802.15.4, Bluetooth Bluetooth v5.2, Zigbee® Transceiver Module 2.36GHz ~ 2.5GHz Integrated, Chip Surface Mount #CommonPartsLibrary #RF #Bluetooth #Transceiver #Module

Bluetooth, WiFi 802.11b/g/n/ax, Bluetooth v5.4 Transceiver Module 2.4GHz Integrated, Chip Surface Mount Silicon Labs SiWG917 module is our lowest power Wi-Fi 6 plus Bluetooth LE 5.4, ideal for ultra-low power IoT wireless devices using Wi-Fi®, Bluetooth, Matter, and IP networking for secure cloud connectivity. It is optimal for developing battery operated devices that need long battery life. SiWG917 module includes an ultra-low power Wi-Fi 6 plus Bluetooth Low Energy (LE) 5.4 wireless CPU subsystem, and an integrated micro-controller (MCU) application subsystem, security, peripherals and power management subsystem all in a single 16 x 21.1 x 2.3 mm package. The wireless subsystem consists of a multi-threaded Network Wireless Processor (NWP) running up to 160 MHz, baseband digital signal processing, analog front end, 2.4 GHz RF transceiver and integrated power amplifier. The application subsystem consists of an ARM® Cortex®-M4 running up to 180 MHz, embedded SRAM, flash, ultra-low power sensor hub, and matrix vector processor. The ARM® Cortex®-M4 is dedicated for peripheral and application-related processing, while the NWP runs the wireless and networking stacks on independent threads, thus providing a fully integrated solution that is ready for a wide range of embedded wireless IoT applications. The modules come with modular radio type approvals for various countries, including USA (FCC), Canada (IC/ISED) and Japan (MIC), and are in compliance with the relevant EN standards (including EN 300 328 v2.2.2) for the conformity with the directives and regulations in EU and UK. KEY FEATURES • Wi-Fi 6 Single Band 2.4 GHz 20 MHz 1x1 stream IEEE 802.11 b/g/n/ax • Bluetooth LE 5.4 • Single chip Matter Over Wi-Fi Solution • ARM® Cortex® M4 Processor with FPU subsystem up to 180 MHz with rich set of Digital and Analog Peripherals. • Wi-Fi 6 Benefits: TWT for improved efficiency and longer battery life, MUMIMO/OFDMA for Higher Throughput, network capacity and low latency • Best in Class Device and Wireless Security • WLAN Tx power up to +17.5 dBm with integrated PA • Bluetooth LE Tx power up to +17 dBm with integrated PA • WLAN Rx sensitivity as low as -95.5 dBm • Wi-Fi 4 Standby Associated mode current: 71 μA @ 1-second listen interval • Embedded Flash option up to 8 MB/ optional external Flash up to 16 MB • Embedded PSRAM option up to 2 MB/ optional external PSRAM option up to 16 MB • Ultra-low power sensor hub peripherals • Matrix Vector Processor (MVP) • Embedded Wi-Fi, Bluetooth LE, Matter, and networking stacks supporting wireless coexistence • Three software-configurable MCU application memory options for sharing the RAM between the wireless, system, and application (192/256/320 KB) • Operating temperature: -40 to +85 ºC • Operating supply range: 3.0 to 3.63 V • Supply voltage for GPIOs: 1.71 to 3.63 V #WiFi6 #BluetoothLE54 #IoTModule #WirelessSoC #SiliconLabs #EmbeddedSystems #SmartHome #IndustrialIoT #LowPowerDesign #RFModule #ConnectedDevices #EdgeComputing #MatterReady #PCBDesign #ElectronicsEngineering

8 (6 + 2) Position Card Connector NANO SIM Surface Mount, Right Angle Gold SIM card holder nano SIM The 2452796-1 is a surface-mount Nano SIM card connector from TE Connectivity designed for 4FF Nano SIM applications in cellular, IoT, GPS, and wireless communication devices. It features a hinged locking mechanism for secure card retention and reliable electrical contact in compact embedded systems. The connector is optimized for PCB mounting and supports high durability for repeated SIM card insertion and removal cycles. Key Features Supports 4FF (Nano SIM) cards Hinge-type SIM holder with locking mechanism 7-position contact configuration Surface-mount (SMT) PCB termination Integrated card detection switch Compact right-angle board-mount design Contact material made from copper alloy with gold plating Durable stainless-steel shell construction Operating temperature range: -40°C to +85°C Rated durability up to 2500 mating cycles Suitable for cellular modems, LTE modules, GPS trackers, and IoT devices UL 94V-0 flammability rated housing #CommonPartsLibrary #Connector #NANO SIM

Buck Switching Regulator IC Positive Adjustable 1.2V 1 Output 3.5A 8-PowerSOIC (0.154", 3.90mm Width) The LM5013DDAR is a 100-V input, 3.5-A buck switching regulator IC that efficiently steps down high DC voltages (such as 24 V, 48 V, or battery rails) to lower regulated outputs. It is optimized for rugged environments where wide input variations and high reliability are required. It features ultra-low quiescent current operation, making it suitable for systems that require high efficiency even at light load or standby conditions. Key Features Wide input voltage range: 6 V to 100 V Up to 3.5 A output current capability Integrated 100-V high-side MOSFET Non-synchronous buck topology Ultra-low quiescent current (IQ) for high efficiency in standby Constant-on-time (COT) control for fast transient response No external compensation components required Adjustable output voltage (down to ~1.2 V reference) 50 ns minimum on/off time for high step-down ratios Built-in protection features: Overcurrent protection Thermal shutdown Input undervoltage lockout (UVLO) Open-drain power-good (PGOOD) signal for system monitoring Meets low EMI requirements (CISPR 25 Class 5 capable) Package 8-pin SO PowerPAD (DDA) surface-mount package Designed for good thermal performance in high-voltage applications Typical Applications Industrial power supplies (24 V / 48 V systems) Automotive power systems Telecom and networking equipment High cell-count battery systems Motor control and inverter subsystems #LM5013 #BuckConverter #DCDCConverter #TexasInstruments #PowerManagementIC #HighVoltageRegulator #3ARegulator #IndustrialPower #AutomotiveElectronics #SwitchingRegulator #COTController

Bluetooth Low Energy 5.0 SiP module, nRF52832-based, 6.5 x 6.5 x 1.15 mm 52-pad package with optional internal or external antenna The ANNA-B112-01B is an ultra-compact, stand-alone Bluetooth® Low Energy (BLE) 5 module developed by u-blox. It is built around the Nordic nRF52832 SoC, which integrates a powerful Arm Cortex-M4 processor with FPU, RF circuitry, memory, and antenna in a single System-in-Package (SiP). This module is designed for industrial and IoT applications, offering a combination of high performance, low power consumption, and small size. It supports both host-controlled operation (AT commands via u-connectXpress) and standalone embedded applications (open CPU mode), giving designers flexibility in system architecture. 🔑 Key Features 🧠 Processing & Memory 64 MHz Arm Cortex-M4 CPU with FPU 512 KB Flash and 64 KB RAM Supports open CPU (run user firmware directly on module) 📡 Wireless Connectivity Bluetooth 5.0 (BLE) compliant Supports: GATT client & server Bluetooth mesh Simultaneous central + peripheral roles Data rate up to 2 Mbps 📶 RF & Antenna Operates at 2.4 GHz ISM band Integrated chip antenna Optional external antenna via antenna pin Range up to ~160 m (internal antenna) 🔌 Interfaces & Peripherals Communication interfaces: UART, SPI, I²C, I²S Additional features: ADC (12-bit) PWM, PDM Up to 25 GPIOs Supports NFC (for pairing / data) ⚙️ Software & Development Comes with u-connectXpress firmware: AT command interface Serial Port Service (SPS) Easy integration without deep BLE stack knowledge Supports development using: Nordic SDK Arm Mbed Supports FOTA (Firmware Over-The-Air updates) 🔋 Power & Electrical Supply voltage: 1.7V to 3.6V Optimized for low-power applications Sleep current as low as ~300 nA 📦 Physical Characteristics Ultra-compact size: 6.5 × 6.5 × 1.2 mm Package: 52-pin SMD module Operating temperature: –40°C to +85°C 🌍 Certifications Globally pre-certified (FCC, CE, etc.) Reduces time and cost for product certification

4.7 µH Shielded Drum Core, Wirewound Inductor 2.6 A 105mOhm Max 2-SMD The SRP4020TA-4R7M is a compact surface-mount power inductor designed for use in high-efficiency power conversion and energy storage applications. It is optimized for switching regulators, DC-DC converters, and filtering circuits where stable inductance, low core loss, and reliable current handling are required. The device features a magnetically shielded construction that minimizes electromagnetic interference, making it suitable for densely populated electronic assemblies. Its robust design supports consistent performance across a wide range of operating conditions, contributing to improved system efficiency and reduced noise. Construction and Materials The component is manufactured using a ferrite core with integrated winding, enclosed in a molded structure that provides mechanical stability and environmental protection. The shielding structure reduces flux leakage and enhances electromagnetic compatibility. External terminations are designed for reliable solderability and strong adhesion to standard printed circuit board pads. Electrical Characteristics The inductor provides a nominal inductance corresponding to its designation and maintains stability under rated operating conditions. It exhibits low direct current resistance to minimize conduction losses and supports moderate to high current levels without significant saturation. The component is engineered to maintain performance over variations in temperature and frequency typical of switching power applications. Thermal Performance The device is capable of operating within standard industrial temperature ranges, with thermal characteristics that support efficient heat dissipation through the PCB. Its construction helps maintain inductance stability and prevents degradation under thermal stress. Mechanical Characteristics The package is a low-profile, surface-mount form factor suitable for automated assembly. The compact footprint enables use in space-constrained designs, while the structure ensures durability during handling and reflow soldering processes. Applications Typical applications include step-down and step-up voltage regulators, power management modules, portable electronics, telecommunications equipment, and general-purpose filtering where compact size and efficient performance are critical. Reliability and Compliance The component is designed to meet common industry reliability standards for surface-mount passive devices. It is compatible with standard reflow soldering processes and is typically compliant with environmental regulations governing hazardous substances. #commonpartslibrary #inductor

OR Controller N+1 ORing Controller N-Channel N:1 8-VSSOP The LM74610QDGKRQ1 is an automotive-qualified smart bypass ideal diode controller designed to drive an external N-channel MOSFET for reverse polarity protection and input supply OR-ing applications. The device minimizes forward voltage drop and power dissipation compared to traditional Schottky diodes while providing robust protection against reverse battery conditions. It supports operation across a wide automotive input voltage range and is optimized for high-current systems requiring low standby current, fast response, and reliable transient handling. The device is AEC-Q100 qualified for automotive applications and is commonly used in ECU power distribution, battery protection, and redundant supply systems. Engineering Specification Manufacturer: Texas Instruments Manufacturer Part Number: LM74610QDGKRQ1 Device Type: Automotive Smart Diode Controller Qualification Standard: AEC-Q100 Automotive Qualified Functionality: Reverse polarity protection and ideal diode control using external N-channel MOSFET Topology: Charge pump driven ideal diode controller Input Operating Voltage Range: Wide automotive battery operating range with load dump capability support Reverse Input Protection: Supports reverse battery protection without requiring a reverse polarity diode Gate Drive Method: Integrated charge pump for external N-channel MOSFET enhancement Forward Voltage Drop: Determined primarily by external MOSFET RDS(on) Quiescent Current: Ultra-low operating current for always-on automotive systems Transient Immunity: Automotive load dump and ISO transient tolerant design MOSFET Compatibility: External N-channel MOSFET Response Time: Fast reverse current blocking response Operating Temperature Range: Automotive extended temperature range Package Type: VSSOP Package Size: 8-pin small-outline package Mounting Type: Surface mount #Commonpartslibrary #Integratedcircuit #Powermanagement #orcontrollers

Accelerometer X, Y, Z Axis ±2g, 4g, 8g, 16g 0.05Hz ~ 1.6kHz 14-LGA (3x5) The ADXL345 is a small, thin, ultralow power, 3-axis accelerometer with high resolution (13-bit) measurement at up to ±16 g. Digital output data is formatted as 16-bit twos complement and is accessible through either a SPI (3- or 4-wire) or I2C digital interface. The ADXL345 is well suited for mobile device applications. It measures the static acceleration of gravity in tilt-sensing applications, as well as dynamic acceleration resulting from motion or shock. Its high resolution (3.9 mg/LSB) enables measurement of inclination changes less than 1.0°. Several special sensing functions are provided. Activity and inactivity sensing detect the presence or lack of motion by comparing the acceleration on any axis with user-set thresholds. Tap sensing detects single and double taps in any direction. Free-fall sensing detects if the device is falling. These functions can be mapped individually to either of two interrupt output pins. An integrated memory management system with a 32-level first in, first out (FIFO) buffer can be used to store data to minimize host processor activity and lower overall system power consumption. Low power modes enable intelligent motion-based power management with threshold sensing and active acceleration measurement at extremely low power dissipation. The ADXL345 is supplied in a small, thin, 3 mm × 5 mm × 1 mm, 14-lead, plastic package. ► Ultralow power: as low as 23 µA in measurement mode and 0.1 µA in standby mode at VS = 2.5 V (typical) ► Power consumption scales automatically with bandwidth ► User-selectable resolution ► Fixed 10-bit resolution ► Full resolution, where resolution increases with g range, up to 13-bit resolution at ±16 g (maintaining 4 mg/LSB scale factor in all g ranges) ► Embedded memory management system with FIFO technology minimizes host processor load ► Single tap/double tap detection ► Activity/inactivity monitoring ► Free-fall detection ► Supply voltage range: 2.0 V to 3.6 V ► I/O voltage range: 1.7 V to VS ► SPI (3- and 4-wire) and I2C digital interfaces ► Flexible interrupt modes mappable to either interrupt pin ► Measurement ranges selectable via serial command ► Bandwidth selectable via serial command ► Wide temperature range (−40°C to +85°C) ► 10,000 g shock survival ► Pb free/RoHS compliant #CommonPartsLibrary #IntegratedCircuit #Sensor #Transducer #Motion-Sensor #Accelerometer #ADXL345

ARM® Cortex®-M4 STM32F4 Microcontroller IC 32-Bit Single-Core 100MHz 512KB (512K x 8) FLASH 64-LQFP (10x10) #commonpartslibrary #Integrated Circuits #microcontroller