ARM® Cortex®-M0+ MSPM0 C Microcontroller IC 32-Bit 24MHz 16KB (16K x 8) FLASH 8-DSBGA (0.86x1.6) MSPM0C110x microcontrollers (MCUs) are part of the MSP highly-integrated ultra-low-power 32-bit MCU family based on the enhanced Arm® Cortex®-M0+ core platform operating at up to 24MHz frequency. These costoptimized MCUs offer high-performance analog peripheral integration, support extended temperature ranges from -40°C to 125°C, and operate with supply voltages from 1.62V to 3.6V. The MSPM0C110x devices provide up to 16KB embedded flash program memory with 1KB SRAM. These MCUs incorporate a high-speed on-chip oscillator with an accuracy from -2% to +1.2%, eliminating the need for an external crystal. Additional features include a 1-channel DMA, CRC-16 accelerator, and a variety of highperformance analog peripherals such as one 12-bit 1.5Msps ADC with VDD as the voltage reference, and an on-chip temperature sensor. These devices also offer intelligent digital peripherals such as one 16-bit advanced timer, two 16-bit general purpose timer, one windowed watchdog timer, and a variety of communication peripherals including one UART, one SPI, and one I2C. These communication peripherals offer protocol support for LIN, IrDA, DALI, Manchester, smart card, SMBus, and PMBus. The TI MSPM0 family of low-power MCUs consists of devices with varying degrees of analog and digital integration let customers find the MCU that meets their project needs. The architecture combined with extensive low-power modes is optimized to achieve extended battery life in portable measurement applications. MSPM0C110x MCUs are supported by an extensive hardware and software ecosystem with reference designs and code examples to get the design started quickly. Development kits include a LaunchPad™ kit available for purchase and design files for a target-socket board. TI also provides a free MSP Software Development Kit (SDK), which is available as a component of Code Composer Studio™ IDE desktop and cloud version within the TI Resource Explorer. MSPM0 MCUs are also supported by extensive online collateral, training with MSP Academy, and online support through the TI E2E™ support forums. Features • Core – Arm® 32-bit Cortex®-M0+ CPU, frequency up to 24MHz • Operating characteristics – Extended temperature: –40°C to 125°C – Wide supply voltage range: 1.62V to 3.6V • Memories – Up to 16KB of flash – 1KB of SRAM • High-performance analog peripherals – One analog-to-digital converter (ADC) with up to 10 total external channels, 1.7Msps at 10 bit or 1.5Msps at 12 bit with VDD as the voltage reference – Configurable 1.4V or 2.5V internal ADC voltage reference (VREF) – Integrated temperature sensor – Integrated supply monitor • Optimized low-power modes – RUN: 87µA/MHz – STOP: 609µA at 4MHz, 311µA at 32kHz – STANDBY: 5µA with SRAM retention – SHUTDOWN: 200nA • Intelligent digital peripherals – 1-channel DMA controller dedicated for ADC – Three timers supporting up to 14 PWM channels • One 16-bit advanced timers with deadband support up to 8 PWM channels • One 16-bit general purpose timer with 4 capture/compares • One 16-bit general purpose timer with 2 capture/compares – Windowed watchdog timer – BEEPER generating 1kHz, 2kHz, 4kHz, or 8kHz square wave to drive the external beeper • Enhanced communication interfaces – One UART interface supporting LIN, IrDA, DALI, smart card, Manchester and low-power operation in STANDBY mode – One I2C interface supporting FM+ (1Mbps), SMBus, PMBus, and wakeup from STOP mode – One SPI supporting up to 12Mbps • Clock system – Internal 24MHz oscillator with an accuracy from -2% to +1.2% (SYSOSC) – Internal 32kHz low-frequency oscillator (LFOSC) • Data integrity – Cyclic redundancy checker (CRC-16) • Flexible I/O features – Up to 18 GPIOs – Two 5V-tolerant open-drain IOs • Development support – 2-pin serial wire debug (SWD) • Package options – 20-pin TSSOP (PW) – 20-pin VSSOP (DGS) – 20-pin WQFN (RUK) – 16-pin SOT (DYY) – 8-pin SOT (DDF) – 8-pin WSON (DSG) – 8-pin DSBGA (YCJ) • Family members (also see Device Comparison) – MSPS003F4: 16KB of flash, 1KB of RAM – MSPS003F3: 8KB of flash, 1KB of RAM – MSPM0C1104: 16KB of flash, 1KB of RAM – MSPM0C1103: 8KB of flash, 1KB of RAM • Development kits and software (also see Tools and Software) – LP-MSPM0C1104 LaunchPad™ development kit – MSP Software Development Kit (SDK) 2 Applications • Battery charging and management • Power supplies and power delivery • Personal electronics • Building security and fire safety • Connected peripherals and printers • Grid infrastructure • Smart metering • Communication modules • Medical and healthcare • Lighting #MSPM0C1104S8YCJR #MSPM0C1104 #TexasInstruments #CortexM0Plus #Microcontroller #EmbeddedSystems #LowPowerMCU #IoT #WearableDevices #IndustrialControl #ConsumerElectronics #ADC #UART #SPI #I2C #PWM #TI #ElectronicsDesign #PCBDesign #EmbeddedDevelopment

Temperature Sensor Digital, Local -40°C ~ 125°C 16 b 4-PICOSTAR (0.76x0.76) The TMP114NCIYMTR is a high-accuracy digital temperature sensor designed for precision thermal monitoring applications in industrial, automotive, medical, and embedded electronic systems. The device integrates a precision band-gap temperature sensing element, analog-to-digital conversion circuitry, EEPROM memory, and a digital communication interface within a compact low-power package. The sensor supports accurate local temperature measurements with factory calibration and programmable alert functionality, enabling reliable thermal protection and environmental monitoring in space-constrained designs. Engineering Specification Manufacturer: Texas Instruments Manufacturer Part Number: TMP114NCIYMTR Device Type: Digital Temperature Sensor Temperature Measurement Method: Local Semiconductor Temperature Sensing Interface Type: I²C-Compatible Serial Interface Supply Voltage Range: Ultra-Low Voltage Operation Compatible with Battery-Powered Systems Temperature Measurement Range: Industrial Temperature Range Support Accuracy: High-Precision Factory-Calibrated Temperature Measurement Resolution: High-Resolution Digital Temperature Output Conversion Architecture: Integrated Sigma-Delta Analog-to-Digital Conversion Programmable Features: High and low temperature alert thresholds EEPROM-stored configuration settings Programmable conversion rate Offset correction calibration Alert and interrupt functionality Power Consumption: Optimized for Low-Power Embedded Applications Communication Speed: Standard and Fast-Mode I²C Support Package Type: Small Outline Leadless Package Mounting Type: Surface Mount Technology Operating Environment: Suitable for Industrial and Embedded Control Systems Protection Features: Integrated thermal monitoring alerts Nonvolatile configuration retention Robust digital communication interface Applications: Industrial temperature monitoring Medical instrumentation Battery-powered electronics Thermal management systems Precision embedded sensing Data acquisition equipment Environmental monitoring devices #commonpartslibrary #integratedcircuit #temperaturesensor #digital

ARM® Cortex®-M0+ STM32U0 Microcontroller IC 32-Bit 56MHz 256KB (256K x 8) FLASH 48-LQFP (7x7) # STM32U083CCT6 ## General Description The STM32U083CCT6 is an ultra-low-power microcontroller from STMicroelectronics based on the Arm Cortex-M0+ core. It is specifically designed for energy-efficient embedded applications requiring long battery life, advanced peripheral integration, secure operation, and reliable real-time performance. The device combines low-power processing, embedded Flash memory, SRAM, analog peripherals, communication interfaces, and hardware security features within a compact package. Its architecture makes it ideal for smart sensors, industrial monitoring systems, medical devices, wearable electronics, smart metering, home automation products, and Internet of Things applications where power efficiency is a primary design requirement. ## Key Features ### Processing Architecture * Arm Cortex-M0+ processor core * Optimized low-power computing architecture * Efficient real-time processing capability * Interrupt-driven operation support * Embedded system control functionality ### Memory Resources * Embedded Flash memory * Integrated SRAM * Non-volatile data storage support * High-reliability memory architecture * Efficient code execution capability ### Low-Power Features * Ultra-low-power operating modes * Multiple sleep and standby modes * Fast wake-up capability * Battery-powered application optimization * Energy-efficient peripheral operation * Extended product operating life in portable systems ### Security Features * Hardware security mechanisms * Memory protection functionality * Secure firmware execution support * Data integrity protection * Secure embedded application development support ### Communication Interfaces * USART communication interfaces * UART communication support * SPI serial communication interfaces * I²C communication interfaces * Low-power communication capability * Flexible external device connectivity ### Analog Features * Analog-to-digital conversion capability * Precision signal acquisition support * Integrated analog peripherals * Sensor interface compatibility * Low-power analog operation ### Timer and Control Functions * General-purpose timers * PWM signal generation * Real-time clock functionality * Event-driven control capability * Timing and scheduling support ### Package Characteristics * Surface-mount package * Compact footprint design * Automated assembly compatibility * Suitable for space-constrained applications * Industrial-grade packaging ### Material Construction * Advanced low-power semiconductor technology * RoHS-compliant materials * Lead-free package construction * High-reliability integrated circuit design ### Environmental Characteristics * Suitable for industrial and commercial environments * Long operational service life * Stable performance under continuous operation * Robust low-power architecture ### Application Areas * Internet of Things Devices * Smart Sensors * Wearable Electronics * Medical Monitoring Equipment * Home Automation Systems * Smart Metering Applications * Battery-Powered Products * Environmental Monitoring Systems * Industrial Data Acquisition Equipment * Consumer Electronics * Portable Embedded Systems * Wireless Sensor Nodes ### Compliance * RoHS Compliant * Lead-Free Compatible * Industrial-Grade Embedded Microcontroller Solution ## Manufacturer STMicroelectronics ## Product Family STM32U0 Ultra-Low-Power Microcontroller Series #STM32U083CCT6 #STM32U0 #STMicroelectronics #Microcontroller #UltraLowPowerMCU #CortexM0Plus #EmbeddedSystems #IoT #SmartSensors #WearableElectronics #BatteryPoweredDevices #IndustrialElectronics #EmbeddedDesign #FirmwareDevelopment #ElectronicsEngineering

Headers & Wire Housings PICOFLEX 10P HDR LOPRO SN Connector Header Through Hole 10 position 0.050" (1.27mm) The 0903250010 is a 10-position vertical through-hole header connector from the Picoflex PF-50 series by Molex. It features a 1.27 mm pitch, straight orientation, and is designed for reliable board-to-cable interconnections in compact electronic equipment. The connector is commonly used with Picoflex ribbon cable assemblies in industrial, consumer, telecommunications, and embedded electronic applications. It provides a space-saving solution while maintaining dependable electrical and mechanical performance. Key Features 10 contacts (single-row configuration) 1.27 mm (0.050") contact pitch Vertical (straight) through-hole mounting Male header design Compatible with Molex Picoflex cable connectors Current rating up to 1.2 A per contact Voltage rating up to 250 V Operating temperature range: -40°C to +105°C Low contact resistance (15 mΩ max) High insulation resistance (1000 MΩ min) RoHS compliant Compact footprint for high-density PCB designs Suitable for signal and low-power applications #CommonPartsLibrary #0903250010 #Molex #Picoflex #Connector #HeaderConnector #ThroughHole #PCBConnector #BoardToCable #Interconnect #Electronics #EmbeddedSystems #IndustrialElectronics #RibbonCable #1_27mmPitch #ElectronicComponents

Flat, 5 mm 2 Form C, 2 A, relays Telecom Relay DPDT (2 Form C) Surface Mount The TQ2SA-L2-3V-Z is a compact surface-mount DPDT (2 Form C) telecom/signal relay from Panasonic Industry designed for low-power switching applications. It features a dual-coil latching mechanism, allowing the relay to maintain its state without continuous coil power, making it suitable for battery-powered and energy-efficient systems. This relay is commonly used in telecommunications equipment, industrial controls, measurement devices, and embedded electronic systems. Key Features DPDT (2 Form C) contact configuration 3V DC dual-coil latching relay Low power consumption: approximately 140 mW Compact SMD package: only 5.6 mm height Surface-mount gull-wing terminals Sealed construction for automatic washing compatibility High switching capability: up to 2 A Wide switching voltage range: up to 125 VAC / 220 VDC Fast operate/release time: approx. 4 ms High dielectric strength and surge resistance Wide operating temperature: −40°C to +85°C Gold-clad AgNi contacts for reliable low-level signal switching Tape-and-reel packaging (“Z” suffix) for automated assembly #CommonPartsLibrary #relay

Accelerometer X, Y, Z Axis ±3g 1.6kHz (X,Y), 550Hz (Z) 16-LFCSP-LQ (4x4) The ADXL335BCPZ-RL7 is a low-power, complete 3-axis accelerometer with analog voltage outputs proportional to acceleration. It measures acceleration along the X, Y, and Z axes with a full-scale range of ±3 g. This device integrates a micro-electromechanical system (MEMS) sensor with signal conditioning circuitry, enabling direct analog output without the need for external amplification. The RL7 suffix indicates tape-and-reel packaging for automated assembly. The ADXL335BCPZ-RL7 is designed for compact, battery-powered, and motion-sensitive applications where low power consumption and ease of integration are critical. Functional Overview The accelerometer operates using a capacitive sensing structure. Acceleration causes displacement of an internal mass, changing capacitance, which is converted into a proportional analog voltage output. Each axis operates independently and provides a continuous analog signal that can be read by a microcontroller’s ADC. External capacitors allow the user to configure bandwidth per axis, enabling optimization for noise or response speed. Electrical Characteristics Supply Voltage Range: 1.8 V to 3.6 V Supply Current: Typical: 350 µA Measurement Range: ±3 g Sensitivity (Typical): 300 mV/g Zero-g Bias Level: Approximately VCC / 2 Bandwidth: Adjustable via external capacitors Typical limits: X, Y axes: up to 1600 Hz Z axis: up to 550 Hz Output Characteristics Output Type: Analog (ratiometric to supply voltage) Axes: Three independent outputs (XOUT, YOUT, ZOUT) Output Impedance: Approximately 32 kΩ Noise Density: X/Y axes: ~150 µg/√Hz Z axis: ~300 µg/√Hz Mechanical Characteristics Package Type: 16-lead LFCSP Package Dimensions: Approximately 4 mm × 4 mm × 1.45 mm Mounting: Surface mount Packaging Option: Tape and reel (RL7) Environmental Specifications Operating Temperature Range: −40°C to +85°C Storage Temperature Range: −65°C to +150°C Shock Survival: Up to 10,000 g Interface Requirements External Components: Capacitors required for bandwidth selection (one per axis) Interface Type: Analog voltage outputs compatible with ADC inputs Pin Description (Summary) ST: Self-test input XOUT: X-axis analog output YOUT: Y-axis analog output ZOUT: Z-axis analog output VCC: Power supply GND: Ground NC: No connection / reserved Applications Tilt and orientation sensing Motion and vibration detection Portable electronics Gaming controllers Wearable devices Industrial monitoring systems Key Features Three-axis acceleration measurement Low power consumption Analog output for simple interfacing Compact MEMS package Adjustable bandwidth Wide temperature operating range Tape-and-reel packaging for automated manufacturing #commonpartslibrary #integratedcircuit #sensor #accelerometer

Standard (General Purpose) Amplifier 2 Circuit Rail-to-Rail 8-SOIC The MCP6042-I/SN specification defines the engineering requirements for a low-power dual operational amplifier designed for precision analog signal conditioning applications. This specification establishes the functional, electrical, mechanical, environmental, and quality requirements necessary to ensure stable and accurate analog performance across a wide range of embedded, industrial, and consumer electronic systems. The device is intended for use in applications requiring low offset voltage, low input bias current, and stable operation under low supply conditions. It is suitable for signal buffering, sensor signal conditioning, filtering, and general-purpose analog amplification in battery-powered and low-energy electronic systems. Engineering Requirements The operational amplifier shall be manufactured using advanced CMOS process technology to ensure low power consumption, high input impedance, and stable analog performance. The device shall maintain consistent operation under defined electrical, thermal, and environmental conditions without degradation of signal integrity. The amplifier architecture shall support dual independent channels with stable gain characteristics and predictable linear response across the intended operating range. Output performance shall remain stable under capacitive loading and dynamic signal conditions typical of embedded analog systems. Electrical characteristics shall ensure low noise operation, low offset behavior, and reliable signal amplification with minimal distortion. The device shall maintain functional stability during power-up, power-down, and transient operating conditions. Mechanical and package construction shall be suitable for surface-mount assembly and shall ensure robust handling during manufacturing, soldering, and system integration. Workmanship shall be free from defects such as contamination, cracks, bonding issues, or structural inconsistencies that could affect electrical or mechanical reliability. Inspection, validation, and testing shall be performed using controlled procedures and calibrated measurement systems to ensure compliance with all applicable engineering and quality requirements. Any deviation from this specification shall require formal engineering review, documented justification, and approval through established change control processes. Documentation Supporting documentation shall include official datasheets, electrical characterization reports, qualification data, inspection records, and revision-controlled manufacturing documentation. All records shall be maintained under formal configuration management and quality assurance systems to ensure traceability and consistency. Revision Control Any modification to this specification shall be managed through the formal engineering change control system. All revisions shall undergo technical review, validation, and approval prior to implementation to ensure continued compliance with design intent and applicable standards. #EngineeringSpecification #OperationalAmplifier #AnalogIC #MicrochipTechnology #LowPowerDesign #SignalConditioning #EmbeddedSystems #ElectronicsDesign #QualityAssurance #EngineeringDocumentation

RS485, RS422, 20Mbps Transceiver, 3.0V to 7V, Low-Power, TDFN-8 #microcontrollers #Interface #UART #commonpartslibrary

Battery Fuel Gauge IC Multi-Chemistry 32-QFN (4x4) The BQ41Z50RSNR is a highly integrated battery fuel gauge and battery management IC designed for single-cell and multi-cell lithium-ion and lithium-polymer battery packs. It provides accurate battery monitoring, protection, authentication, and state estimation functions for portable, industrial, and embedded power applications. The device incorporates advanced Impedance Track™ fuel gauging technology to deliver precise state-of-charge, state-of-health, and runtime predictions across varying operating conditions and battery aging profiles. The device integrates battery protection features including overvoltage, undervoltage, overcurrent, short-circuit, and temperature monitoring to enhance system safety and reliability. It supports SMBus and I²C communication interfaces for host processor interaction and system diagnostics. Internal flash memory allows programmable configuration parameters, calibration data, and battery profile storage. The BQ41Z50RSNR is optimized for compact battery-powered systems requiring accurate fuel gauging, low power consumption, and robust battery protection capabilities. Typical applications include notebooks, handheld devices, industrial instruments, portable medical equipment, smart battery packs, and embedded rechargeable systems. Engineering Specification Device Type Battery Fuel Gauge and Battery Management IC Battery Chemistry Support Lithium-Ion and Lithium-Polymer Cell Configuration Supports multi-cell battery pack configurations Fuel Gauging Technology Impedance Track™ battery fuel gauging Integrated Functions Battery monitoring State-of-charge estimation State-of-health estimation Remaining runtime prediction Battery protection Cell balancing support Authentication support Temperature monitoring Data logging and diagnostics Protection Features Overvoltage protection Undervoltage protection Overcurrent protection Short-circuit protection Charge and discharge protection Thermal protection Communication Interface SMBus compatible I²C compatible interface Non-Volatile Memory Integrated flash memory for configuration and battery profile storage Measurement Functions Battery voltage measurement Current measurement Temperature sensing Capacity tracking Cycle count monitoring Operating Voltage Designed for rechargeable battery pack applications Power Consumption Low-power operation optimized for portable devices Package Type QFN package Mounting Type Surface-mount device Operating Temperature Range Industrial operating temperature range suitable for portable and embedded applications Typical Applications Smart battery packs Portable electronics Industrial handheld equipment Medical portable devices Rechargeable embedded systems Battery-powered instrumentation #commonpartslibrary #integratedcircuit #powermanagement

17 Position FFC, FPC Connector Contacts, Bottom 0.020" (0.50mm) Surface Mount, Right Angle The F300-1B7H1-11017-E100 is a board-to-board / mezzanine connector designed for high-density interconnections in compact electronic assemblies. It is typically used in applications requiring reliable signal transmission between stacked PCBs, offering precise alignment, robust mechanical retention, and consistent electrical performance. This type of connector is commonly found in industrial electronics, embedded systems, communication devices, and compact consumer electronics where space-saving and high pin-count connectivity are critical. Key Features High-density board-to-board connection Compact form factor for space-constrained designs Reliable contact system for stable signal integrity Precision alignment for accurate mating Durable construction for repeated mating cycles Suitable for high-speed and low-power signal transmission Electrical Characteristics Rated Voltage: Typically 30–100 V (application dependent) Current Rating: Typically 0.3–1.0 A per contact Contact Resistance: Low (typically < 50 mΩ) Insulation Resistance: High (≥ 100 MΩ) Dielectric Withstanding Voltage: ~250–500 VAC Mechanical Characteristics Mounting Type: Surface Mount (SMT) Mating Type: Board-to-board / mezzanine Contact Configuration: High pin-count array Pitch: Typically fine pitch (e.g., 0.3 mm – 0.8 mm range) Mating Cycles: 30–100 cycles (typical) Housing Material: High-temperature thermoplastic Contact Material: Copper alloy with gold plating Environmental Characteristics Operating Temperature Range: -40°C to +85°C (typical) RoHS Compliant: Yes Moisture Sensitivity Level: Standard SMT classification Applications Embedded systems Industrial control electronics Communication devices Portable and compact consumer electronics PCB stacking architectures Packaging Supplied in tape and reel for automated SMT assembly Notes Exact electrical and mechanical values may vary depending on manufacturer specifications and variant configuration Recommended to verify mating connector compatibility and stack height before design implementation Follow manufacturer PCB footprint guidelines for optimal performance #commonpartslibrary #connector

74AUP Series 3.6 V 4 mA Low-Power Inverter with Voltage-Level Translator-TSSOP-5 #commonpartslibrary #integratedcircuit #inverter #schmitt #nexperia

Pressure Sensor 4.35PSI ~ 18.13PSI (30kPa ~ 125kPa) 9-LGA The BMP585 is a high-precision digital barometric pressure sensor designed for accurate altitude and environmental pressure measurement in compact, low-power embedded systems. It integrates a MEMS sensing element with advanced signal conditioning and digital compensation circuitry to provide highly stable and reliable pressure and temperature data across a wide operating range. The device is optimized for portable electronics, industrial sensing, indoor navigation, weather monitoring, drones, and IoT applications requiring precise atmospheric measurements. The sensor supports digital communication through standard serial interfaces, enabling straightforward integration with modern microcontrollers and processors. Its low noise performance, high resolution, and fast response characteristics make it suitable for applications involving motion tracking, vertical positioning, and environmental monitoring. The compact surface-mount package allows efficient PCB layout integration in space-constrained designs. The BMP585 incorporates configurable sampling, filtering, and power management features to balance measurement accuracy, bandwidth, and energy consumption. Internal calibration and compensation algorithms reduce system-level complexity while improving long-term stability and measurement consistency. The device is designed for robust operation under varying environmental conditions and supports low-power modes for battery-operated systems. Engineering Specification Device Type Digital barometric pressure and temperature sensor Sensor Functions Atmospheric pressure sensing Temperature sensing Altitude estimation support Pressure Measurement High-resolution MEMS pressure sensing element Integrated digital compensation and calibration Low-noise pressure measurement architecture Temperature Measurement Integrated temperature sensing for environmental monitoring and pressure compensation Communication Interface I²C interface support SPI interface support Power Features Low-power operation Configurable performance and sampling modes Sleep and standby operating capability Signal Processing Integrated digital filtering Configurable oversampling Internal compensation engine Package Information Compact surface-mount package RoHS-compliant construction Operating Characteristics High measurement stability Fast response time Designed for portable and industrial environments Application Areas Wearable devices Indoor navigation systems Portable weather stations Industrial monitoring IoT sensing nodes Drones and altitude tracking systems Consumer electronics #commonpartslibrary #integratedcircuit #pressuresensor

CH32V003 series is an industrial-grade general-purpose microcontroller designed based on QingKe RISC-V2A core, which supports 48MHz system main frequency in the product function. The series features wide voltage, single-wire serial debug interface, low-power consumption and ultra-small package. It provides commonly used peripheral functions, built-in 1 group of DMA controller, 1 group of 10-bit analog-to-digital conversion ADC, 1 group of op-amp comparator, multiple timers, standard communication interfaces such as USART, I2C, SPI, etc. The rated operating voltage of the product is 3.3V or 5V, and the operating temperature range is -40℃～85℃ industrial- grade. #CommonPartsLibrary #Microcontroller #CH32V003F4P6.

dsPIC dsPIC™ 33CK, Functional Safety (FuSa) Microcontroller IC 16-Bit 100MHz 256KB (256K x 8) FLASH 48-UQFN (6x6) 28/36/48/64/80-Pin Digital Signal Controllers with High-Resolution PWM and CAN Flexible Data (CAN FD) Operating Conditions • 3.0V to 3.6V, -40°C to +125°C, DC to 100 MIPS • 3.0V to 3.6V, -40°C to +150°C, DC to 70 MIPS Core: 16-Bit dsPIC33CK CPU • 32-256 Kbytes of Program Flash with ECC and 8-24K RAM • Fast 6-Cycle Divide • LiveUpdate • Code Efficient (C and Assembly) Architecture • 40-Bit Wide Accumulators • Single-Cycle (MAC/MPY) with Dual Data Fetch • Single-Cycle, Mixed-Sign MUL Plus Hardware Divide • 32-Bit Multiply Support • Four Sets of Interrupt Context Saving Registers which Include Accumulator and STATUS for Fast Interrupt Handling • Zero Overhead Looping • RAM Memory Built-In Self-Test (MBIST) Clock Management • Internal Oscillator • Programmable PLLs and Oscillator Clock Sources • Reference Clock Output • Fail-Safe Clock Monitor (FSCM) • Fast Wake-up and Start-up • Backup Internal Oscillator Power Management • Low-Power Management Modes (Sleep, Idle, Doze) • Integrated Power-on Reset and Brown-out Reset High-Speed PWM • Eight PWM Pairs • Up to 250 ps PWM Resolution • Dead Time for Rising and Falling Edges • Dead-Time Compensation • Clock Chopping for High-Frequency Operation • PWM Support for: - DC/DC, AC/DC, inverters, PFC, lighting - BLDC, PMSM, ACIM, SRM motors • Fault and Current Limit Inputs • Flexible Trigger Configuration for ADC Triggering Timers/Output Compare/Input Capture • One General Purpose Timer • Peripheral Trigger Generator (PTG): - Up to 15 trigger sources to other peripheral modules - CPU independent state machine-based instruction sequencer • Nine MCCP/SCCP modules which Include Timer, Capture/Compare and PWM: - One MCCP - Eight SCCPs - 16 or 32-bit time base - 16 or 32-bit capture - 4-deep capture buffer • Fully Asynchronous Operation, Available in Sleep Modes #CommonPartsLibrary #IntegratedCircuit #Microcontroller #DSPIC33CK256MP

Low-Power, Low Offset Voltage, Rail-to-Rail Operational Amplifier 14-SOIC #CommonPartLibrary #IntegratedCircuits #Amplifiers #Instrumentation #OPAmp #BufferAmps #Linear #OPA4196

Low-Power, Quad-Operational Amplifiers 14-TSSOP #CommonPartLibrary #IntegratedCircuits #Amplifiers #Instrumentation #OPAmp #BufferAmps #Linear #ADA4807

Low-Power, Rail-to-Rail In/Out, 1-MHz Operational Amplifier for Cost-Sensitive Systems SC-70-5 #CommonPartLibrary #IntegratedCircuits #Amplifiers #Instrumentation #OPAmp #BufferAmps #Linear #TLV6001

36-V, Low-Power, Low Offset Voltage, Rail-to-Rail Operational Amplifier 8-SOIC #CommonPartLibrary #IntegratedCircuits #Amplifiers #Instrumentation #OPAmp #BufferAmps #Linear #OPA196

150 MHz to 960 MHz Low Power Long Range Transceiver, 22dBm output power, spreading factor from 5 to 12, LoRA, QFN-24 low-power lora transceiver QFN*1EP*4x4mm*P0.5mm*

1-MHz, Low-Power, General-Purpose, 2.7-V Operational Amplifiers SC-70-6 #CommonPartLibrary #IntegratedCircuits #Amplifiers #Instrumentation #OPAmp #BufferAmps #Linear #LMV601

This is an Energy Meter project leveraging an ATTiny85 microcontroller (U1) to sense current through an ACS712 module (U2). It displays the data in real-time on an OLED display (OLED1) and interacts with three buttons (NEXT, MENU, OK). This compact energy meter is suitable for edge computing and low-power Internet of Things (IoT) applications #project #keypad #arduino #attiny85 #ISP #reusable #module #edge-computing #edgeComputing #microchip #sublayout

Power Management Specialized - PMIC Automotive 2.8-V to 5.5-V PMIC The TPS6593C3A0RWERQ1 is an automotive-grade power management integrated circuit (PMIC) designed by Texas Instruments for advanced processor and system-on-chip power architectures. The device integrates multiple high-efficiency DC/DC buck converters, low-dropout regulators, power sequencing, safety monitoring, and diagnostic functions into a single compact package. It is optimized for use in automotive ADAS, digital cockpit, gateway, radar, vision, and domain controller applications requiring functional safety compliance and high power density. The device supports complex multi-rail power management for high-performance processors and includes configurable startup and shutdown sequencing, voltage monitoring, watchdog functionality, error signaling, and fault protection mechanisms. Integrated communication interfaces enable configuration and monitoring by an external host processor. The PMIC is qualified for automotive applications and supports operation across extended temperature ranges suitable for harsh automotive environments. Key Features Automotive AEC-Q100 qualified power management IC for processor power systems Integrated multi-phase step-down buck converters for high-current rails Integrated low-dropout linear regulators for analog and auxiliary rails Programmable power sequencing and rail management Functional safety support suitable for ASIL-oriented system architectures Integrated watchdog timer and safety monitoring functions Voltage supervision and fault detection for all major rails I2C and SPI communication interface support Power-good outputs and interrupt signaling Thermal shutdown and overtemperature protection Overcurrent and short-circuit protection Undervoltage and overvoltage monitoring Configurable GPIO functionality Low-power standby and sleep mode support Optimized for automotive SoCs and processors High-efficiency switching regulator architecture Compact VQFN package with thermal enhancement Electrical Characteristics Input supply voltage range supports automotive battery-powered systems Multiple programmable buck converter output voltages Integrated LDO outputs for precision analog and digital domains High switching frequency operation for reduced external component size Wide operating junction temperature range suitable for automotive environments Low shutdown current for standby operation High-current capability for processor core supplies Accurate voltage regulation and monitoring Protection and Safety Features Thermal shutdown protection Buck converter cycle-by-cycle current limiting Short-circuit protection on power rails Undervoltage lockout protection Power sequencing fault management Watchdog monitoring for processor supervision Diagnostic interrupt and fault reporting capability Safe-state transition support during fault conditions Package Information Package type: VQFN Package option: RWE Automotive-grade Q1 qualified device RoHS compliant Surface-mount package optimized for thermal performance Typical Applications Automotive domain controllers ADAS processing modules Digital cockpit systems Automotive gateway and networking platforms Radar and vision systems Processor and FPGA power management Industrial high-performance embedded systems #commonpartslibrary #integratedcircuit #powermanagement

LED Lighting Driver ICs LED Lighting Drivers 4-Channel RGBW Driver, I2C, 1.5x1.5mm TDFN The KTD2027BEWE-TR is a highly integrated, low-power RGB LED driver designed for portable and battery-powered applications. It features a compact WLCSP package and provides precise current control for up to three LED channels. The device includes an I²C-compatible interface, enabling flexible control of brightness, color mixing, and lighting effects. Integrated features such as programmable current sinks, dimming control, and built-in protection mechanisms make it suitable for indicators, backlighting, and decorative lighting in consumer electronics. Key Features Triple-channel constant current LED driver (RGB support) I²C-compatible digital interface Independent brightness control per channel Programmable current up to ~24 mA per channel Built-in PWM dimming and pattern generation Low quiescent current for power-sensitive applications Wide input voltage range Thermal shutdown and overcurrent protection Small WLCSP package (suitable for compact designs) Applications Mobile devices and wearables Status indicators and notification LEDs Backlighting and decorative lighting IoT and portable electronics Absolute Maximum Ratings Supply Voltage (VDD): −0.3 V to +6.0 V Logic Input Voltage: −0.3 V to VDD + 0.3 V Operating Temperature Range: −40°C to +85°C Storage Temperature Range: −55°C to +150°C Recommended Operating Conditions Supply Voltage (VDD): 1.8 V to 5.5 V LED Forward Voltage: Dependent on external LEDs Ambient Temperature: −40°C to +85°C Electrical Characteristics (Typical) Supply Current (Idle): < 1 µA (shutdown mode) Channel Current Accuracy: ±5% (typical) Maximum Output Current: ~24 mA per channel I²C Clock Frequency: Up to 400 kHz (Fast Mode) Functional Description The KTD2027BEWE-TR operates as a constant-current sink driver for RGB LEDs. Each channel can be independently programmed via the I²C interface to control brightness and enable dynamic lighting effects. Internal PWM generators allow smooth dimming without requiring continuous microcontroller intervention. The device also integrates protection features such as thermal shutdown and current limiting to ensure reliable operation. Pin Configuration (Typical WLCSP) VDD – Power supply GND – Ground SDA – I²C data line SCL – I²C clock line LED1 – Current sink output (Red) LED2 – Current sink output (Green) LED3 – Current sink output (Blue) Package Information Package Type: WLCSP (Wafer-Level Chip Scale Package) Mounting: Surface mount Tape & Reel: Yes (TR suffix) Ordering Information KTD2027BEWE-TR: Tape and reel packaging for automated assembly #commonpartslibrary #integratedcircuit #leddriver

Low-Power Quad-Channel Digital Isolator, 150Mbps, 2.5-5.5V, 2.5kV isolation, Fail-Safe Low, SOIC-16W 4Ch 4In Quad Digital Isolator 150Mbps SOIC*7.5x10.3mm*P1.27mm*