1-Channel Single ADC Delta-Sigma 60sps 16-bit Serial Automotive 8-DFN #commonpartslibrary #ADC #integratedcircuit

Hall Effect Sensor Single Axis 4-SIP #commonpartslibrary #sensor #currentsensor #hallsensor #integratedcircuit

Hall Effect Sensor Single Axis 4-SIP #commonpartslibrary #sensor #currentsensor #hallsensor #integratedcircuit

MAX98357A Series 5.5V 3.2W PCM Input Class D Audio Power Amplifier - TQFN-16 The MAX98357A/MAX98357B is an easy-to-use, low-cost, digital pulse-code modulation (PCM) input Class D amplifier that provides industry-leading Class AB audio performance with Class D efficiency. The digital audio interface automatically recognizes up to 35 different PCM and TDM clocking schemes which eliminates the need for I2C programming. Operation is further simplified by eliminating the need for an external MCLK signal that is typically used for PCM communication. Simply supply power, LRCLK, BCLK, and digital audio to generate audio! Furthermore, a novel pinout allows customers to use the cost-effective WLP package with no need for expensive vias (refer to Application Note 6643: Optimize Cost, Size, and Performance with MAX98357 WLP for more information). The digital audio interface is highly flexible with the MAX98357A supporting I2S data and the MAX98357B supporting left-justified data. Both ICs support 8 channel time division multiplexed (TDM) data. The digital audio interface accepts specified sample rates between 8kHz and 96kHz for all supported data formats. The ICs can be configured to produce a left channel, right channel, or (left/2 + right/2) output from the stereo input data. The ICs operate using 16/24/32-bit data for I2S and left-justified modes as well as 16-bit or 32-bit data using TDM mode. The ICs eliminate the need for the external MCLK signal that is typically used for PCM communication. This reduces EMI and possible board coupling issues in addition to reducing the size and pin count of the ICs. The ICs also feature a very high wideband jitter tolerance (12ns typ) on BCLK and LRCLK to provide robust operation. Active emissions-limiting, edge-rate limiting, and overshoot control circuitry greatly reduce EMI. A filterless spread-spectrum modulation scheme eliminates the need for output filtering found in traditional Class D devices and reduces the component count of the solution. The ICs are available in 9-pin WLP (1.345mm x 1.435mm x 0.64mm) and 16-pin TQFN (3mm x 3mm x 0.75mm) packages and are specified over the -40°C to +85°C temperature range. ● Single-Supply Operation (2.5V to 5.5V) ● 3.2W Output Power into 4Ω at 5V ● 2.4mA Quiescent Current ● 92% Efficiency (RL = 8Ω, POUT = 1W) ● 22.8μVRMS Output Noise (AV = 15dB) ● Low 0.013% THD+N at 1kHz ● No MCLK Required ● Sample Rates of 8kHz to 96kHz ● Supports Left, Right, or (Left/2 + Right/2) Output ● Sophisticated Edge Rate Control Enables Filterless Class D Outputs ● 77dB PSRR at 1kHz ● Low RF Susceptibility Rejects TDMA Noise from GSM Radios ● Extensive Click-and-Pop Reduction Circuitry ● Robust Short-Circuit and Thermal Protection ● Available in Space-Saving Packages: 1.345mm x 1.435mm WLP (0.4mm Pitch) and 3mm x 3mm TQFN ● Solution Size with Single Bypass Capacitor is 4.32mm2 Applications ● Single Li-ion Cell/5V Devices ● Smart Speakers ● Notebook Computers ● IoT Devices ● Gaming Devices (Audio and Haptics) ● Smartphones ● Tablets ● Cameras #commonpartslibrary #integratedcircuit #linearamplifier #mono

Bluetooth, WiFi 802.11b/g/n/ax, Bluetooth v5.4 Transceiver Module 2.4GHz Integrated, Chip Surface Mount Silicon Labs SiWG917 module is our lowest power Wi-Fi 6 plus Bluetooth LE 5.4, ideal for ultra-low power IoT wireless devices using Wi-Fi®, Bluetooth, Matter, and IP networking for secure cloud connectivity. It is optimal for developing battery operated devices that need long battery life. SiWG917 module includes an ultra-low power Wi-Fi 6 plus Bluetooth Low Energy (LE) 5.4 wireless CPU subsystem, and an integrated micro-controller (MCU) application subsystem, security, peripherals and power management subsystem all in a single 16 x 21.1 x 2.3 mm package. The wireless subsystem consists of a multi-threaded Network Wireless Processor (NWP) running up to 160 MHz, baseband digital signal processing, analog front end, 2.4 GHz RF transceiver and integrated power amplifier. The application subsystem consists of an ARM® Cortex®-M4 running up to 180 MHz, embedded SRAM, flash, ultra-low power sensor hub, and matrix vector processor. The ARM® Cortex®-M4 is dedicated for peripheral and application-related processing, while the NWP runs the wireless and networking stacks on independent threads, thus providing a fully integrated solution that is ready for a wide range of embedded wireless IoT applications. The modules come with modular radio type approvals for various countries, including USA (FCC), Canada (IC/ISED) and Japan (MIC), and are in compliance with the relevant EN standards (including EN 300 328 v2.2.2) for the conformity with the directives and regulations in EU and UK. KEY FEATURES • Wi-Fi 6 Single Band 2.4 GHz 20 MHz 1x1 stream IEEE 802.11 b/g/n/ax • Bluetooth LE 5.4 • Single chip Matter Over Wi-Fi Solution • ARM® Cortex® M4 Processor with FPU subsystem up to 180 MHz with rich set of Digital and Analog Peripherals. • Wi-Fi 6 Benefits: TWT for improved efficiency and longer battery life, MUMIMO/OFDMA for Higher Throughput, network capacity and low latency • Best in Class Device and Wireless Security • WLAN Tx power up to +17.5 dBm with integrated PA • Bluetooth LE Tx power up to +17 dBm with integrated PA • WLAN Rx sensitivity as low as -95.5 dBm • Wi-Fi 4 Standby Associated mode current: 71 μA @ 1-second listen interval • Embedded Flash option up to 8 MB/ optional external Flash up to 16 MB • Embedded PSRAM option up to 2 MB/ optional external PSRAM option up to 16 MB • Ultra-low power sensor hub peripherals • Matrix Vector Processor (MVP) • Embedded Wi-Fi, Bluetooth LE, Matter, and networking stacks supporting wireless coexistence • Three software-configurable MCU application memory options for sharing the RAM between the wireless, system, and application (192/256/320 KB) • Operating temperature: -40 to +85 ºC • Operating supply range: 3.0 to 3.63 V • Supply voltage for GPIOs: 1.71 to 3.63 V #WiFi6 #BluetoothLE54 #IoTModule #WirelessSoC #SiliconLabs #EmbeddedSystems #SmartHome #IndustrialIoT #LowPowerDesign #RFModule #ConnectedDevices #EdgeComputing #MatterReady #PCBDesign #ElectronicsEngineering

1A Single 5μA@1kV 1kV 1.1V@1A SOD-123FL Diodes - General Purpose 1N4007

Hall Effect Sensor Single Axis Radial Lead #commonpartslibrary #transducer #sensor

Bridge Rectifier Single Phase Standard 800V Through Hole GBU #commonpartslibrary #diodebridge #rectifier

Bipolar (BJT) Transistor Array 2 PNP (Dual) Matched Pair 65V 100mA 175MHz 380mW Surface Mount 6-TSOP The BCM856DS,115 is a dual matched PNP bipolar junction transistor (BJT) housed in a compact SOT-363 (SC-88) 6-pin surface-mount package. It consists of two independent PNP transistors with closely matched electrical characteristics, making it suitable for differential amplifier stages, current mirrors, and signal processing applications where symmetry and thermal tracking are important. Key Features Dual PNP transistor configuration in a single package Matched transistor pair for improved circuit stability Low collector-emitter saturation voltage High current gain consistency between channels Compact SOT-363 (SC-88) package for space-constrained designs Suitable for low-power and signal-level applications Electrical Characteristics (typical values unless otherwise noted) Collector-Emitter Voltage (VCEO): -45 V Collector-Base Voltage (VCBO): -50 V Emitter-Base Voltage (VEBO): -5 V Continuous Collector Current (IC): -100 mA per transistor Power Dissipation (Ptot): ~250 mW total DC Current Gain (hFE): 100 to 300 Transition Frequency (fT): ~100 MHz Package Information Package Type: SOT-363 (SC-88) Mounting: Surface Mount Pin Count: 6 Configuration: Dual PNP (E1, B1, C2, E2, B2, C1 pin arrangement depending on layout) Applications Differential amplifier input stages Current mirror circuits Signal amplification Analog front-end designs Matched pair transistor applications Additional Notes The two transistors are thermally coupled within the same package, improving matching over temperature variations Ideal for precision analog circuits requiring closely matched transistor characteristics Commonly used in compact and high-density PCB layouts #commonpartslibrary #transistor #bjt #pnp

Overcharge, overcurrent and overdischarge protection IC for single cell lithium-ion/polymer battery battery protection li-ion lipo overcurrent overdischarge overcharge SOT?23*

Bridge Rectifier Single Phase Standard 600V Through Hole GBU #commonpartslibrary #diodebridge #rectifier

Decoder/Driver Single 4-to-7 16-Pin PDIP Box #commonpartslibrary #integratedcircuit #powermanagement #displaydriver #leddriver

Bridge Rectifier Single Phase Standard 800 V Through Hole GBU #CommonPartsLibrary #Diode #BridgeRectifier

Bridge Rectifier Single Phase Standard 800 V Through Hole GBU #commonpartslibrary #diodebridge #rectifier