2.2µH Unshielded Molded Inductor 17 A 3.7mOhm 2-SMD, J-Lead The MPL-AY1265-2R2 is a 2.2 µH surface-mount molded power inductor from Monolithic Power Systems (MPS). It is designed for high-current DC-DC switching power supplies and power management applications requiring low DC resistance (DCR), high efficiency, and stable inductance over a wide operating temperature range. Its molded construction minimizes audible noise and provides excellent mechanical reliability for compact, high-performance electronic designs. Key Features 2.2 µH inductance with ±20% tolerance High rated current: up to 17 A Low DC resistance: 3.7 mΩ typ. (4.3 mΩ max.) Soft saturation characteristics for improved reliability Molded construction for enhanced durability and reduced EMI Low audible noise during switching operation Stable performance across a wide temperature range Operating temperature: −40°C to +155°C Compact SMD package: 13.5 × 12.6 × 6.2 mm RoHS/REACH compliant and halogen-free Typical Applications Battery-powered devices Portable electronics Embedded computing systems High-current switching mode power supplies (SMPS) High-frequency DC-DC converters Point-of-load (POL) converters FPGA power rails #MoldedInductor #PowerInductor #2_2uH #HighCurrent #LowDCR #SMPS #DCDCConverter #PowerManagement #SMD #MonolithicPowerSystems #RoHS #EmbeddedSystems

Battery Power Management IC Lithium Ion/Polymer 24-QFN (4x4) nPM1100 is an integrated Power Management IC (PMIC) with a linear-mode lithium-ion/lithium-polymer battery charger in a compact 2.1x2.1 mm WLCSP package. It has a highly efficient, dual-mode configurable output DC/DC buck regulator. nPM1100 is an extremely compact PMIC device, created for space constrained applications with a small lithium-ion or lithium-polymer battery. It is compatible with all nRF52 and nRF53 Series SoCs and supports charging batteries at up to 500 mA through USB, and also delivers up to 150 mA of current to power external components with regulated voltage. A minimum of five passive components are required for operation and the device functions without a control interface. It is the perfect companion for nRF52 and nRF53 multiprotocol SoCs in battery powered designs. Low quiescent current (IQ) extends battery life during shipping and storage with Ship mode, or in operation using auto-controlled hysteretic buck mode for high efficiency down to 1 µA loads. Charge and error indication LED drivers are built in. Charge profile limits are configurable and VBUS current limits can be fixed or auto-controlled with on-chip USB port detection. • 400 mA linear battery charger • Linear charger for lithium-ion/lithium-polymer batteries • Adjustable charge current from 20 mA to 400 mA • Selectable termination voltage of 4.1 V or 4.2 V • Automatic trickle, constant current, and constant voltage charging • Battery thermal protection • Discharge current limitation • JEITA compliant • Li-ion/Li-polymer USB battery charger with a high efficiency buck regulator • 800 nA - Typical quiescent current • 460 nA - Shipping mode quiescent current • Thermal protection • Input regulator • USB compatible current limit of 100 mA and 500 mA • 4.1 V to 6.7 V input voltage range for normal operation • 20 V overvoltage protection • Reverse current protection • 3.0 V to 5.5 V system voltage output • USB port detection supporting the following types: • SDP • CDP/DCP • 1.8 V to 3.0 V, 150 mA step-down buck regulator • Step-down buck regulator with up to 92% efficiency • Automatic transition between hysteretic and pulse width modulation (PWM) modes • Forced PWM mode for clean power operation • Pin-selectable output voltage (1.8 V, 2.1 V, 2.7 V, 3.0 V) • Soft start-up • LED drivers for charger state indication • 5 mA low side LED driver for charging indication • 5 mA low side LED driver for error indication • 2.3 V to 4.35 V battery operating input range • 2.1x2.1 mm WLCSP package • Suitable for two layer PCB design #CommonPartsLibrary #IntegratedCircuit #NordicSemiconductor #nPM1100 #PMIC #BatteryCharger #PowerManagement #LiIon #LiPolymer #BuckConverter #Wearables #IoT #WirelessSensor #LowPowerDesign #USBCharging #EmbeddedSystems #nRF52 #nRF53 #PortableElectronics

QFN-68-EP(7x7) Power Management - Specialized RoHS The RK809-5 is a highly integrated Power Management Integrated Circuit (PMIC) from Rockchip designed for multi-core processor systems and embedded applications. It provides a complete power management solution by integrating multiple high-efficiency DC-DC buck converters, LDO regulators, power sequencing logic, battery fuel gauging, RTC functionality, and audio codec capabilities into a single device. The RK809-5 is commonly used alongside Rockchip SoCs in single-board computers, tablets, AIoT devices, and industrial embedded systems. Key Features Five high-efficiency synchronous buck converters with fast transient response. Nine low-dropout (LDO) voltage regulators for powering sensitive analog and digital circuits. Integrated battery fuel gauge for battery capacity monitoring. Configurable power-up and power-down sequencing (OTP programmable). Dynamic Voltage Scaling (DVS/DVFS) support via I²C interface. Integrated Real-Time Clock (RTC) with 32.768 kHz crystal oscillator support. Two integrated load switches for peripheral power control. Over-current, over-voltage, and thermal protection features. Built-in audio CODEC with headphone driver and Class-D amplifier support. Designed to minimize external component count and simplify power system design. QFN-68-EP (7 mm × 7 mm) package. #RK8095 #RK809 #Rockchip #PMIC #PowerManagementIC #BatteryManagement #AudioCodec #RTC #DVFS #EmbeddedSystems #SingleBoardComputer #IoT #IndustrialElectronics #PowerSupplyDesign #ElectronicsEngineering

The TGS2611-C00 specification defines the engineering requirements for a semiconductor gas sensor designed for the detection of combustible gases in industrial, commercial, and embedded monitoring systems. This specification establishes the functional, electrical, mechanical, environmental, and quality requirements necessary to ensure accurate gas detection, stable sensing characteristics, and long-term operational reliability. The sensor is intended for use in gas leak detection equipment, safety monitoring systems, residential and commercial appliances, industrial automation, and environmental monitoring applications. It utilizes semiconductor sensing technology to detect target combustible gases with high sensitivity and repeatable performance, enabling reliable monitoring and early warning in safety-critical environments. Engineering Requirements The gas sensor shall be manufactured using qualified semiconductor sensing materials and controlled production processes to ensure consistent sensitivity, repeatability, and long-term stability. The sensing element shall maintain reliable performance under specified operating voltage, temperature, humidity, and environmental conditions. Electrical characteristics shall provide stable output response, repeatable detection performance, and predictable recovery behavior following gas exposure. The sensor shall maintain reliable operation during continuous monitoring while minimizing drift and preserving measurement consistency throughout its service life. The sensing element shall provide dependable detection of the intended combustible gases while maintaining resistance to environmental influences and normal operational contaminants. The sensor shall exhibit stable response characteristics suitable for integration with embedded control systems and gas monitoring electronics. Mechanical construction shall provide adequate protection for the sensing element while allowing sufficient exposure to the surrounding atmosphere for effective gas diffusion. The package shall withstand handling, vibration, thermal cycling, and standard assembly processes without degradation of sensing performance or structural integrity. Workmanship shall be free from defects including contamination, mechanical damage, corrosion, package deformation, or structural inconsistencies that could adversely affect sensing accuracy or reliability. Inspection, validation, and testing shall be performed using calibrated equipment and controlled quality procedures to verify compliance with engineering and manufacturing requirements. Any deviation from this specification shall require formal engineering evaluation, documented technical justification, and approval through the established engineering change control process before implementation. Documentation Supporting documentation shall include engineering drawings, electrical specifications, gas sensitivity characteristics, qualification reports, inspection records, reliability data, material declarations, and revision-controlled manufacturing documentation. All documentation shall be maintained under formal configuration management and quality assurance systems to ensure complete product traceability. Revision Control Any modification to this specification shall be managed through the formal engineering change management process. All revisions shall undergo technical review, validation, and approval before release to ensure continued compliance with design intent and applicable engineering standards. #EngineeringSpecification #GasSensor #CombustibleGasSensor #SemiconductorSensor #GasDetection #IndustrialSafety #EmbeddedSystems #EnvironmentalMonitoring #QualityAssurance #EngineeringDocumentation

Bluetooth, WiFi 802.11b/g/n/ax, Bluetooth v5.4 Transceiver Module 2.4GHz Integrated, Chip Surface Mount Silicon Labs SiWG917 module is our lowest power Wi-Fi 6 plus Bluetooth LE 5.4, ideal for ultra-low power IoT wireless devices using Wi-Fi®, Bluetooth, Matter, and IP networking for secure cloud connectivity. It is optimal for developing battery operated devices that need long battery life. SiWG917 module includes an ultra-low power Wi-Fi 6 plus Bluetooth Low Energy (LE) 5.4 wireless CPU subsystem, and an integrated micro-controller (MCU) application subsystem, security, peripherals and power management subsystem all in a single 16 x 21.1 x 2.3 mm package. The wireless subsystem consists of a multi-threaded Network Wireless Processor (NWP) running up to 160 MHz, baseband digital signal processing, analog front end, 2.4 GHz RF transceiver and integrated power amplifier. The application subsystem consists of an ARM® Cortex®-M4 running up to 180 MHz, embedded SRAM, flash, ultra-low power sensor hub, and matrix vector processor. The ARM® Cortex®-M4 is dedicated for peripheral and application-related processing, while the NWP runs the wireless and networking stacks on independent threads, thus providing a fully integrated solution that is ready for a wide range of embedded wireless IoT applications. The modules come with modular radio type approvals for various countries, including USA (FCC), Canada (IC/ISED) and Japan (MIC), and are in compliance with the relevant EN standards (including EN 300 328 v2.2.2) for the conformity with the directives and regulations in EU and UK. KEY FEATURES • Wi-Fi 6 Single Band 2.4 GHz 20 MHz 1x1 stream IEEE 802.11 b/g/n/ax • Bluetooth LE 5.4 • Single chip Matter Over Wi-Fi Solution • ARM® Cortex® M4 Processor with FPU subsystem up to 180 MHz with rich set of Digital and Analog Peripherals. • Wi-Fi 6 Benefits: TWT for improved efficiency and longer battery life, MUMIMO/OFDMA for Higher Throughput, network capacity and low latency • Best in Class Device and Wireless Security • WLAN Tx power up to +17.5 dBm with integrated PA • Bluetooth LE Tx power up to +17 dBm with integrated PA • WLAN Rx sensitivity as low as -95.5 dBm • Wi-Fi 4 Standby Associated mode current: 71 μA @ 1-second listen interval • Embedded Flash option up to 8 MB/ optional external Flash up to 16 MB • Embedded PSRAM option up to 2 MB/ optional external PSRAM option up to 16 MB • Ultra-low power sensor hub peripherals • Matrix Vector Processor (MVP) • Embedded Wi-Fi, Bluetooth LE, Matter, and networking stacks supporting wireless coexistence • Three software-configurable MCU application memory options for sharing the RAM between the wireless, system, and application (192/256/320 KB) • Operating temperature: -40 to +85 ºC • Operating supply range: 3.0 to 3.63 V • Supply voltage for GPIOs: 1.71 to 3.63 V #WiFi6 #BluetoothLE54 #IoTModule #WirelessSoC #SiliconLabs #EmbeddedSystems #SmartHome #IndustrialIoT #LowPowerDesign #RFModule #ConnectedDevices #EdgeComputing #MatterReady #PCBDesign #ElectronicsEngineering

RF ANTENNA Bluetooth, Wi-Fi, WLAN, Zigbee™ Ceramic Patch Solder Surface Mount The SWLP.2450.10.4.A.02 specification defines the engineering requirements for a surface-mount radio frequency antenna designed for wireless communication applications operating within the 2.4 GHz frequency band. This specification establishes the functional, electrical, mechanical, environmental, and quality requirements necessary to ensure efficient RF transmission and reception, stable antenna performance, and long-term operational reliability in embedded electronic systems. The antenna is intended for use in wireless communication devices supporting technologies such as Bluetooth, Wi-Fi, Zigbee, Thread, and other 2.4 GHz ISM band protocols. It is optimized for compact PCB integration while providing efficient radiation characteristics, stable impedance matching, and dependable performance in space-constrained electronic products including IoT devices, industrial controllers, consumer electronics, and smart sensing platforms. Engineering Requirements The antenna shall be manufactured using qualified conductive and dielectric materials with controlled production processes to ensure consistent RF performance, mechanical durability, and long-term reliability. The construction shall maintain stable electrical characteristics throughout the specified operating temperature and environmental conditions. Electrical characteristics shall provide efficient radiation efficiency, stable impedance matching, low return loss, and reliable signal transmission and reception across the intended operating frequency range. The antenna shall maintain consistent performance when integrated according to the recommended PCB layout and grounding practices. The RF structure shall minimize insertion losses and support reliable wireless communication while maintaining acceptable gain, bandwidth, and radiation pattern characteristics. The antenna shall exhibit stable performance under normal operating conditions without significant degradation caused by thermal variation or environmental exposure. Mechanical construction shall be suitable for automated surface-mount assembly and compatible with standard solder reflow manufacturing processes. The package shall withstand vibration, thermal cycling, mechanical handling, and environmental stress without degradation of electrical or structural performance. Workmanship shall be free from defects including cracks, contamination, plating irregularities, or structural inconsistencies that could adversely affect RF performance or reliability. Inspection, validation, and testing shall be performed using calibrated RF measurement equipment and controlled quality procedures to verify compliance with engineering and manufacturing requirements. Any deviation from this specification shall require formal engineering evaluation, documented technical justification, and approval through the established engineering change control process before implementation. Documentation Supporting documentation shall include engineering drawings, RF performance specifications, impedance matching recommendations, qualification reports, inspection records, reliability data, material declarations, and revision-controlled manufacturing documentation. All documentation shall be maintained under formal configuration management and quality assurance systems to ensure complete product traceability. Revision Control Any modification to this specification shall be managed through the formal engineering change management process. All revisions shall undergo technical review, validation, and approval before release to ensure continued compliance with design intent and applicable engineering standards. #EngineeringSpecification #RFAntenna #WirelessCommunication #Antenna #Bluetooth #WiFi #IoT #EmbeddedSystems #QualityAssurance #EngineeringDocumentation