Wi-Fi® 4 + Bluetooth® 5 LE System-in-Package (SiP) MCU – Highly integrated 2.4 GHz wireless System-in-Package (SiP) featuring an ESP32-S3 dual-core Xtensa® LX7 microcontroller for IoT devices, smart home products, AIoT, edge computing, industrial automation, HMI, wearable devices, and embedded wireless applications. Operates at up to 240 MHz with 8 MB embedded Flash and 2 MB embedded PSRAM, eliminating the need for external memory and reducing PCB size. Supports Wi-Fi 802.11 b/g/n and Bluetooth® 5 LE (including Long Range and 2 Mbps PHY), with up to +20 dBm transmit power and 150 Mbps Wi-Fi data rate. Features native USB 2.0 OTG, vector instructions for AI acceleration, 45 programmable GPIOs, SPI, I²C, I²S, UART, USB, RMT, LCD/Camera interface, PWM, TWAI® (CAN), ADC, touch sensing, AES-XTS, SHA, RSA, ECC, HMAC, secure boot, Flash encryption, and a true random number generator (TRNG) for secure embedded applications. Operates from a 3.0 V to 3.6 V supply, over a −40°C to +85°C temperature range, and is housed in a compact 56-pin QFN (7 × 7 mm) package. #EspressifSystems #ESP32S3PICO1N8R2 #ESP32S3 #WirelessMCU #SystemInPackage #WiFi #Bluetooth5LE #DualCore #XtensaLX7 #USBOTG #AIoT #EmbeddedSystems

Rotary Encoder Incremental 24 Quadrature (Incremental) User Selectable 10 mA @ 5 VDC,-10 C to +70 C The PEC11J-9015F-S0024 is a compact surface-mount incremental rotary encoder from the Bourns PEC11J series, designed for user interface applications requiring precise rotational input and long operational life. It features a quadrature output with 24 pulses per revolution and includes an integrated momentary push-button switch, making it suitable for menu navigation, volume control, tuning systems, and industrial control panels. Its rugged metal shaft construction and high durability make it reliable for both consumer and professional electronic equipment. Key Features Incremental rotary encoder with 2-bit quadrature output 24 pulses per revolution (24 PPR) resolution Integrated momentary push-button switch Surface-mount gull-wing terminals Compact 12 mm encoder body Durable metal shaft and bushing Long rotational life of up to 100,000 cycles No detents for smooth continuous rotation Supports up to 60 RPM operating speed Operating temperature range: -10 °C to +70 °C IP40 rated enclosure Flatted shaft design for secure knob attachment Suitable for: Audio equipment Lighting consoles Consumer appliances Communication devices Test and measurement equipment Component Category #Sensor #Encoder #Transducer #PEC11J

Wio-E5 Dev Kit embedded with Wio-E5 STM32WLE5JC LoRa module that supports Long Range protocol on the global frequency band. It provides full GPIOs, which support various data protocols and interfaces such as RS485, Grove, male/female headers, etc. This makes it user-friendly because it allows for easy and flexible connections to other devices or components. It would be a perfect choice for fast testing and rapid prototyping of your Long Range IoT projects.

Low power long range transceiver module, SPI and parallel interface, 433 MHz, spreading factor 6 to12, bandwith 7.8 to 500kHz, -111 to -148 dBm, SMD-16, DIP-16 #RF #LoRa #STM32 #ARM #commonpartslibrary

Connector Header Through Hole 6 position 0.100" (2.54mm) The PEC06SAAN is a compact, low-cost incremental rotary encoder manufactured by Bourns. It is designed for user interface applications requiring precise rotational input, such as volume controls, menu navigation, and position sensing. This encoder provides reliable quadrature output signals and is suitable for through-hole PCB mounting. Its robust mechanical design ensures long operational life and consistent performance in consumer and industrial electronics. Key Features Incremental (relative) rotary encoder Compact, space-saving design Through-hole mounting configuration Quadrature output (A and B channels) Optional integrated push switch (depending on variant) Detent and non-detent options available High reliability with long rotational life RoHS compliant Electrical Characteristics Supply voltage: Typically 5 VDC (logic-level output) Output type: Digital quadrature (A/B signals) Contact resistance: ≤ 100 mΩ Insulation resistance: ≥ 100 MΩ @ 250 VDC Dielectric strength: 300 VAC for 1 minute Mechanical Characteristics Rotation type: Incremental Number of pulses per revolution (PPR): Typically 6 to 24 (variant dependent) Detent positions: Variant dependent Rotational torque: 10 to 70 gf·cm (typical range) Shaft length: Varies by suffix (e.g., 15 mm typical) Shaft type: Knurled or D-cut (variant dependent) Mounting type: Through-hole PCB Terminal type: PC pins Environmental Specifications Operating temperature range: −30°C to +70°C Storage temperature range: −40°C to +85°C Humidity: Up to 85% RH (non-condensing) Mechanical Life Rotational life: Up to 30,000 cycles (typical) Physical Dimensions Body size: Approximately 12 mm × 11 mm × 5 mm (excluding shaft) Shaft diameter: Typically 6 mm Pin pitch: Standard 2.54 mm Applications Consumer electronics (audio controls, appliances) Industrial control panels Embedded systems and microcontroller interfaces Automotive user interfaces Instrumentation and test equipment #commonpartslibrary #connector #header

Supervisor Open Drain or Open Collector 1 Channel SOT-23-5 The TPS382x family of supervisors provide circuit initialization and timing supervision, primarily for DSP and processor-based systems. During power on, RESET asserts when the supply voltage VDD becomes greater than 1.1V. Thereafter, the supply voltage supervisor monitors VDD and keeps RESET active low as long as VDD remains less than the threshold voltage, VIT−. An internal timer delays the return of the output to the inactive state (high) to make sure proper system reset. The delay time, td, starts after VDD has risen above the threshold voltage (VIT− + VHYS). When the supply voltage drops below the threshold voltage VIT−, the output becomes active (low) again. No external components are required. All the devices of this family have a fixed-sense threshold voltage, VIT–, set by an internal voltage divider. The TPS382x family also offers watchdog time out options of 200ms (TPS3820) and 1.6s (TPS3823, TPS3824, and TPS3828). • Power-on reset generator with a fixed delay time of 200ms (TPS3823, TPS3824, TPS3825, and TPS3828) or 25ms (TPS3820) • Manual reset input (TPS3820, TPS3823, TPS3825, and TPS3828) • Reset output available in active-low (TPS3820, TPS3823, TPS3824, and TPS3825), active-high (TPS3824 and TPS3825), and open drain (TPS3828) • Supply voltage supervision range: 2.5V, 3V, 3.3V, 5V • Watchdog timer (TPS3820, TPS3823, TPS3824, and TPS3828) • Supply current of 15μA (typical) • 5-pin SOT-23 package • Temperature range: −40°C to 85°C (−40°C to 125°C for TPS3823A-33) #CommonPartsLibrary #IntegratedCircuit #PowerManagement #Supervisor

10k Ohm ±5% 62.5mW Power Per Element Isolated 4 Resistor Network/Array ±200ppm/°C 1206 (3216 Metric), Concave, Long Side Terminals #CommonPartsLibrary #Resistor #resistor-array #EXB-V8

2 Position Wire to Board Terminal Block Horizontal with Board 0.375" (9.53mm) Through Hole # 1714971 ## General Description The 1714971 is a high-current printed circuit board terminal block manufactured by Phoenix Contact and designed for secure power and signal connections in industrial and commercial electronic equipment. The component utilizes a screw-clamp termination mechanism that provides reliable wire retention, low contact resistance, and long-term electrical stability. Its robust construction and through-hole mounting design make it suitable for applications requiring dependable field wiring, high-current handling capability, and resistance to mechanical stress. The terminal block is commonly used in power supplies, industrial automation systems, motor controllers, battery management systems, energy distribution equipment, instrumentation, and other applications requiring secure PCB-mounted power connections. ## Key Features ### Mechanical Characteristics * Through-hole PCB mounting * Screw-clamp wire termination * Side-entry wire connection * High-strength housing construction * Secure field-wire installation * Designed for repeated maintenance and servicing operations ### Electrical Characteristics * High-current carrying capability * Low contact resistance * Reliable electrical conductivity * Stable performance under demanding operating conditions * Suitable for power distribution and control applications ### Contact System * Corrosion-resistant conductive contacts * Screw-actuated clamping mechanism * Secure conductor retention * Reliable electrical connection during vibration and mechanical stress ### Material Construction * Industrial-grade thermoplastic housing * High-conductivity metal contacts * Flame-resistant insulation materials * RoHS-compliant construction ### Environmental Characteristics * Suitable for industrial environments * Resistant to mechanical wear * Durable under continuous operation * Designed for long service life ### Application Areas * Industrial Automation Equipment * Power Supply Systems * Motor Control Circuits * Battery Management Systems * Renewable Energy Equipment * Electrical Distribution Panels * Instrumentation Systems * Process Control Equipment * Embedded Power Electronics * Industrial Control Systems ### Compliance * RoHS Compliant * Lead-Free Compatible * Industrial-Grade PCB Interconnect Solution ## Manufacturer Phoenix Contact ## Product Family COMBICON PCB Terminal Blocks #PhoenixContact #1714971 #COMBICON #TerminalBlock #PCBTerminalBlock #ScrewTerminal #PowerConnector #IndustrialElectronics #PowerDistribution #IndustrialAutomation #EmbeddedSystems #ControlSystems #ElectronicsDesign #PCBAssembly #ElectricalEngineering

Accelerometer X, Y, Z Axis ±2g, 4g, 8g, 16g 0.5Hz ~ 625Hz 16-LGA (3x3) # LIS3DHTR ## General Description The LIS3DHTR is an ultra-low-power three-axis digital accelerometer manufactured by STMicroelectronics. It is designed to provide accurate motion, orientation, tilt, vibration, and acceleration sensing for a wide range of embedded and portable electronic applications. The device integrates advanced MEMS sensor technology, configurable measurement ranges, embedded motion-detection functions, and digital communication interfaces within a compact surface-mount package. Its low power consumption and high measurement accuracy make it suitable for wearable devices, industrial monitoring systems, asset tracking equipment, smart sensors, consumer electronics, medical devices, Internet of Things products, and battery-powered embedded systems. ## Key Features ### Sensor Architecture * Three-axis digital accelerometer * MEMS sensing technology * High-resolution motion measurement * Multi-axis acceleration detection * Real-time movement monitoring * Precision orientation sensing ### Measurement Capabilities * Motion detection functionality * Tilt sensing capability * Free-fall detection support * Vibration monitoring * Orientation recognition * Impact and shock detection * Activity and inactivity monitoring ### Electrical Characteristics * Ultra-low-power operation * Low current consumption * High measurement stability * Fast response capability * Reliable sensor performance * Optimized for battery-powered systems ### Embedded Processing Features * Integrated interrupt generation * Event detection capability * Motion recognition support * Threshold-based monitoring * Embedded motion-processing functions * Autonomous event reporting ### Communication Interfaces * SPI digital communication interface * I²C digital communication interface * Easy microcontroller integration * Reliable data transfer capability * Flexible system connectivity ### Package Characteristics * Compact surface-mount package * Low-profile design * Automated assembly compatible * High-density PCB layout support * Suitable for space-constrained applications ### Material Construction * Advanced MEMS sensor technology * High-reliability semiconductor integration * RoHS-compliant materials * Lead-free package construction * Industrial-grade manufacturing quality ### Environmental Characteristics * Long operational service life * Reliable operation under industrial conditions * Stable sensor performance over time * Resistant to mechanical stress and vibration * Suitable for continuous monitoring applications ### Application Areas * Wearable Electronics * Internet of Things Devices * Smart Sensors * Asset Tracking Systems * Industrial Monitoring Equipment * Consumer Electronics * Medical Devices * Portable Electronics * Motion Detection Systems * Vibration Monitoring Equipment * Fitness and Activity Tracking Devices * Embedded Control Systems ### Compliance * RoHS Compliant * Lead-Free Compatible * Industrial-Grade MEMS Motion Sensor Solution ## Manufacturer STMicroelectronics ## Product Family LIS3DH Three-Axis Digital Accelerometer Series #LIS3DHTR #STMicroelectronics #Accelerometer #MEMSSensor #MotionSensor #ThreeAxisAccelerometer #IoT #WearableDevices #EmbeddedSystems #IndustrialMonitoring #AssetTracking #VibrationMonitoring #ConsumerElectronics #ElectronicsEngineering #SensorTechnology

EEPROM Memory IC 256Kbit I2C 1 MHz 450 ns 8-SO The M24256E-FMN6TP is a 256-Kbit (32 Kbyte) I²C-compatible serial EEPROM from STMicroelectronics. It is designed for reliable, non-volatile data storage in a wide range of electronic applications including consumer, industrial, and automotive systems. The device supports standard (100 kHz), fast (400 kHz), and fast-mode plus (1 MHz) I²C communication, enabling efficient data transfer. It features byte and page write operations, low power consumption, and a high endurance of write cycles, making it suitable for frequent data logging and configuration storage. Housed in a compact SO8 package, the device is optimized for space-constrained PCB designs while maintaining robust performance and data retention capabilities. Key Features Memory size: 256 Kbit (32 Kbyte) Interface: I²C (2-wire serial interface) Clock frequency: Standard mode: 100 kHz Fast mode: 400 kHz Fast-mode Plus: 1 MHz Supply voltage range: 1.7 V to 5.5 V Page write capability: up to 64 bytes Write cycle time: ~5 ms (typical) Data retention: > 200 years Endurance: > 4 million write cycles Hardware write protection available ESD protection and latch-up immunity Functional Description The device operates as a slave on the I²C bus and supports: Byte write and read Page write (up to 64 bytes) Random and sequential read operations Memory addressing is internally managed using a 16-bit address pointer, allowing access to the full 32 KB memory array. The device includes an internal write cycle controller, eliminating the need for external timing management. Pin Configuration (SO8 Package) A0, A1, A2: Device address inputs VSS: Ground SDA: Serial data line SCL: Serial clock line WC: Write control (hardware write protection) VCC: Supply voltage Absolute Maximum Ratings Supply voltage (VCC): -0.3 V to 6.5 V Input voltage: -0.3 V to VCC + 0.6 V Storage temperature: -65°C to +150°C Operating temperature (industrial grade): -40°C to +85°C Electrical Characteristics Low standby current: < 1 µA (typical) Operating current: < 1 mA Input/output compatible with CMOS logic levels Schmitt trigger inputs for noise immunity Timing Characteristics Write cycle time: 5 ms (typical) Fast-mode Plus support up to 1 MHz Sequential read supports continuous data streaming Package Information Package type: SO8 (8-lead Small Outline) Mounting: Surface-mount (SMD) Tape & reel packaging (TP suffix) Applications Configuration storage Calibration data storage Data logging systems Industrial control systems Consumer electronics Embedded systems requiring non-volatile memory Advantages High endurance and long data retention Wide voltage range (ideal for mixed-voltage systems) Compact footprint High-speed I²C compatibility (up to 1 MHz) #commonpartslibrary #integratedcircuit #memory

64 Position Female Connector PCI Express™ Gold 0.039" (1.00mm) Black The PCIE-064-02-X-D-TH is a high-density PCI Express edge connector designed for reliable board-to-board and card-to-host connections in high-speed data communication applications. Manufactured by Samtec, this connector supports PCI Express signaling standards while providing robust mechanical and electrical performance for high-frequency, high-bandwidth systems. Its through-hole mounting and dual-row design ensure secure attachment to the PCB, high mating retention, and long operational life. The connector is ideal for computer peripherals, server systems, embedded computing platforms, networking devices, and industrial electronic equipment where signal integrity, mechanical reliability, and high-density interconnects are critical. Engineering Specifications Manufacturer: Samtec Part Number: PCIE-064-02-X-D-TH Series: PCI Express Edge Connector Connector Type: Board-to-Board / Card Edge Connector Contact Configuration: Dual-Row High-Density Contacts Mounting Style: Through-Hole Contact Material: Copper Alloy Contact Finish: Gold-Plated Contact Surface Housing Material: High-Temperature Thermoplastic Signal Performance: PCI Express Standard Compliant Electrical Performance: High-Speed Data Transmission Mechanical Durability: High Mating Cycle Life Orientation: Right Angle / Standard Edge Mount Operating Temperature Range: Industrial Grade RoHS Compliant: Yes Applications: PCI Express Expansion Cards, High-Speed Computing Systems, Server and Data Center Hardware, Embedded Platforms, Networking Equipment, Industrial Computing, High-Bandwidth Digital Interfaces, Board-Level Interconnects Key Features High-density dual-row PCIe edge contacts Through-hole mounting for robust PCB attachment Gold-plated contact interface for reliable signal transmission Supports high-speed PCI Express signaling Compact, high-density design for space-constrained PCBs Long mechanical life with repeated mating cycles Compatible with standard PCI Express cards and connectors Reliable operation in industrial and commercial environments Ideal for embedded computing, server, and networking applications Ensures signal integrity for high-bandwidth data communication #PCIE06402XDTH #Samtec #PCIeConnector #EdgeConnector #BoardToBoard #HighSpeedInterconnect #HighDensityConnector #ThroughHole #IndustrialElectronics #EmbeddedSystems #ServerHardware #NetworkingEquipment #ElectronicComponents #PCBDesign #HighBandwidth #DataCommunication #PCIExpress #ExpansionCardConnector #MechanicalReliability #ElectronicInterconnect

Ultra Efficient Dual Sources Energy Manager with Ratio/Constant Voltage Regulation, Regulated Buck Output and 5 V Charger, 120 mV, 135 mA The AEM13921 is a fully integrated and compact power management circuit that extracts DC power from two harvesting sources to store energy in a rechargeable storage element and supply an application circuit. A 5 V input can also be used to charge the storage element (e.g., if it gets depleted). This compact and ultra-efficient PMIC allows for extending battery lifetime and eliminating the primary energy storage in a large range of applications. Both sources implement Maximum Power Point Tracking (MPPT) based on open-circuit voltage ratio as well as constant source voltage regulation features, allowing for harvesting the maximum power available from each source to charge the storage element. With its unique cold-start circuit, it can start operating with an input voltage as low as 275 mV (min. 1.5 µW power). The configurable protection thresholds prevent overcharging and overdischarging the storage element. No external components are required to set those thresholds. The thermal monitoring prevents charging and discharging the storage element outside a configurable temperature range. The Average Power Monitoring (APM) allows the application circuit to get an estimate of the energy harvested from each source to the battery and from the battery to the application circuit. A shipping mode is available to avoid charging and discharging the storage element during shipping or storage. A buck regulator with selectable output voltage allows an application circuit to be supplied with high efficiency. I²C communication allows users to control every setting of the AEM13921 from the application circuit MCU. Features and Benefits Dual sources inputs - Boost operation optimized for each source. - Conversion efficiency above 90 % on each source. - Harvests from 120 mV after cold start. - Simultaneous harvesting from both sources. - Up to 135 mA current extracted from the harvester. Maximum Power Point Tracking - Both sources configurable to constant voltage mode or to open-circuit voltage ratio mode. - Optimal harvesting from a multiple combinations of harvesters (PV cells, RF, vibration, pulsed sources...). Cold start from 275 mV / 1.5 µW input - Startup at ultra-low power from each harvesting source input. Configurable overdischarge & overcharge protection - Supports various types of rechargeable storage elements (LiC, Li-ion, LiPo, Li-ceramic pouch...). Regulated output for application circuit - Buck regulator conversion efficiency up to 96 %. - Selectable output voltage between 0.6 V and 3.3 V. - Output current up to 100 mA. Thermal monitoring - Storage element protection against overtemperature and under-temperature during charging and discharging, independently. Average Power Monitoring - Provides data to determine how much energy has been transferred to the storage from each source and from the 5 V charger, as well as the energy drained from the storage to supply the application circuit. System configuration by GPIO or I²C communication - All settings dynamically configurable through GPIO or I²C (Fast Mode Plus). - System data available through I²C. Shipping mode - Storage element charge and discharge disabling during shipment. External 5 V charging capability - Extra charging input for 5 V power supplies. - Configurable CC and CV modes (max. 135 mA). - Provides a fast charging alternative when no source is available for a long time. #AEM13921 #EnergyHarvesting #PowerManagementIC #PMIC #MPPT #BatteryCharging #EnergyAutonomous #IoT #WirelessSensor #IndustrialMonitoring #EmbeddedSystems #QFN #epeas #LowPowerDesign

Buck Switching Regulator IC Positive Fixed 3.3V 1 Output 2A 8-SOIC (0.154", 3.90mm Width) # L6982N33DR ## General Description The L6982N33DR is a high-efficiency synchronous step-down switching regulator manufactured by STMicroelectronics. It is designed to provide a fixed regulated output voltage from a wide input voltage range while maintaining excellent conversion efficiency and low power dissipation. The device integrates high-side and low-side power MOSFETs, control circuitry, protection features, and compensation functions within a compact package, reducing external component count and simplifying power supply design. Its robust architecture makes it suitable for industrial automation systems, distributed power architectures, telecommunications equipment, embedded systems, consumer electronics, smart devices, and battery-powered applications requiring efficient DC-to-DC voltage conversion. ## Key Features ### Power Conversion Architecture * Synchronous buck regulator topology * Fixed output voltage regulation * Integrated power MOSFETs * High-efficiency power conversion * Optimized switching performance * Reduced external component requirements ### Electrical Characteristics * Wide input voltage operating range * Stable output voltage regulation * High conversion efficiency * Low standby power consumption * Fast transient response * Low output ripple performance ### Control Features * Current-mode control architecture * Internal compensation circuitry * Soft-start functionality * Frequency synchronization capability * Stable operation under varying load conditions ### Protection Features * Overcurrent protection * Short-circuit protection * Thermal shutdown protection * Undervoltage lockout protection * Safe startup operation * Enhanced system reliability ### Power Management * Low-power operating modes * Energy-efficient design * Suitable for battery-powered systems * Optimized thermal performance * Reduced power dissipation ### Package Characteristics * Surface-mount package * Compact footprint * Automated assembly compatible * High-density PCB design support * Industrial-grade packaging ### Material Construction * Monolithic integrated power management solution * Lead-free package materials * RoHS-compliant construction * High-reliability semiconductor technology ### Environmental Characteristics * Suitable for industrial operating environments * Long operational service life * Reliable continuous operation * Robust thermal performance ### Application Areas * Industrial Automation Equipment * Embedded Systems * Microcontroller Power Supplies * FPGA and Processor Power Rails * Telecommunications Equipment * Smart Metering Systems * Consumer Electronics * Building Automation Systems * Distributed Power Architectures * Battery-Powered Devices * IoT Products * Power Management Modules ### Compliance * RoHS Compliant * Lead-Free Compatible * Industrial-Grade Power Management Solution ## Manufacturer STMicroelectronics ## Product Family L6982 Synchronous Step-Down Switching Regulator Series #L6982N33DR #STMicroelectronics #BuckConverter #DCtoDCConverter #SwitchingRegulator #PowerManagement #PowerSupplyDesign #EmbeddedSystems #IndustrialElectronics #VoltageRegulator #PowerElectronics #IoTDevices #ElectronicsEngineering #PCBDesign #SMPS

137 MHz to 1020 MHz Low Power Long Range Transceiver, spreading factor from 6 to 12, LoRA, QFN-28 low-power lora transceiver QFN*1EP*6x6mm*P0.65mm*

ARM® Cortex®-M0+ STM32U0 Microcontroller IC 32-Bit 56MHz 256KB (256K x 8) FLASH 48-LQFP (7x7) # STM32U083CCT6 ## General Description The STM32U083CCT6 is an ultra-low-power microcontroller from STMicroelectronics based on the Arm Cortex-M0+ core. It is specifically designed for energy-efficient embedded applications requiring long battery life, advanced peripheral integration, secure operation, and reliable real-time performance. The device combines low-power processing, embedded Flash memory, SRAM, analog peripherals, communication interfaces, and hardware security features within a compact package. Its architecture makes it ideal for smart sensors, industrial monitoring systems, medical devices, wearable electronics, smart metering, home automation products, and Internet of Things applications where power efficiency is a primary design requirement. ## Key Features ### Processing Architecture * Arm Cortex-M0+ processor core * Optimized low-power computing architecture * Efficient real-time processing capability * Interrupt-driven operation support * Embedded system control functionality ### Memory Resources * Embedded Flash memory * Integrated SRAM * Non-volatile data storage support * High-reliability memory architecture * Efficient code execution capability ### Low-Power Features * Ultra-low-power operating modes * Multiple sleep and standby modes * Fast wake-up capability * Battery-powered application optimization * Energy-efficient peripheral operation * Extended product operating life in portable systems ### Security Features * Hardware security mechanisms * Memory protection functionality * Secure firmware execution support * Data integrity protection * Secure embedded application development support ### Communication Interfaces * USART communication interfaces * UART communication support * SPI serial communication interfaces * I²C communication interfaces * Low-power communication capability * Flexible external device connectivity ### Analog Features * Analog-to-digital conversion capability * Precision signal acquisition support * Integrated analog peripherals * Sensor interface compatibility * Low-power analog operation ### Timer and Control Functions * General-purpose timers * PWM signal generation * Real-time clock functionality * Event-driven control capability * Timing and scheduling support ### Package Characteristics * Surface-mount package * Compact footprint design * Automated assembly compatibility * Suitable for space-constrained applications * Industrial-grade packaging ### Material Construction * Advanced low-power semiconductor technology * RoHS-compliant materials * Lead-free package construction * High-reliability integrated circuit design ### Environmental Characteristics * Suitable for industrial and commercial environments * Long operational service life * Stable performance under continuous operation * Robust low-power architecture ### Application Areas * Internet of Things Devices * Smart Sensors * Wearable Electronics * Medical Monitoring Equipment * Home Automation Systems * Smart Metering Applications * Battery-Powered Products * Environmental Monitoring Systems * Industrial Data Acquisition Equipment * Consumer Electronics * Portable Embedded Systems * Wireless Sensor Nodes ### Compliance * RoHS Compliant * Lead-Free Compatible * Industrial-Grade Embedded Microcontroller Solution ## Manufacturer STMicroelectronics ## Product Family STM32U0 Ultra-Low-Power Microcontroller Series #STM32U083CCT6 #STM32U0 #STMicroelectronics #Microcontroller #UltraLowPowerMCU #CortexM0Plus #EmbeddedSystems #IoT #SmartSensors #WearableElectronics #BatteryPoweredDevices #IndustrialElectronics #EmbeddedDesign #FirmwareDevelopment #ElectronicsEngineering

Isolated Module DC DC Converter 2 Output 12 ~ 15V -12 ~ -15V 125mA, 125mA 18V - 36V Input The CC3-2412DF-E is an isolated DC-DC converter module designed to provide efficient and reliable power conversion in industrial, telecommunications, instrumentation, and embedded electronic systems. The module converts a regulated DC input voltage into isolated dual-output DC supplies while maintaining electrical isolation between the input and output stages. Its compact encapsulated design simplifies PCB integration and enhances system reliability by reducing the need for external conversion circuitry. The device is optimized for applications requiring isolated power rails, noise reduction, and protection against ground loop interference. Engineering Specifications Manufacturer: TDK-Lambda Part Number: CC3-2412DF-E Device Type: Isolated DC-DC Converter Module Conversion Topology: Isolated Power Conversion Input Voltage: Nominal DC Input Operation Output Configuration: Dual Output Output Regulation: Regulated DC Output Isolation Type: Galvanic Isolation Efficiency: High-Efficiency Power Conversion Protection Features: Short Circuit Protection and Overload Tolerance Package Type: Encapsulated Through-Hole Module Mounting Style: Through-Hole Operating Temperature Range: Industrial Grade Reliability: Designed for Continuous Operation RoHS Compliant: Yes Applications: Industrial Automation, Telecommunications Equipment, Embedded Systems, Instrumentation, Data Acquisition Systems, Process Control Equipment, Power Distribution Circuits, Isolated Interface Designs Key Features Isolated input-to-output power conversion Dual regulated output architecture Compact PCB-mount package High efficiency operation Reduced electrical noise and ground loop interference Reliable performance in industrial environments Simplified power supply design integration Robust protection against abnormal operating conditions Suitable for mixed-signal and sensitive analog systems Long operational lifespan and stable output characteristics #CC32412DFE #TDKLambda #DCDCConverter #IsolatedPowerSupply #PowerModule #PowerElectronics #EmbeddedSystems #IndustrialElectronics #PowerConversion #GalvanicIsolation #Telecommunications #Instrumentation #AutomationSystems #PCBDesign #ElectronicComponents #DualOutput #PowerManagement #IndustrialAutomation #ElectricalEngineering #PowerSupplyDesign

N-Channel 200 V 120A (Tc) 714W (Tc) Through Hole TO-247AD (IXFH) # IXFH120N15P ## General Description The IXFH120N15P is a high-current N-channel power MOSFET manufactured by Littelfuse IXYS. It is designed for demanding power switching and power conversion applications requiring low conduction losses, fast switching performance, and high current-handling capability. Built using advanced power MOSFET technology, the device provides excellent efficiency, ruggedness, and thermal performance for industrial power systems, motor drives, battery management equipment, welding systems, uninterruptible power supplies, renewable energy systems, and high-power DC switching applications. Its robust construction and low on-state resistance make it particularly suitable for designs requiring high efficiency and reliable operation under heavy load conditions. ## Key Features ### Power MOSFET Architecture * N-channel enhancement-mode MOSFET * Advanced power semiconductor technology * Low conduction losses * High-current switching capability * Optimized efficiency for power conversion applications * Fast switching performance ### Electrical Characteristics * Low on-state resistance * High-current carrying capability * Low gate drive power requirements * Excellent switching efficiency * Stable electrical performance under demanding operating conditions * Suitable for high-power applications ### Switching Performance * Fast turn-on characteristics * Fast turn-off characteristics * Reduced switching losses * High-frequency operation capability * Efficient power control functionality ### Thermal Characteristics * High power dissipation capability * Excellent thermal conductivity * Efficient heat transfer performance * Suitable for heatsink mounting * Reliable operation under continuous load conditions ### Protection and Reliability * Avalanche ruggedness * Robust semiconductor structure * Enhanced reliability under transient conditions * Long operational service life * Industrial-grade durability ### Package Characteristics * Through-hole power package * Electrically isolated mounting configuration * Suitable for high-power assemblies * Automated and manual assembly compatibility * Industrial-grade mechanical construction ### Material Construction * Advanced silicon power MOSFET technology * High-reliability semiconductor materials * RoHS-compliant construction * Lead-free compatible package * Rugged power device architecture ### Environmental Characteristics * Suitable for industrial operating environments * High mechanical durability * Stable operation across extended temperature ranges * Reliable continuous-duty performance ### Application Areas * Motor Drive Systems * Industrial Power Supplies * Battery Management Systems * Renewable Energy Equipment * Solar Power Converters * DC-DC Converters * High-Power Switching Circuits * Welding Equipment * Uninterruptible Power Supplies * Electric Vehicle Support Systems * Energy Storage Systems * Industrial Automation Equipment ### Compliance * RoHS Compliant * Lead-Free Compatible * Industrial-Grade Power Semiconductor Solution ## Manufacturer Littelfuse IXYS ## Product Family PolarP N-Channel Power MOSFET Series #IXFH120N15P #IXYS #Littelfuse #PowerMOSFET #NChannelMOSFET #PowerElectronics #MotorDrive #DCDCConverter #PowerSupplyDesign #IndustrialElectronics #EnergyStorage #RenewableEnergy #BatteryManagement #ElectronicsEngineering #PowerSemiconductor #Commonpartslibrary #Transistor #MOSFET #FET #tht

Low power long range transceiver module, SPI and parallel interface, 433 MHz, spreading factor 6 to12, bandwith 7.8 to 500kHz, -111 to -148 dBm, SMD-16, DIP-16 #RF #LoRa #STM32 #ARM #commonpartslibrary

The A767KN476M1HLAE029 is a surface-mount aluminum electrolytic capacitor designed for bulk energy storage, power supply filtering, ripple current suppression, and voltage stabilization applications. This capacitor utilizes aluminum electrolytic technology to provide high capacitance density in a compact package, making it suitable for modern power management and industrial electronic systems. The device is optimized for applications requiring stable capacitance performance, long operational life, and reliable operation under varying electrical and environmental conditions. It is commonly used in switching power supplies, DC-DC converters, industrial control equipment, communication systems, consumer electronics, and embedded power distribution networks. Its low impedance characteristics and high ripple current capability support efficient power filtering and transient response improvement in electronic circuits. The surface-mount construction enables automated assembly processes and compact PCB integration in high-density designs. Engineering Specification Device Type Aluminum electrolytic capacitor Capacitor Technology Surface-mount aluminum electrolytic construction Capacitance Characteristics High-capacitance energy storage and filtering capability Electrical Characteristics Optimized for power supply filtering and voltage stabilization Impedance Performance Low impedance design for efficient ripple suppression Ripple Current Capability Suitable for high-ripple-current power applications Thermal Characteristics Stable operation across industrial electronic operating conditions Reliability Features Long operational lifetime and robust electrical performance Mounting Style Surface mount technology Package Structure Chip-type aluminum electrolytic capacitor Environmental Characteristics Designed for commercial and industrial electronic environments Applications Switching power supplies DC-DC converters Power management systems Industrial automation Communication equipment Embedded systems Consumer electronics Voltage filtering circuits Energy storage applications Power distribution networks Manufacturer Commonly associated with KEMET aluminum electrolytic capacitor product families #commonpartslibrary #electrolyticcapacitor #aluminumcapacitor #passivecomponents #powerelectronics #powersupply #filtercapacitor #energystorage #surfaceountcomponents #embeddedhardware #electronicsdesign #dcdcconverter #industrialelectronics #powermanagement #ripplefiltering

Pin Receptacle Connector 0.037" ~ 0.043" (0.94mm ~ 1.09mm) No Tail Surface Mount The 6628-0-18-15-18-27-10-0 is a surface-mount receptacle connector manufactured by Mill-Max Manufacturing Corp.. This component is designed to provide a reliable board-level interconnect solution for applications requiring compact, high-density signal routing. The connector utilizes precision-machined contacts to ensure excellent electrical performance, mechanical durability, and long-term mating reliability. The device features a low-profile surface-mount configuration optimized for automated assembly processes and space-constrained electronic designs. Its rugged construction supports repeated insertion and removal cycles while maintaining consistent contact integrity. The connector is suitable for embedded systems, communication equipment, industrial electronics, instrumentation, prototyping platforms, and custom board-to-board interface applications. The receptacle incorporates high-quality conductive materials and plated contact surfaces to minimize contact resistance and enhance corrosion resistance. The SMT mounting style enables efficient PCB integration while supporting robust mechanical attachment during operation and handling. General Description The 6628-0-18-15-18-27-10-0 is a precision-machined surface-mount receptacle connector intended for high-reliability electronic interconnections. It offers dependable electrical contact, compact footprint characteristics, and excellent mechanical stability for demanding applications. The connector is commonly used where reliable signal transmission, ease of assembly, and long service life are essential design requirements. Its precision socket architecture makes it suitable for mating with compatible pin headers and custom interconnect systems while supporting modern automated manufacturing environments. #MillMax #Connector #Receptacle #SMTConnector #BoardToBoard #ElectronicInterconnect #SurfaceMount #PrecisionMachined #EmbeddedSystems #IndustrialElectronics #PCBDesign #HardwareEngineering #ElectronicComponents

Air Quality Sensor CO2 Sensor 2.5V/3.3V/5V 20-Pin SMD EP T/R The SCD41-D-R1 is a miniature photoacoustic carbon dioxide sensor module developed by Sensirion for high-accuracy environmental sensing applications. The device integrates a CO₂ sensing element, temperature sensor, humidity sensor, optical components, calibration memory, and digital signal processing into a compact surface-mount package suitable for embedded systems and portable electronics. The sensor utilizes photoacoustic sensing technology to provide precise carbon dioxide concentration measurements while maintaining low power consumption and long-term stability. Integrated humidity and temperature sensing capabilities enable environmental compensation and simplify system integration by reducing the need for external sensors. The SCD41 communicates through a standard I²C digital interface and supports automatic self-calibration functions for reliable long-term operation. Its compact footprint and low energy requirements make it suitable for battery-powered devices, smart building systems, HVAC equipment, indoor air quality monitoring systems, and IoT applications. The module is factory calibrated and designed for continuous monitoring of indoor air quality conditions. The integrated architecture minimizes external component requirements while enabling accurate sensing performance across a wide operating range. Key Features Photoacoustic CO₂ sensing technology Integrated temperature and humidity sensing High accuracy carbon dioxide measurement I²C digital communication interface Low power consumption operation Automatic self-calibration support Compact surface-mount package Factory calibrated output Long-term measurement stability Optimized for indoor air quality applications Low-profile PCB mounting design RoHS and halogen-free compliant Electrical Characteristics Low-voltage supply operation Low average current consumption suitable for portable devices Integrated digital signal processing Non-volatile calibration memory Standard I²C communication compatibility Stable operation across industrial environmental conditions Mechanical Characteristics Compact SMD package for space-constrained applications Surface-mount assembly compatible Low-profile package structure Integrated optical cavity and sensing chamber Moisture-sensitive device requiring controlled handling during assembly Functional Characteristics Real-time carbon dioxide concentration monitoring Simultaneous temperature and humidity measurement Automatic environmental compensation Continuous and periodic measurement modes Fast startup and measurement response Long operational lifetime with stable calibration Optimized airflow design for accurate sensing Suitable for continuous indoor environmental monitoring Typical Applications Indoor air quality monitoring systems Smart thermostats and HVAC controllers Building automation equipment Demand-controlled ventilation systems Portable environmental monitoring devices Smart home and IoT products Air purification systems Occupancy and ventilation monitoring Battery-powered sensing devices Consumer and industrial environmental monitoring equipment #commonpartslibrary #sensor #airquality

IGBT 460 V 20 A 107 W Surface Mount LPDS #CommonPartsLibrary #Transistor #IGBT The RGPR20NS43HRTL specification defines the engineering requirements for an ultrafast recovery power rectifier designed for high-efficiency power conversion and switching applications. This specification establishes the functional, electrical, mechanical, thermal, environmental, and quality requirements necessary to ensure reliable rectification performance, low switching losses, and long-term operational stability in power electronic systems. The device is intended for use in switch-mode power supplies, power factor correction circuits, motor drives, industrial power equipment, and other high-frequency power conversion applications. It provides efficient current rectification with fast reverse recovery characteristics, enabling improved system efficiency and reduced electromagnetic interference in demanding electrical environments. Engineering Requirements The rectifier shall be manufactured using qualified semiconductor fabrication processes and high-quality materials to ensure consistent electrical performance, thermal stability, and long service life. The device shall maintain reliable operation under specified voltage, current, and temperature conditions without degradation of functional performance. Electrical characteristics shall provide low forward voltage drop, fast reverse recovery time, and high surge current capability to support efficient high-frequency switching applications. The device shall maintain stable electrical behavior under repetitive switching cycles and transient operating conditions. Thermal performance shall support effective heat dissipation through the package structure and recommended mounting configuration. The component shall operate within specified junction temperature limits while maintaining electrical integrity and long-term reliability under continuous or intermittent load conditions. Mechanical construction shall be suitable for standard surface-mount or through-hole assembly, depending on the package configuration, and shall withstand soldering, handling, vibration, and thermal cycling without mechanical degradation. Workmanship shall be free from defects including contamination, cracks, bond failures, corrosion, or structural inconsistencies that could adversely affect electrical or mechanical performance. Inspection, validation, and testing shall be conducted using calibrated equipment and controlled quality procedures to verify compliance with all applicable engineering and manufacturing requirements. Any deviation from this specification shall require formal engineering evaluation, documented technical justification, and approval through the established engineering change control process. Documentation Supporting documentation shall include engineering drawings, electrical performance data, thermal characterization reports, qualification records, inspection reports, and revision-controlled manufacturing documentation. All documentation shall be maintained under formal configuration management and quality assurance systems to ensure complete product traceability. Revision Control Any modification to this specification shall be managed through the formal engineering change management process. All revisions shall undergo technical review, validation, and approval before implementation to ensure continued compliance with design intent and applicable engineering standards. #EngineeringSpecification #PowerRectifier #UltrafastRecoveryDiode #PowerElectronics #SwitchModePowerSupply #IndustrialElectronics #Semiconductor #ThermalManagement #QualityAssurance #EngineeringDocumentation

Laminated Core 1.1VA Power Transformer 115V Primary Parallel 6.3V, Series 12.6V Secondary Parallel 180mA, Series 90mA Through Hole The F12-090-C2 specification defines the engineering requirements for an electronic connector component intended to provide reliable electrical interconnection between printed circuit boards, cable assemblies, or electronic subsystems. This specification establishes the functional, mechanical, electrical, environmental, and quality requirements necessary to ensure dependable signal transmission, secure mechanical engagement, and long-term operational reliability. The component is intended for use in embedded, industrial, communication, and electronic control systems where compact interconnect solutions and consistent electrical performance are required. The connector is designed to support repeated mating cycles while maintaining low contact resistance, stable mechanical retention, and compatibility with standard electronic assembly processes. Engineering Requirements The connector shall be manufactured using precision-formed conductive contacts and high-strength insulating materials to ensure consistent electrical conductivity, mechanical durability, and long service life. The construction shall support reliable mating and unmating operations without degradation of contact performance. Electrical characteristics shall provide low contact resistance, stable signal integrity, and reliable current-carrying capability within the specified operating conditions. The connector shall maintain electrical continuity under vibration, thermal cycling, and environmental exposure encountered during normal operation. Mechanical construction shall ensure accurate alignment of mating interfaces, secure retention, and resistance to mechanical wear resulting from repeated insertion and removal. The housing and contact system shall withstand normal handling and assembly processes without deformation or structural damage. Workmanship shall be free from defects including contamination, cracks, corrosion, plating irregularities, or mechanical deformation that could adversely affect electrical or mechanical performance. Inspection, validation, and testing shall be conducted using calibrated equipment and controlled quality procedures to verify compliance with engineering requirements. Any deviation from this specification shall require formal engineering evaluation, documented technical justification, and approval through the established engineering change control process prior to implementation. Documentation Supporting documentation shall include engineering drawings, material specifications, electrical performance data, inspection records, qualification reports, and revision-controlled manufacturing documentation. All documentation shall be maintained under formal configuration management and quality assurance systems to ensure complete product traceability. Revision Control Any modification to this specification shall be processed through the formal engineering change management system. All revisions shall undergo technical review, validation, and approval before release to ensure continued compliance with design intent and applicable industry standards. #EngineeringSpecification #Connector #ElectronicInterconnect #SignalIntegrity #EmbeddedSystems #IndustrialElectronics #ElectricalEngineering #Manufacturing #QualityAssurance #EngineeringDocumentation

Optical Sensor Through-Beam 0.197" (5mm) PCB Mount The EE-SX4081 specification defines the engineering requirements for a slot-type photomicrosensor designed for non-contact object detection and position sensing in electronic and electromechanical systems. This specification establishes the functional, electrical, mechanical, environmental, and quality requirements necessary to ensure accurate optical sensing, reliable switching performance, and long-term operational stability. The component is intended for use in industrial automation, office equipment, consumer electronics, and embedded control systems requiring precise detection of object presence, motion, or position. The integrated infrared emitter and phototransistor receiver provide dependable sensing through interruption of the optical path, enabling high-speed, contactless detection in compact system designs. Engineering Requirements The photomicrosensor shall be manufactured using qualified optoelectronic components and controlled production processes to ensure consistent sensing performance, mechanical integrity, and long service life. The optical assembly shall maintain accurate alignment between the emitter and receiver to provide stable detection characteristics throughout the specified operating conditions. Electrical characteristics shall provide reliable switching response, stable output behavior, and low power consumption while maintaining consistent sensitivity across the intended operating voltage and temperature ranges. The sensor shall exhibit reliable performance under normal ambient light conditions and shall maintain signal integrity during continuous operation. Mechanical construction shall ensure precise slot dimensions, secure mounting capability, and resistance to vibration, mechanical shock, and thermal cycling encountered during normal operation. The package shall be suitable for printed circuit board assembly and shall withstand standard soldering and handling processes without degradation. Workmanship shall be free from defects including contamination, optical misalignment, package damage, corrosion, or structural irregularities that could affect sensing accuracy or reliability. Inspection, validation, and testing shall be performed using calibrated equipment and controlled quality procedures to verify compliance with engineering requirements. Any deviation from this specification shall require formal engineering evaluation, documented technical justification, and approval through the established engineering change control process before implementation. Documentation Supporting documentation shall include engineering drawings, electrical specifications, optical performance data, qualification reports, inspection records, and revision-controlled manufacturing documentation. All documentation shall be maintained under formal configuration management and quality assurance systems to ensure complete traceability throughout the product lifecycle. Revision Control Any modification to this specification shall be processed through the formal engineering change management system. All revisions shall undergo technical review, validation, and approval before release to ensure continued compliance with design intent and applicable engineering standards. #EngineeringSpecification #Photomicrosensor #OpticalSensor #SlotSensor #IndustrialAutomation #EmbeddedSystems #Optoelectronics #QualityAssurance #EngineeringDocumentation #ElectronicComponents