowerManagement #SynchronousBuck #PowerElectronics #EmbeddedSystems #IndustrialElectronics #QualityAssurance #EngineeringDocumentation

Charger IC Lithium Ion 16-VQFN (3x3) The BQ24075RGTR is a standalone linear charger and power-path management integrated circuit developed by Texas Instruments for single-cell lithium-ion and lithium-polymer battery applications. The device is designed for portable and space-constrained electronic systems requiring efficient battery charging, USB compatibility, and simultaneous system power delivery. The integrated dynamic power-path management architecture enables the system load to be powered while independently charging the battery. The charger supports operation from either a USB power source or an external adapter and includes programmable charging and input current limiting functions for optimized power management. The device incorporates multiple protection and monitoring features including thermal regulation, overvoltage protection, reverse current protection, battery temperature monitoring, and safety timers. The BQ24075RGTR also provides battery disconnect capability through the SYSOFF control function, making it suitable for low-power and portable embedded designs. Typical applications include portable consumer electronics, handheld instruments, wearable devices, wireless accessories, battery-powered IoT equipment, medical portable systems, and embedded rechargeable products. Device Features Standalone single-cell lithium-ion and lithium-polymer battery charger Integrated power-path management architecture Simultaneous battery charging and system power support USB-compatible input current limiting Programmable fast-charge current capability Dynamic power management for unstable or limited input sources Battery temperature monitoring through external thermistor input Integrated thermal regulation and protection mechanisms Reverse current, short-circuit, and input overvoltage protection Programmable safety timers for pre-charge and fast-charge modes Charging status and power-good indication outputs Battery disconnect functionality through SYSOFF control Compact surface-mount VQFN package implementation Electrical Characteristics Designed for single-cell lithium-ion or lithium-polymer batteries Fixed battery regulation voltage suitable for standard single-cell charging Supports USB and external adapter input operation Linear charging topology Wide operating temperature range for portable and industrial applications Programmable input current limit for USB compliance and adapter compatibility Package Information Package Type: VQFN Pin Configuration: Sixteen-pin package Mounting Style: Surface mount Package Dimensions: Compact three-millimeter square footprint Functional Overview The BQ24075RGTR manages power distribution between the external input source, the system load, and the rechargeable battery. When external power is present, the device prioritizes powering the system while charging the battery according to programmable charging parameters. Dynamic power management prevents excessive loading of weak USB or adapter sources by automatically reducing charging current when necessary. Thermal regulation circuitry continuously monitors device temperature and adjusts charging operation to maintain safe operating conditions. Additional integrated protection functions ensure reliable operation during fault conditions such as input overvoltage, battery temperature abnormalities, reverse current flow, and output short circuits. #commonpartslibrary #integratedcircuit #powermanagement

1 mOhms ±1% 4W Chip Resistor Nonstandard Automotive AEC-Q200, Current Sense Metal Element Bourns Inc. CSS4J-4026R-1L00F is a high-power surface-mount current sense resistor designed for accurate current measurement in power electronics applications. It belongs to the CSS4J-4026 series and uses a metal element construction that provides low resistance, high power handling, and excellent stability for automotive and industrial applications. This device features a 1 mΩ resistance value, ±1% tolerance, and 4 W power rating, making it suitable for monitoring high-current paths while minimizing measurement losses. It is also qualified for AEC-Q200 automotive applications and operates across a wide temperature range. Key Features Component Type: SMD Current Sense Resistor (Metal Element / Metal Strip) Resistance Value: 1 mΩ (0.001 Ω) Resistance Tolerance: ±1% Power Rating: 4 W Package Size: 4026 (approx. 10.06 mm × 6.60 mm) Number of Terminals: 4 terminals (Kelvin sensing configuration) Temperature Coefficient: approximately ±75 ppm/°C Operating Temperature Range: −55°C to +170°C Construction: Metal element current shunt resistor for accurate current measurement Qualification: Automotive AEC-Q200 compliant Typical Applications Battery Management Systems (BMS) EV and automotive power systems Motor control circuits Power supplies and DC/DC converters Overcurrent monitoring and protection circuits Industrial power monitoring equipment #CommonPartsLibrary #Bourns #CSS4J4026 #CurrentSenseResistor #ShuntResistor #MetalElementResistor #AECQ200 #PowerElectronics #BatteryManagementSystem #EVElectronics #SMTComponents #PCBDesign

The TPS3839G33DBZT is an ultra-low-power voltage supervisor designed to monitor system supply rails and provide reliable reset signaling for microcontrollers, processors, FPGAs, and other digital systems. The device continuously supervises the supply voltage and asserts a reset output when the monitored voltage falls below the factory-programmed threshold, ensuring proper system startup, shutdown, and fault recovery. Its low quiescent current makes it particularly suitable for battery-powered, portable, and energy-efficient applications where power consumption is critical. The device features a precision voltage monitoring architecture with a fixed reset threshold optimized for nominal logic supply rails. It provides a stable reset output with an internally defined reset timeout period, eliminating the need for external timing components. The compact package and robust noise immunity make it ideal for embedded systems, industrial controls, consumer electronics, IoT devices, medical equipment, and wireless communication platforms. Key Features Ultra-low quiescent current operation Precision fixed-voltage supervision Factory-programmed reset threshold for logic supply monitoring Active-low reset output Internal reset timeout delay High threshold accuracy over temperature Fast response to undervoltage conditions Push-pull reset output configuration No external components required for operation Compact surface-mount package Wide operating temperature range High reliability and low power consumption Applications Microcontroller reset generation Embedded control systems Battery-powered electronics Industrial automation equipment IoT and wireless sensor nodes Portable medical devices Consumer electronics Data acquisition systems Power management subsystems Communication and networking equipment Electrical Characteristics Fixed supply voltage monitoring Precision undervoltage detection Low operating current Integrated reset timing circuitry Stable reset assertion during power-up and brownout conditions Noise-tolerant voltage supervision Reliable operation across specified temperature range Package Information Surface-mount package Compact footprint for space-constrained designs RoHS-compliant construction Suitable for automated assembly processes #commonpartslibrary #integratedcircuit #powersupervisor #voltagesupervisor #resetcontroller #powermanagement #embeddedsystems #microcontroller #lowpower #batterypowered #industrialelectronics #iot #electronicsdesign #semiconductor #texasinstruments

Temperature Sensor Digital, Local -40°C ~ 125°C 10 b 8-MSOP The MCP9808T-E/MS is a high-accuracy digital temperature sensor developed by Microchip Technology for precision thermal monitoring applications. The device communicates through a standard I²C-compatible serial interface and is optimized for low-power embedded systems requiring accurate ambient temperature measurement. It integrates internal temperature sensing, analog-to-digital conversion, programmable alert functionality, and configurable power management within a compact MSOP package. The sensor is designed for applications including industrial monitoring, consumer electronics, IoT devices, thermal management systems, medical instrumentation, and battery-powered portable equipment. Its low operating current and shutdown capability make it suitable for energy-efficient systems where thermal accuracy and minimal power consumption are critical. The device supports programmable temperature limits and interrupt generation for over-temperature events, enabling autonomous thermal supervision without continuous host processor intervention. The MCP9808T-E/MS maintains high measurement accuracy across a wide operating temperature range and offers stable digital output without requiring external calibration components. Electrical Characteristics Supply voltage operation supports low-voltage and standard logic systems. Low operating current enables efficient continuous monitoring. Shutdown mode significantly reduces power consumption during inactive periods. Digital I²C interface supports standard and fast communication modes. Integrated temperature conversion engine provides direct digital temperature output. Temperature Sensing Features High-accuracy ambient temperature measurement. Wide operating temperature range suitable for industrial environments. Programmable resolution for balancing conversion speed and precision. Configurable upper, lower, and critical temperature alert thresholds. Integrated hysteresis control for stable thermal event detection. Communication Interface I²C-compatible serial communication interface. Configurable slave addressing for multi-device bus operation. Supports read and write access to internal configuration registers. Compatible with common microcontrollers and embedded processors. Functional Features Integrated alert output for thermal event signaling. Programmable interrupt and comparator operating modes. Internal registers support temperature monitoring and device configuration. Power-on reset circuitry ensures predictable startup behavior. Device identification registers support system-level verification. Mechanical Characteristics Package type is MSOP with compact surface-mount footprint. Suitable for automated PCB assembly processes. RoHS-compliant and lead-free manufacturing. Typical Applications Industrial temperature monitoring systems. Portable battery-powered electronics. Embedded microcontroller systems. Thermal protection and supervision circuits. Consumer and IoT sensing devices. Medical and laboratory instrumentation. #CommonPartsLibrary #Sensor #Transducer #Temperature-Sensor #MCP9808

Pressure Sensor 4.35PSI ~ 18.13PSI (30kPa ~ 125kPa) Absolute 10-WFLGA The BMP581 is a high-precision digital barometric pressure sensor designed for altitude tracking, environmental monitoring, navigation, weather sensing, and industrial measurement applications. It integrates a MEMS pressure sensing element with a low-noise analog front end and digital signal processing to deliver highly accurate pressure and temperature measurements over a wide operating range. The device supports low-power operation, making it suitable for portable, battery-powered, and always-on sensing systems. The sensor communicates through standard digital interfaces and includes configurable sampling, filtering, and interrupt features for flexible system integration. Its compact package enables use in space-constrained embedded designs such as wearables, mobile devices, drones, smart home systems, IoT devices, and industrial instrumentation. Engineering Specification Device Type Digital barometric pressure and temperature sensor Manufacturer Bosch Sensortec Pressure Measurement High-resolution absolute pressure measurement with integrated temperature compensation Temperature Measurement Integrated digital temperature sensing for environmental monitoring and pressure compensation Pressure Range Wide atmospheric pressure sensing range suitable for altitude and environmental applications Interface Support I²C and SPI digital communication interfaces Supply Voltage Low-voltage operation optimized for embedded and portable systems Power Consumption Ultra-low power modes with configurable performance and sampling settings Measurement Features Oversampling support with programmable output data rate and internal filtering Accuracy High absolute and relative pressure accuracy for precise altitude estimation and environmental sensing Noise Performance Low-noise sensor architecture for stable pressure readings and improved altitude resolution Interrupt Features Configurable interrupt generation for data-ready and threshold-based events FIFO Support Integrated FIFO buffering for efficient sensor data management Operating Temperature Industrial temperature operating capability for consumer and industrial environments Package Type Compact surface-mount package optimized for small PCB footprint designs Applications Altitude tracking, indoor navigation, weather stations, drones, wearable electronics, IoT sensing, HVAC systems, industrial monitoring, and portable devices #CommonPartsLibrary #Sensor #Transducer #PressureSensor

Charger IC Multi-Chemistry 36-VQFN (5x6) The BQ25750RRVR is a highly integrated switch-mode battery charge controller and power-path management device designed for single-cell to multi-cell lithium-ion and lithium-polymer battery-powered systems. The device supports bidirectional power conversion, enabling both battery charging and system power delivery through USB Type-C and other DC power sources. It integrates high-efficiency buck-boost charging architecture to maintain optimal charging performance across a wide input voltage range. The device is intended for portable electronics, industrial handheld equipment, USB Power Delivery applications, embedded systems, and battery-powered computing platforms requiring advanced power management and flexible charging capability. Integrated power-path management allows simultaneous system operation and battery charging while maintaining battery protection and system stability. The BQ25750RRVR supports programmable charging parameters through an I2C interface, including charge voltage, charge current, input current limit, and system power regulation. The device includes comprehensive protection functions such as overvoltage protection, overcurrent protection, thermal regulation, battery temperature monitoring, and fault reporting. High switching frequency operation enables reduced external component size and compact PCB implementation. Features Integrated synchronous buck-boost battery charger Supports USB Power Delivery and wide DC input sources Bidirectional power conversion capability I2C programmable charging and system parameters Integrated power-path management High-efficiency charging operation Supports multi-cell lithium-ion and lithium-polymer batteries Programmable input current and charge current limits Dynamic power management and system voltage regulation Integrated ADC monitoring for voltage, current, and temperature Battery supplement mode during adapter removal OTG boost mode support Thermal regulation and thermal shutdown protection Input overvoltage and overcurrent protection Battery overvoltage protection Safety timer and watchdog timer support NTC thermistor interface for battery temperature monitoring Interrupt and fault status reporting Compact WQFN package suitable for space-constrained designs Electrical Characteristics Wide input operating voltage range Programmable battery charge voltage High charge current capability Integrated low RDS(on) MOSFET drivers High switching frequency operation High conversion efficiency across operating range Low standby and shutdown current consumption Accurate input and charge current regulation Integrated analog-to-digital converter telemetry Interface and Control I2C serial communication interface Programmable charging profiles Configurable protection thresholds Status and interrupt reporting ADC telemetry reporting Enable and control pins for system integration Protection Features Input overvoltage protection Input overcurrent protection Battery overvoltage protection Thermal shutdown protection Thermal regulation control Short-circuit protection Watchdog timer protection Safety charging timer Battery temperature qualification support Package Information Package Type: WQFN Package Suffix: RRV Compact thermally enhanced package Surface-mount device Suitable for automated PCB assembly processes Applications USB Type-C charging systems Portable computers and tablets Industrial handheld devices Power banks and battery packs Embedded battery-powered systems Portable instrumentation Consumer electronics Smart battery charging platforms #commonpartslibrary #integratedcircuit #powermanagement #batterycharger

Battery Battery Monitor IC Lithium Ion 9-DSBGA The BQ27220YZFR is a highly integrated single-cell battery fuel gauge IC developed for rechargeable lithium-ion and lithium-polymer battery applications. The device utilizes Texas Instruments’ Impedance Track™ algorithm to provide highly accurate battery capacity measurement, state-of-charge estimation, runtime prediction, and battery health monitoring across varying load and temperature conditions. The device is designed for compact portable electronics, wearable devices, IoT products, handheld instruments, and low-power embedded systems requiring precise battery monitoring and extended operating life. The BQ27220YZFR supports system-side fuel gauging without requiring battery pack-side electronics, simplifying battery integration and reducing overall system cost. The fuel gauge continuously monitors battery voltage, current, and temperature to estimate available capacity, remaining runtime, full charge capacity, and state-of-health information. Integrated low-power operation enables ultra-low standby current consumption suitable for always-on battery-powered products. Communication with the host processor is implemented through a standard I²C interface, allowing configuration access, telemetry reporting, and battery parameter monitoring. The device also integrates protection and alert functionality through programmable interrupt outputs and battery condition monitoring features. The BQ27220YZFR is optimized for use with single-cell lithium-based chemistries and supports learning cycles for adaptive battery characterization over product lifetime. Internal data flash memory stores battery profile information and calibration parameters to improve long-term gauging accuracy. The device is supplied in a compact lead-free wafer chip-scale package suitable for space-constrained PCB designs and portable electronics requiring minimal footprint and low-profile assembly. Electrical Characteristics Device Type Single-cell battery fuel gauge and battery monitor IC Battery Chemistry Support Lithium-ion and lithium-polymer rechargeable batteries Input Voltage Range Supports single-cell battery operation Fuel Gauging Method Impedance Track™ algorithm Communication Interface I²C serial interface Measurement Functions Battery voltage monitoring Battery current monitoring Battery temperature monitoring State-of-charge estimation Remaining capacity calculation Full charge capacity estimation State-of-health reporting Runtime prediction Power Consumption Ultra-low operating current for portable applications Temperature Monitoring External thermistor support Host Alert Features Interrupt and alert reporting capability Data Storage Integrated nonvolatile configuration memory Calibration Features Automatic learning and battery characterization support Protection Monitoring Battery condition and system monitoring functions Package Type DSBGA wafer chip-scale package Mounting Style Surface mount Operating Temperature Range Industrial temperature operation suitable for portable electronics Functional Features High-accuracy fuel gauging over battery lifetime Adaptive battery modeling and aging compensation Low-power operation for battery-powered systems Integrated battery profiling capability Real-time remaining runtime estimation Automatic battery learning cycles Compact PCB footprint for portable devices System-side implementation without smart battery pack requirement Programmable battery alert functionality Support for low-power embedded processors and mobile systems Optimized for wearable and IoT applications RoHS compliant and lead-free package construction #commonpartslibrary #integratedcircuit #powermanagement #batterymanagement

ARM® Cortex®-M7 S32K3 Microcontroller IC 32-Bit Tri-Core 240MHz 8MB (8M x 8) FLASH 289-LFBGA (14x14) ## Engineering Specification ## General Description The **S32K358GHT1MJBST** is an NXP Semiconductors **S32K3 series automotive microcontroller** designed for high-performance embedded control applications in automotive, industrial, and electrically harsh environments. It is built around an **Arm Cortex-M7 architecture** and provides high processing capability, large embedded flash memory, automotive-grade qualification, security support, and a broad set of communication interfaces. The device is suitable for body control, gateway systems, vehicle networking, motor control, domain control, safety-related embedded systems, and general-purpose automotive electronic control units. ## Device Identification Manufacturer Part Number: **S32K358GHT1MJBST** Manufacturer: **NXP Semiconductors** Product Family: **S32K3** Device Category: **Integrated Circuit** Device Type: **Automotive Microcontroller** Core Architecture: **Arm Cortex-M7** Processing Class: **Thirty-Two-Bit MCU** Qualification: **Automotive Grade, AEC-Q100** ## Functional Description The device functions as a high-performance automotive microcontroller for embedded control and communication systems. It provides processing resources for real-time control, communication management, diagnostics, security handling, and system-level application logic. The microcontroller is designed for scalable automotive platforms where software reuse, safety capability, and peripheral integration are important. ## Core and Processing Description The **S32K358GHT1MJBST** uses an Arm Cortex-M7 based processing architecture with tri-core capability and high-speed operation. The core architecture supports digital signal processing, floating-point operation, interrupt handling, and real-time embedded software execution. This makes the device suitable for control systems that require strong computing performance and deterministic response. ## Memory Description The device includes large embedded flash memory for application firmware storage and integrated RAM for runtime operation, data buffering, communication stacks, and control algorithms. The memory architecture is suitable for complex embedded applications requiring large program space, diagnostics, bootloader support, and over-the-air update capability. ## Security and Safety Description The microcontroller includes hardware security support through **HSE-B security** and is intended for automotive applications where secure boot, cryptographic services, protected firmware operation, and system integrity are important. The S32K3 family also supports automotive safety-oriented development through features such as error correction, monitoring, and diagnostic capability. ## Communication and Interface Description The device supports multiple embedded communication interfaces suitable for vehicle and industrial networks. Supported interface types include CAN, Ethernet, I²C, SPI, UART, LIN, QSPI, SAI, SENT, and FlexIO. These interfaces allow the device to communicate with sensors, actuators, transceivers, memory devices, network controllers, and other electronic control units. ## Analog and Peripheral Description The microcontroller includes analog-to-digital conversion capability, timers, watchdog functions, direct memory access, serial audio support, and general-purpose input and output resources. These peripherals support sensing, control, timing, supervision, communication, and system management functions in embedded hardware designs. ## Electrical Description The device is designed for automotive low-voltage operation and supports use across a wide supply voltage range. It is intended for applications requiring reliable operation in automotive and industrial temperature environments. Proper power supply design, decoupling, reset control, clock configuration, and grounding should follow the manufacturer’s hardware design recommendations. ## Package and Mechanical Description The **S32K358GHT1MJBST** is supplied in a **surface-mount LFBGA package** with a compact ball-grid-array footprint. The package is intended for dense printed circuit board layouts requiring careful routing, controlled assembly process, thermal management, and proper solder joint reliability. ## Mounting and Assembly Description The component is intended for automated surface-mount PCB assembly using BGA-compatible manufacturing processes. PCB layout should follow the recommended footprint, ball escape routing, power-plane design, decoupling capacitor placement, thermal design, and inspection requirements for high-density automotive microcontroller assemblies. ## Application Suitability The device is suitable for automotive electronic control units, body control modules, gateway controllers, vehicle networking systems, motor control platforms, battery-related control systems, industrial controllers, safety-oriented embedded systems, and high-performance general-purpose control applications. ## Design Considerations The design should account for supply voltage range, clocking requirements, flash and RAM usage, thermal limits, package routing density, communication interface requirements, EMC performance, boot configuration, security provisioning, debugging access, software safety requirements, and compliance with automotive design guidelines. The device should not be operated beyond the manufacturer’s specified electrical, thermal, or mechanical limits. ## Hashtags #commonpartslibrary #integratedcircuit #microcontroller #automotivemcu #nxp #nxpsemiconductors #s32k3 #s32k358 #s32k358ght1mjbst #armcortexm7 #cortexm7 #thirtytwobit #automotiveelectronics #aecq100 #hsesecurity #canfd #ethernet #vehicleelectronics #embeddedhardware #embeddeddesign #ecu #gatewaycontroller #bodycontrolmodule #pcbdesign #hardwaredesign #electronicscomponents #electronicparts #componentlibrary #engineeringparts #electronicsengineering

Buck-Boost Regulator Positive Output Step-Up/Step-Down I2C DC-DC Controller IC 40-VQFN (6x6) The LM51772RHAR is a high-performance multi-phase bidirectional buck-boost controller designed for power conversion systems requiring efficient energy transfer between two voltage domains. The device supports seamless operation in both step-up and step-down modes and is optimized for battery-powered, automotive, industrial, and energy storage applications. The controller enables bidirectional current flow, making it suitable for battery charging, backup power systems, supercapacitor management, and high-power USB Type-C power delivery applications. The device integrates advanced control architecture for high efficiency across a wide operating range while supporting programmable current regulation, voltage regulation, and protection features. Multi-phase capability allows reduced input and output ripple currents, improved thermal distribution, and higher overall power capability. The controller supports external MOSFETs for scalable power design flexibility and includes comprehensive monitoring and fault management functions. The LM51772RHAR is designed for operation in demanding environments with robust protection features including overvoltage protection, undervoltage lockout, cycle-by-cycle current limiting, thermal shutdown, and fault reporting. Its flexible configuration and high integration level reduce external component count and simplify implementation in high-density power systems. Key Features Bidirectional synchronous buck-boost controller architecture Supports power transfer in both forward and reverse directions Multi-phase operation for increased power capability and reduced ripple Wide input and output voltage operating range High-efficiency synchronous control using external MOSFETs Programmable current and voltage regulation Peak and average current control capability Seamless transition between buck, boost, and buck-boost operating modes Integrated current sensing support Programmable switching frequency synchronization Phase interleaving support for thermal and ripple optimization External clock synchronization capability Soft-start and controlled startup sequencing Comprehensive fault detection and protection functions Overcurrent protection and short-circuit protection Overvoltage and undervoltage protection Thermal shutdown protection Fault status reporting and system monitoring support Designed for automotive and industrial power applications Compact thermally enhanced package Typical Applications Bidirectional battery charging systems Energy storage systems Automotive dual-battery architectures USB Type-C Power Delivery systems Backup power and UPS systems Supercapacitor charging and balancing Industrial DC power conversion Renewable energy power management High-power portable electronics Telecom and server power systems Electrical Characteristics Wide operating supply voltage range High switching frequency operation capability High-current multi-phase scalability Precision current regulation accuracy Low standby power consumption High-efficiency synchronous rectification support Programmable dead-time and switching parameters Stable operation across wide temperature range Package Information Package Type: VQFN Package Suffix: RHA Thermally enhanced exposed pad package Surface-mount implementation Suitable for automated assembly processes #commonpartslibrary #integratedcircuit #powermanagement #buckboost #dcdcswitchingcontrollers

16 Bit Digital to Analog Converter 1 10-VSSOP The DAC80501MDGSR is a high-precision, single-channel digital-to-analog converter developed by Texas Instruments for industrial, instrumentation, and embedded control applications requiring accurate voltage output generation. The device integrates a low-drift voltage reference, precision output buffer, and serial peripheral interface communication into a compact low-power solution optimized for high-resolution signal generation. Designed for applications such as programmable power supplies, process control systems, automated test equipment, and sensor calibration, the device delivers excellent linearity, low noise performance, and stable output characteristics across varying environmental conditions. The integrated architecture minimizes external component requirements while maintaining high accuracy and long-term reliability. The converter supports rail-to-rail output operation and offers flexible reference configurations to accommodate different system architectures. Its SPI-compatible digital interface enables straightforward integration with microcontrollers, processors, and FPGA-based systems. Electrical Characteristics The device operates from a single analog supply and supports precision voltage output generation with monotonic performance across the full operating range. Integrated precision reference circuitry provides low temperature drift and stable output characteristics suitable for high-accuracy measurement and control systems. Low glitch energy, low offset error, and low gain error characteristics improve output stability during code transitions. The output amplifier is capable of driving moderate capacitive loads while maintaining signal integrity and settling performance. Interface and Control Communication is implemented through a high-speed SPI-compatible serial interface supporting standard synchronous digital communication protocols. The interface allows direct programming of DAC output codes and internal configuration registers. The device supports daisy-chain capable serial communication architecture for simplified expansion in multi-device systems. Internal registers provide control of reference operation, power management, and output configuration functions. Power Management The DAC80501MDGSR incorporates low-power operating modes intended for energy-sensitive applications. Integrated power-down functionality reduces current consumption during inactive system states while preserving configuration integrity. Internal circuitry is optimized for low quiescent current operation without compromising output precision or dynamic response performance. Package Information The device is supplied in a compact VSSOP surface-mount package suitable for space-constrained industrial and embedded designs. The package configuration supports automated assembly processes and standard PCB manufacturing techniques. Typical Applications Typical applications include industrial automation, programmable voltage sources, data acquisition systems, sensor simulation, instrumentation equipment, motor control systems, and precision calibration platforms. The device is particularly suitable for systems requiring stable and repeatable analog voltage generation with minimal external circuitry. #commonpartslibrary #integratedcircuit #analog #digital #converter

Bridge Rectifier Single Phase Standard 100 V Surface Mount 4-MiniDIP The HD01-T is a compact, high-reliability rectifier diode bridge designed for general-purpose AC-to-DC conversion applications. It integrates four diodes in a single package to provide full-wave rectification, making it suitable for power supply circuits, battery chargers, and low-power AC input stages. The device is optimized for space-constrained PCB designs while maintaining adequate current handling and voltage blocking capability. Key Features Single-phase full-wave bridge rectifier Compact through-hole package High surge current capability Low forward voltage drop Reliable and robust construction Suitable for automated assembly Electrical Characteristics Maximum Ratings Repetitive Peak Reverse Voltage: typically up to 100 V Average Forward Rectified Current: typically up to 1 A Peak Forward Surge Current: high surge tolerance for transient conditions Forward Characteristics Forward Voltage Drop: low, typically around 1.0 V per diode at rated current Reverse Characteristics Reverse Leakage Current: low under rated reverse voltage conditions Mechanical Characteristics Package Type: HD (through-hole, compact square package) Mounting: Through-hole PCB mounting Lead Configuration: 4-pin (AC, AC, +, −) Encapsulation: Molded plastic body for insulation and durability #commonpartslibrary #diodes #bridgerectifier

22 Position Receptacle Connector 0.100" (2.54mm) Through Hole Gold The SSW-122-02-G-S is a surface-mount, single-row socket strip designed for reliable board-to-board or component interconnection in electronic assemblies. It is part of a standardized connector series intended for applications requiring compact form factor, consistent electrical performance, and ease of automated placement. The component features a low-profile design suitable for dense PCB layouts and is commonly used in prototyping, embedded systems, and production-level electronics. Design and Construction The connector is manufactured with precision-aligned contacts housed in a high-temperature thermoplastic body, enabling compatibility with standard reflow soldering processes. The contact system is engineered to ensure stable mechanical retention and consistent electrical conductivity, supporting repeated mating cycles without significant degradation. The materials used provide durability, resistance to thermal stress, and compliance with common industry standards for electronic components. Electrical Characteristics The device is intended to provide reliable signal transmission with minimal contact resistance. It supports low to moderate current applications typical of signal-level interconnections. The contact plating is designed to reduce oxidation and maintain stable electrical performance over time. Mechanical Features The connector is configured as a single-row socket with a defined pitch spacing suitable for standard header interfaces. Its surface-mount termination allows for secure attachment to printed circuit boards while minimizing required board space. The structure supports proper alignment during assembly and ensures consistent engagement with corresponding mating connectors. Applications This component is widely used in applications such as microcontroller boards, communication modules, sensor interfaces, and general-purpose electronic systems. It is suitable for both development environments and final product integration where dependable and space-efficient connectivity is required. Compliance and Reliability The SSW-122-02-G-S is designed to meet common industry requirements for environmental and mechanical reliability. It is typically compliant with RoHS standards and suitable for use in a variety of operating conditions encountered in commercial and industrial electronics. #commonpartslibrary #connector #header

8 Position Wire to Board Terminal Block Horizontal with Board 0.200" (5.08mm) Through Hole ## Engineering Specification ## General Description The **1726202** is a Phoenix Contact **MKKDSN series PCB terminal block** designed for compact and reliable wire-to-board connection in printed circuit board assemblies. It is intended for applications that require secure field wiring, serviceable conductor termination, and stable electrical connection between external wiring and PCB circuitry. The component is suitable for industrial control systems, automation equipment, power interfaces, instrumentation, building controls, and general electronic hardware assemblies. ## Device Identification Manufacturer Part Number: **1726202** Manufacturer: **Phoenix Contact** Product Name: **MKKDSN 1,5/ 8-5,08** Product Family: **MKKDSN 1,5** Product Line: **COMBICON Terminals** Device Category: **Connector and Interconnect Component** Device Type: **PCB Terminal Block** Connection Type: **Wire-to-Board Terminal Block** Termination Method: **Screw Connection with Tension Sleeve** Mounting Type: **Through-Hole PCB Mount** ## Functional Description The device functions as a fixed printed circuit board terminal block that allows external conductors to be connected directly to PCB circuits. The screw-clamp connection secures the conductor mechanically while maintaining electrical continuity through the terminal body and solder pins. This makes the component suitable for wiring interfaces that require durability, accessibility, and field-service capability. ## Mechanical Description The terminal block uses a compact green housing with a two-row terminal arrangement and side-access conductor entry. Its layout supports dense wiring connection on a printed circuit board while maintaining practical access for conductor insertion and screw tightening. The through-hole solder pins provide mechanical stability and electrical connection to the host PCB. ## Electrical Description The component is intended for low-voltage power and signal connection applications within the manufacturer’s specified current and voltage ratings. It supports conductor connection for typical industrial and control wiring requirements when used with compatible wire sizes, correct strip length, and proper tightening torque. ## Material and Contact Description The terminal block uses an insulating housing with internal conductive contact elements designed to transfer current from the inserted conductor to the PCB solder connection. The screw connection with tension sleeve helps maintain stable contact pressure and reliable conductor retention during normal operating conditions. ## Mounting and Assembly Description The **1726202** is intended for through-hole PCB soldering, including wave-solder assembly processes. The PCB layout should follow the manufacturer’s recommended hole size, pad pattern, spacing, and soldering guidelines. The component should be positioned to allow safe conductor insertion, screwdriver access, and adequate clearance from nearby parts or enclosure walls. ## Application Suitability The device is suitable for industrial control boards, automation modules, relay boards, power supply interfaces, building automation equipment, instrumentation systems, sensor wiring interfaces, signal distribution boards, and other electronic products requiring secure PCB wire termination. ## Design Considerations The design should account for conductor size compatibility, current carrying requirement, voltage rating, creepage and clearance spacing, tightening torque, solder joint strength, wire routing, and user access during installation or maintenance. The terminal block should not be used beyond the manufacturer’s specified electrical, thermal, or mechanical limits. ## Hashtags #commonpartslibrary #terminalblock #pcbterminalblock #phoenixcontact #mkkdsn #mkkdsnterminalblock #combicon #wiretoboard #screwterminal #fixedterminalblock #throughholecomponent #wavesoldering #soldermount #connector #interconnect #fieldwiring #industrialelectronics #automationequipment #controlsystems #powerinterface #pcbdesign #hardwaredesign #electronicscomponents #electronicparts #engineeringparts #componentlibrary #electronicsengineering

Accelerometer, Gyroscope, 6 Axis Sensor I2C, I3C, SPI Output The BMI323 is a low-power, high-performance inertial measurement unit developed by Bosch Sensortec. It integrates a three-axis accelerometer and a three-axis gyroscope within a compact surface-mount package intended for motion sensing applications requiring precise movement detection, orientation tracking, vibration monitoring, and activity recognition. The device is optimized for wearable electronics, industrial sensing, robotics, navigation systems, IoT devices, and consumer electronics where low power consumption and high motion accuracy are critical. The sensor includes advanced digital signal processing, configurable motion-detection features, programmable interrupts, and integrated FIFO buffering to reduce host processor workload and improve system efficiency. Communication is supported through standard digital interfaces, enabling straightforward integration with microcontrollers and embedded platforms. The BMI323 is designed for robust environmental performance and supports flexible power management modes suitable for battery-operated systems. Engineering Specifications Device Type Six-axis inertial measurement unit consisting of: Three-axis accelerometer Three-axis gyroscope Manufacturer Bosch Sensortec Package Compact LGA surface-mount package suitable for automated assembly processes. Accelerometer Characteristics Supports multiple selectable full-scale measurement ranges for motion and acceleration sensing applications. Provides high-resolution digital output with configurable filtering and sampling parameters for low-noise operation and accurate motion analysis. Gyroscope Characteristics Integrated three-axis angular rate sensor with programmable measurement ranges and digital filtering capabilities. Designed for rotational movement tracking, stabilization, gesture recognition, and inertial navigation applications. Digital Interfaces Supports: I²C serial communication SPI serial communication I3C compatible operation Power Features Designed for ultra-low power operation with multiple configurable power modes to optimize energy consumption for portable and battery-powered devices. Embedded Features Includes integrated: FIFO data buffering Motion detection engine Activity and inactivity detection Tap and gesture detection Orientation and tilt sensing Interrupt generation Self-test functionality Output Data Handling Provides configurable output data rates, oversampling settings, and digital filtering options for balancing performance, bandwidth, and power consumption. Temperature Performance Integrated temperature sensing and compensation support for improved measurement stability across varying environmental conditions. Interrupt System Programmable interrupt outputs support event-driven system architectures and allow efficient host wake-up functionality. Operating Environment Designed for operation across industrial and consumer temperature ranges with stable sensor performance under dynamic motion conditions. Applications Suitable for: Wearable devices Smart watches Fitness trackers Industrial motion monitoring Robotics Drones Navigation systems Gaming controllers AR/VR systems IoT motion sensing Human-machine interfaces #commonpartslibrary #integratedcircuit #accelerometer #sensor

Accelerometer X, Y, Z Axis ±2g, 4g, 8g, 16g 0.5Hz ~ 625Hz 16-LGA (3x3) # LIS3DHTR ## General Description The LIS3DHTR is an ultra-low-power three-axis digital accelerometer manufactured by STMicroelectronics. It is designed to provide accurate motion, orientation, tilt, vibration, and acceleration sensing for a wide range of embedded and portable electronic applications. The device integrates advanced MEMS sensor technology, configurable measurement ranges, embedded motion-detection functions, and digital communication interfaces within a compact surface-mount package. Its low power consumption and high measurement accuracy make it suitable for wearable devices, industrial monitoring systems, asset tracking equipment, smart sensors, consumer electronics, medical devices, Internet of Things products, and battery-powered embedded systems. ## Key Features ### Sensor Architecture * Three-axis digital accelerometer * MEMS sensing technology * High-resolution motion measurement * Multi-axis acceleration detection * Real-time movement monitoring * Precision orientation sensing ### Measurement Capabilities * Motion detection functionality * Tilt sensing capability * Free-fall detection support * Vibration monitoring * Orientation recognition * Impact and shock detection * Activity and inactivity monitoring ### Electrical Characteristics * Ultra-low-power operation * Low current consumption * High measurement stability * Fast response capability * Reliable sensor performance * Optimized for battery-powered systems ### Embedded Processing Features * Integrated interrupt generation * Event detection capability * Motion recognition support * Threshold-based monitoring * Embedded motion-processing functions * Autonomous event reporting ### Communication Interfaces * SPI digital communication interface * I²C digital communication interface * Easy microcontroller integration * Reliable data transfer capability * Flexible system connectivity ### Package Characteristics * Compact surface-mount package * Low-profile design * Automated assembly compatible * High-density PCB layout support * Suitable for space-constrained applications ### Material Construction * Advanced MEMS sensor technology * High-reliability semiconductor integration * RoHS-compliant materials * Lead-free package construction * Industrial-grade manufacturing quality ### Environmental Characteristics * Long operational service life * Reliable operation under industrial conditions * Stable sensor performance over time * Resistant to mechanical stress and vibration * Suitable for continuous monitoring applications ### Application Areas * Wearable Electronics * Internet of Things Devices * Smart Sensors * Asset Tracking Systems * Industrial Monitoring Equipment * Consumer Electronics * Medical Devices * Portable Electronics * Motion Detection Systems * Vibration Monitoring Equipment * Fitness and Activity Tracking Devices * Embedded Control Systems ### Compliance * RoHS Compliant * Lead-Free Compatible * Industrial-Grade MEMS Motion Sensor Solution ## Manufacturer STMicroelectronics ## Product Family LIS3DH Three-Axis Digital Accelerometer Series #LIS3DHTR #STMicroelectronics #Accelerometer #MEMSSensor #MotionSensor #ThreeAxisAccelerometer #IoT #WearableDevices #EmbeddedSystems #IndustrialMonitoring #AssetTracking #VibrationMonitoring #ConsumerElectronics #ElectronicsEngineering #SensorTechnology

Linear Voltage Regulator IC Positive Fixed 1 Output 1A SOT-223-3 General Description The AP2114H-3.3TRG1 is a low dropout linear voltage regulator designed to provide a stable fixed output voltage for low-noise and power-sensitive electronic applications. The device is optimized for high current capability, low quiescent current operation, and reliable thermal performance. It is suitable for portable electronics, embedded systems, communication equipment, consumer devices, and industrial control applications where stable power regulation is required. The regulator incorporates internal protection functions including over-current protection and thermal shutdown to improve operational reliability and system safety. The component is supplied in a surface-mount SOT-223 package suitable for automated PCB assembly processes. Device Type Low Dropout Linear Voltage Regulator with Enable Function Output Configuration Positive Fixed Output Nominal Output Voltage 3.3 V Maximum Output Current 1 A minimum continuous load current capability Input Voltage Range Operates from low-voltage DC input supplies up to 6 V maximum Dropout Voltage Low dropout operation suitable for battery-powered and low-headroom applications Output Accuracy High precision regulated output voltage with tight tolerance characteristics Quiescent Current Low standby current for power-efficient system operation Power Supply Rejection High ripple rejection performance for low-noise output regulation Protection Features Integrated over-current protection Thermal shutdown protection Short-circuit protection Operating Temperature Range Suitable for industrial temperature operating conditions from negative forty degrees Celsius to positive eighty-five degrees Celsius Package Information Surface-mount SOT-223 package Mounting Method Surface Mount Technology Applications LCD monitors LCD televisions Set-top boxes Portable electronics Embedded controllers Industrial electronic systems Low-noise power supply applications #CommonPartsLibrary #IntegratedCircuit #PowerManagement

SDRAM Memory IC 512Mbit Parallel 143 MHz 5.4 ns 54-TSOP II The AS4C32M16SB-7TCN is a single-data-rate synchronous dynamic random-access memory (SDR SDRAM) device manufactured by Alliance Memory. It is organized internally as a multi-bank array, allowing concurrent access operations across banks to improve effective memory bandwidth compared to simpler asynchronous DRAM architectures. The device is intended for general-purpose embedded memory applications where a synchronous, clock-driven memory interface is required, including embedded systems, industrial controllers, consumer electronics, networking equipment, and other designs that rely on a parallel SDRAM interface for working memory or buffering. As a drop-in style component within Alliance Memory's broader memory portfolio, this part is designed to be pin- and function-compatible with legacy SDR SDRAM devices originally offered by other manufacturers, allowing designers to source a continued-availability alternative for designs that depend on this memory architecture even as some original suppliers have discontinued production. This makes the device particularly useful in long-lifecycle industrial, embedded, and legacy system designs where a guaranteed supply of a specific memory interface and timing profile is critical to sustaining production over many years. The "B" designation in the part family indicates a specific die revision within the AS4C32M16S product line, reflecting a particular generation of internal silicon design while maintaining functional and pinout compatibility with related die revisions in the same footprint. The device communicates over a standard synchronous SDRAM command interface, using a clock-synchronized protocol for row and column addressing, data burst transfers, and bank management, and it supports the auto-refresh and self-refresh mechanisms typical of SDRAM devices to maintain stored data integrity without requiring constant external refresh management by the host controller. Mechanically, the device is housed in a thin small-outline package suited to space-constrained PCB layouts, and it is built for standard surface-mount assembly processes. The "-7TCN" suffix on this part number reflects a specific speed grade, package style, and temperature grade combination within the product family, with this particular variant intended for commercial temperature range operation. The device is supplied in tray packaging for surface-mount assembly and is compliant with RoHS material restrictions, supporting standard environmental and regulatory requirements for electronic components. Spec Sheet Identification Part Number: AS4C32M16SB-7TCN Device Family: AS4C32M16SB Manufacturer: Alliance Memory, Inc. Die Revision: B-die Functional Classification Device Type: Synchronous DRAM (SDR SDRAM) Memory Organization: Multi-bank array architecture Interface Type: Parallel, clock-synchronous command interface Refresh Capability: Supports auto-refresh and self-refresh modes Electrical Characteristics Supply Voltage: Standard 3.3V-class SDRAM supply rating Clock Frequency: Mid-range SDR SDRAM clock speed class Access Timing: Standard SDR SDRAM access time class for its speed grade Environmental & Qualification Temperature Grade: Commercial ("C" suffix designation) RoHS Compliance: Yes Product Positioning: Long-lifecycle, drop-in replacement memory device Package Package Type: Thin Small Outline Package, TSOP-II style Mounting: Surface mount technology (SMT) Packaging Format Supply Format: Tray packaging #AS4C32M16SB #AllianceMemory #SDRAM #SDRSDRAM #MemoryIC #EmbeddedMemory #TSOP #SurfaceMount #LegacyMemory #DropInReplacement #DRAM #EmbeddedSystems #IndustrialElectronics #SemiconductorIC #EngineeringSpec #ComponentLibrary #CommonPartsLibrary #RoHSCompliant #MemoryComponent #PCBDesign #CommonPartsLibrary #IntegratedCircuit #Memory #AS4C32

EEPROM Memory IC 256Kbit I2C 1 MHz 450 ns 8-SO The M24256E-FMN6TP is a 256-Kbit (32 Kbyte) I²C-compatible serial EEPROM from STMicroelectronics. It is designed for reliable, non-volatile data storage in a wide range of electronic applications including consumer, industrial, and automotive systems. The device supports standard (100 kHz), fast (400 kHz), and fast-mode plus (1 MHz) I²C communication, enabling efficient data transfer. It features byte and page write operations, low power consumption, and a high endurance of write cycles, making it suitable for frequent data logging and configuration storage. Housed in a compact SO8 package, the device is optimized for space-constrained PCB designs while maintaining robust performance and data retention capabilities. Key Features Memory size: 256 Kbit (32 Kbyte) Interface: I²C (2-wire serial interface) Clock frequency: Standard mode: 100 kHz Fast mode: 400 kHz Fast-mode Plus: 1 MHz Supply voltage range: 1.7 V to 5.5 V Page write capability: up to 64 bytes Write cycle time: ~5 ms (typical) Data retention: > 200 years Endurance: > 4 million write cycles Hardware write protection available ESD protection and latch-up immunity Functional Description The device operates as a slave on the I²C bus and supports: Byte write and read Page write (up to 64 bytes) Random and sequential read operations Memory addressing is internally managed using a 16-bit address pointer, allowing access to the full 32 KB memory array. The device includes an internal write cycle controller, eliminating the need for external timing management. Pin Configuration (SO8 Package) A0, A1, A2: Device address inputs VSS: Ground SDA: Serial data line SCL: Serial clock line WC: Write control (hardware write protection) VCC: Supply voltage Absolute Maximum Ratings Supply voltage (VCC): -0.3 V to 6.5 V Input voltage: -0.3 V to VCC + 0.6 V Storage temperature: -65°C to +150°C Operating temperature (industrial grade): -40°C to +85°C Electrical Characteristics Low standby current: < 1 µA (typical) Operating current: < 1 mA Input/output compatible with CMOS logic levels Schmitt trigger inputs for noise immunity Timing Characteristics Write cycle time: 5 ms (typical) Fast-mode Plus support up to 1 MHz Sequential read supports continuous data streaming Package Information Package type: SO8 (8-lead Small Outline) Mounting: Surface-mount (SMD) Tape & reel packaging (TP suffix) Applications Configuration storage Calibration data storage Data logging systems Industrial control systems Consumer electronics Embedded systems requiring non-volatile memory Advantages High endurance and long data retention Wide voltage range (ideal for mixed-voltage systems) Compact footprint High-speed I²C compatibility (up to 1 MHz) #commonpartslibrary #integratedcircuit #memory

Comparator Standard (General Purpose) Open-Drain, Rail-to-Rail 14-TSSOP The TLV902x have an open-drain output that can be pulled-up below or beyond the supply voltage. These devices are designed for low voltage logic translators. The TLV903x have a push-pull output stage capable of sinking and sourcing many milliamps of current to drive LEDs or capacitive loads for MOSFET gates. The TLV90x0 and TLV90x1 are alternate pinouts of the single device. The family is specified for the Industrial temperature range of -40°C to +125°C and are available in a standard leaded and leadless packages. • Supply range: 1.65V to 5.5V • Precision input offset voltage: 300μV • Rail-to-Rail input with fault-tolerance • Typical propagation delay: 100ns • Low quiescent current per channel: 16μA • Low input bias current: 5pA • Open-drain output option (TLV902x) • Push-pull output option (TLV903x) • Full temperature range: -40°C to +125°C • ESD protection: 2kV • Alternate Single Pinout (TLV90x0) #CommonPartsLibrary #IntegratedCircuit #Comparator

680 kOhms ±5% 0.25W, 1/4W Through Hole Resistor Axial Automotive AEC-Q200 Carbon Film The CFR-25JB-52-680K is a carbon film through-hole resistor designed for general-purpose electronic applications requiring stable resistance characteristics, reliable long-term performance, and cost-effective implementation. This resistor is commonly used in signal conditioning, voltage division, pull-up and pull-down networks, biasing circuits, and low-power analog or digital systems. Its axial leaded construction supports automated insertion and conventional through-hole assembly methods, making it suitable for consumer electronics, industrial controls, instrumentation, and embedded systems. The device utilizes carbon film resistive technology to provide dependable electrical performance with moderate noise characteristics and good environmental stability. The flame-retardant coating enhances mechanical durability and improves resistance against moisture and environmental exposure. The component is optimized for standard operating environments where compact size, stable operation, and economical design are required. Electrical Characteristics Resistance Value: 680 kΩ Resistance Tolerance: ±5% Resistor Technology: Carbon Film Rated Power Dissipation: 1/4 W Maximum Working Voltage: 250 V Maximum Overload Voltage: 500 V Temperature Coefficient: ±350 ppm/°C Insulation Resistance: High reliability insulation structure suitable for general electronic equipment Mechanical Characteristics Package Type: Axial Through-Hole Mounting Style: Through Hole Body Style: Cylindrical Flame-Retardant Coated Body Lead Material: Tin-Plated Copper Lead Configuration: Axial Leads for PCB insertion Environmental Characteristics Operating Temperature Range: −55°C to +155°C Moisture Resistance: Suitable for standard humidity environments Flame Resistance: Flame-retardant protective coating compliant with general safety requirements Applications Signal Conditioning Circuits Voltage Divider Networks Pull-Up and Pull-Down Resistors Industrial Control Electronics Consumer Electronic Products General Analog and Digital Circuitry Embedded Systems and Microcontroller Interfaces #commonpartslibrary #passivecomponents #resistor #carbonfilm #throughhole #axialresistor #powermanagement #analog #digital #industrialelectronics

Buck Switching Regulator IC Positive Adjustable 0.8V 1 Output 3.5A SOT-23-6 Thin, TSOT-23-6 The LMR51635YFDDCR specification defines the engineering requirements for a synchronous step-down DC-DC converter integrated circuit designed for high-efficiency power regulation in embedded and industrial electronic systems. This specification establishes the functional, electrical, mechanical, thermal, environmental, and quality requirements necessary to ensure stable voltage conversion, efficient power management, and long-term operational reliability. The device is intended for use in industrial automation, telecommunications equipment, consumer electronics, test and measurement instruments, distributed power systems, and embedded applications requiring regulated low-voltage power rails from higher-voltage DC sources. It integrates high-performance switching circuitry to provide efficient voltage conversion while minimizing external component count and overall system power loss. Engineering Requirements The DC-DC converter shall be manufactured using qualified semiconductor fabrication processes and high-quality materials to ensure consistent electrical performance, low power consumption, and reliable long-term operation. The device shall maintain stable functionality under specified input voltage, output load, temperature, and environmental operating conditions. Electrical characteristics shall provide accurate output voltage regulation, high conversion efficiency, low output ripple, and fast transient response during load and input voltage variations. The converter shall maintain stable switching operation while supporting continuous and dynamic power delivery with minimal performance degradation. The integrated control architecture shall ensure reliable startup, controlled shutdown, and stable operation under varying load conditions. Built-in protection mechanisms shall support safe operation during abnormal conditions, including overload, overcurrent, thermal stress, and short-circuit events, thereby enhancing overall system reliability. Thermal performance shall support continuous operation within the specified junction temperature range while maintaining electrical integrity and long-term reliability. The package shall be suitable for automated surface-mount assembly and compatible with standard solder reflow manufacturing processes. Mechanical construction shall withstand thermal cycling, vibration, mechanical handling, and environmental exposure without degradation of electrical or mechanical performance. Workmanship shall be free from defects including contamination, package cracking, bond failures, lead deformation, or structural inconsistencies that could adversely affect device functionality or reliability. Inspection, validation, and testing shall be conducted using calibrated equipment and controlled quality procedures to verify compliance with engineering and manufacturing requirements. Any deviation from this specification shall require formal engineering evaluation, documented technical justification, and approval through the established engineering change control process before implementation. Documentation Supporting documentation shall include engineering drawings, electrical performance specifications, application guidelines, thermal characterization reports, qualification records, inspection reports, reliability data, material declarations, and revision-controlled manufacturing documentation. All documentation shall be maintained under formal configuration management and quality assurance systems to ensure complete product traceability. Revision Control Any modification to this specification shall be managed through the formal engineering change management process. All revisions shall undergo technical review, validation, and approval before release to ensure continued compliance with design intent and applicable engineering standards. #EngineeringSpecification #DCDCConverter #BuckConverter #PowerManagement #PowerElectronics #EmbeddedSystems #IndustrialElectronics #VoltageRegulator #QualityAssurance #EngineeringDocumentation