HDSP-K511
Display Modules - LED Character and Numeric Green 7-Segment 2 Character Common Anode 2.1V 10mA 0.670" H x 0.990" W x 0.315" D (17.02mm x 25.15mm x 8.00mm) 18-DIP (0.600", 15.24mm) #commonpartslibrary #optoelectronics #displaymodule #ledcharacter... show more17 Uses
0 Stars
TPS48100QDGXRQ1
High-Side Gate Driver IC Non-Inverting 19-VSSOP The TPS48100QDGXRQ1 is an automotive-grade dual high-side gate driver integrated circuit manufactured by Texas Instruments. It is designed to drive external N-channel power MOSFETs configured as high-side switches, providing the gate-drive voltage and current needed to turn the switches fully on and off with controlled timing. The device targets automotive and other harsh-environment power switching applications where a robust, low quiescent current solution is needed to control loads such as motors, relays, solenoids, lighting, and other inductive or resistive loads powered from a vehicle battery rail. As a member of TI's automotive low-IQ high-side driver portfolio, the device is built to tolerate the wide voltage swings and transient conditions characteristic of automotive electrical systems, including load dump events and cold-crank voltage sags, while maintaining very low standby current draw when the driven loads are not active. This low quiescent current characteristic is particularly valuable in always-on automotive modules, where minimizing parasitic battery drain during vehicle-off states is a key design requirement. The device's two independent driver channels operate synchronously, allowing coordinated control of dual high-side switches from a shared set of control and protection circuitry, which is useful in applications such as dual-channel load switching, H-bridge-adjacent driver stages, or redundant power path control. The non-inverting input structure means that the gate driver outputs follow the logic state of the input control signals directly, simplifying integration with microcontroller-based control logic without requiring additional inverting stages. Internally, the device manages the charge pump or bootstrap circuitry needed to generate a gate voltage above the battery rail, which is necessary to fully enhance an N-channel MOSFET configured in the high-side position. This internal voltage generation simplifies the external bill of materials compared to discrete charge-pump driver implementations. The device is qualified to automotive electronics reliability standards, reflecting the rigorous stress testing and quality requirements expected of components used in vehicle electrical and powertrain-adjacent systems. It is housed in a small-outline surface-mount package suited to space-constrained automotive control module designs, and it is supplied in tape-and-reel or cut-tape packaging formats to support both high-volume automated assembly and lower-volume prototyping needs. Spec Sheet Identification Part Number: TPS48100QDGXRQ1 Device Family: TPS48100-Q1 Manufacturer: Texas Instruments Functional Classification Device Type: Dual high-side gate driver IC Driven Configuration: High-side Channel Type: Synchronous, dual independent drive channels Gate Type Driven: N-channel power MOSFET Input Logic: Non-inverting Electrical Characteristics Supply Voltage Range: Wide automotive-class supply range Quiescent Current: Low-IQ class, optimized for always-on automotive modules Output Drive Current: Symmetric source and sink peak output current Internal Gate Drive Generation: Integrated charge pump/bootstrap-style high-side gate drive generation Protection & Diagnostics Application Context: Suited for protected high-side switching designs typical of the automotive driver family Robustness: Designed to tolerate automotive transient and load-dump conditions Environmental & Qualification Temperature Grade: Extended automotive operating temperature range Automotive Qualification: AEC-Q100 qualified RoHS Compliance: Yes Package Package Type: Small-outline surface-mount package, VSSOP style Mounting: Surface mount technology (SMT) Packaging Format Supply Format: Tape-and-reel, cut-tape, or reel-on-demand packaging options #TPS48100 #TexasInstruments #GateDriver #HighSideDriver #AutomotiveIC #AECQ100 #PowerManagement #MOSFETDriver #LowIQ #VSSOP #SurfaceMount #AutomotiveElectronics #PowerSwitching #SemiconductorIC #EngineeringSpec #ComponentLibrary #CommonPartsLibrary #RoHSCompliant #VehicleElectronics #PCBDesign... show more4 Uses
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SIWG917Y111MGABAR
Bluetooth, WiFi 802.11b/g/n/ax, Bluetooth v5.4 Transceiver Module 2.4GHz Integrated, Chip Surface Mount Silicon Labs SiWG917 module is our lowest power Wi-Fi 6 plus Bluetooth LE 5.4, ideal for ultra-low power IoT wireless devices using Wi-Fi®, Bluetooth, Matter, and IP networking for secure cloud connectivity. It is optimal for developing battery operated devices that need long battery life. SiWG917 module includes an ultra-low power Wi-Fi 6 plus Bluetooth Low Energy (LE) 5.4 wireless CPU subsystem, and an integrated micro-controller (MCU) application subsystem, security, peripherals and power management subsystem all in a single 16 x 21.1 x 2.3 mm package. The wireless subsystem consists of a multi-threaded Network Wireless Processor (NWP) running up to 160 MHz, baseband digital signal processing, analog front end, 2.4 GHz RF transceiver and integrated power amplifier. The application subsystem consists of an ARM® Cortex®-M4 running up to 180 MHz, embedded SRAM, flash, ultra-low power sensor hub, and matrix vector processor. The ARM® Cortex®-M4 is dedicated for peripheral and application-related processing, while the NWP runs the wireless and networking stacks on independent threads, thus providing a fully integrated solution that is ready for a wide range of embedded wireless IoT applications. The modules come with modular radio type approvals for various countries, including USA (FCC), Canada (IC/ISED) and Japan (MIC), and are in compliance with the relevant EN standards (including EN 300 328 v2.2.2) for the conformity with the directives and regulations in EU and UK. KEY FEATURES • Wi-Fi 6 Single Band 2.4 GHz 20 MHz 1x1 stream IEEE 802.11 b/g/n/ax • Bluetooth LE 5.4 • Single chip Matter Over Wi-Fi Solution • ARM® Cortex® M4 Processor with FPU subsystem up to 180 MHz with rich set of Digital and Analog Peripherals. • Wi-Fi 6 Benefits: TWT for improved efficiency and longer battery life, MUMIMO/OFDMA for Higher Throughput, network capacity and low latency • Best in Class Device and Wireless Security • WLAN Tx power up to +17.5 dBm with integrated PA • Bluetooth LE Tx power up to +17 dBm with integrated PA • WLAN Rx sensitivity as low as -95.5 dBm • Wi-Fi 4 Standby Associated mode current: 71 μA @ 1-second listen interval • Embedded Flash option up to 8 MB/ optional external Flash up to 16 MB • Embedded PSRAM option up to 2 MB/ optional external PSRAM option up to 16 MB • Ultra-low power sensor hub peripherals • Matrix Vector Processor (MVP) • Embedded Wi-Fi, Bluetooth LE, Matter, and networking stacks supporting wireless coexistence • Three software-configurable MCU application memory options for sharing the RAM between the wireless, system, and application (192/256/320 KB) • Operating temperature: -40 to +85 ºC • Operating supply range: 3.0 to 3.63 V • Supply voltage for GPIOs: 1.71 to 3.63 V #WiFi6 #BluetoothLE54 #IoTModule #WirelessSoC #SiliconLabs #EmbeddedSystems #SmartHome #IndustrialIoT #LowPowerDesign #RFModule #ConnectedDevices #EdgeComputing #MatterReady #PCBDesign #ElectronicsEngineering... show more577 Uses
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AL8866QSP-13
LED Driver IC 1 Output DC DC Controller SEPIC, Step-Down (Buck), Step-Up (Boost) Analog, PWM Dimming 8-SO-EP # AL8866QSP-13 Engineering Specifications **General Description** The AL8866QSP-13 is an automotive-qualified, multi-topology DC-switching LED controller manufactured by Diodes Incorporated. It is designed to control an external power MOSFET for high-power automotive LED lighting systems. The device supports buck, boost, buck-boost and single-ended primary-inductance converter configurations. Its wide input-voltage range makes it suitable for automotive power systems and various high-voltage LED applications. The controller uses fixed-frequency peak current-mode regulation with spread-spectrum frequency modulation to reduce electromagnetic interference. It supports both analog and pulse-width-modulation dimming through the DIM input. An integrated programmable soft-start function gradually increases the inductor and switching currents during startup to reduce output-voltage and current stress. The open-drain fault output provides system-level fault reporting for abnormal operating conditions. **Engineering Specifications** **Manufacturer:** Diodes Incorporated **Manufacturer Part Number:** AL8866QSP-13 **Component Type:** Automotive LED driver controller **Converter Topologies:** Buck, boost, buck-boost and SEPIC **Control Architecture:** Fixed-frequency peak current-mode control **External Switching Device:** External power MOSFET **Minimum Input Voltage:** Four point seven volts **Maximum Input Voltage:** Eighty-five volts **Maximum Output Voltage:** Eighty-five volts **Switching Frequency:** Four hundred kilohertz **Frequency Modulation:** Spread-spectrum modulation for reduced electromagnetic interference **LED Current Control:** External current-sense resistor and external MOSFET configuration **Feedback Voltage:** Two hundred millivolts **Typical Quiescent Current:** One point eight milliamperes **Typical Efficiency:** Up to approximately ninety-three percent, depending on the application circuit and external components **Dimming Methods:** Analog dimming and pulse-width-modulation dimming **Analog Dimming Range:** One percent to one hundred percent **Analog Dimming Dynamic Range:** Greater than one hundred to one **Pulse-Width-Modulation Dimming Ratio:** One hundred to one at a two-hundred-hertz dimming frequency **Pulse-Width-Modulation Frequency Range:** Approximately one hundred hertz to one kilohertz **Full-Brightness Current Accuracy:** Approximately plus or minus three percent **Low-Level Dimming Current Accuracy:** Approximately plus or minus twelve percent at twenty-percent dimming **Soft-Start Function:** Externally programmable **Fault Output:** Active-low open-drain fault indicator **Protection Features:** Output overvoltage protection, LED open-circuit protection, output undervoltage protection, LED short-circuit protection, cycle-by-cycle overcurrent limitation, current-sense resistor short-circuit protection, inductor and diode short-circuit detection, diode open-circuit protection and thermal shutdown **Automotive Qualification:** AEC-Q100 Grade One qualified **Automotive Documentation:** PPAP capable **Manufacturing Standard:** Manufactured in IATF-certified automotive facilities **Operating Temperature Range:** Minus forty degrees Celsius to positive one hundred twenty-five degrees Celsius **Package Type:** Thermally enhanced SO-8 exposed-pad package **Pin Count:** Eight leads with exposed thermal ground pad **Mounting Style:** Surface mount **Packing Method:** Thirteen-inch tape and reel **Standard Packing Quantity:** Two thousand five hundred components per reel **Moisture Sensitivity:** Level One **Terminal Finish:** Matte-tin-plated leads **Environmental Compliance:** Lead-free, RoHS compliant, halogen-free and antimony-free **Typical Applications** Automotive high-beam and low-beam lighting Automotive daytime running lights Automotive fog lights Automotive turn-signal lights Automotive position lights Automotive brake and stop lights High-power exterior LED lighting Multi-topology automotive LED driver modules #AL8866QSP13 #AL8866Q #DiodesIncorporated #LEDDriver #AutomotiveLED #AutomotiveElectronics #BuckConverter #BoostConverter #BuckBoostConverter #SEPICConverter #PowerElectronics #LEDLighting #ElectronicComponents #EngineeringSpecifications... show more5 Uses
0 Stars
ESP32-S3-MINI-1-N8
WiFi Modules - 802.11 SMD Module, ESP32-S3FN8, 8 MB SPI Flash, PCB Antenna #CommonPartsLibrary #Wifi #module... show more504 Uses
1 Star
E01-ML01DP5
Through Hole RF Modules ROHS #Module #Part #loT #Communication-module... show more9 Uses
1 Star