11 Position Connector Header, Center Strip Contacts Surface Mount Gold or Gold, GXT™ The 91911-31311LF is a 1.00 mm pitch board-to-board mezzanine connector from the Conan™ / MezzSelect™ series by Amphenol ICC. It is designed for compact, high-density PCB stacking applications commonly used in industrial, embedded, networking, and portable electronic systems. Key Features 11-position vertical header 1.00 mm pitch compact board-to-board connector Surface-mount (SMT) mounting 5 mm mated stacking height Gold/GXT™ contact plating for reliable signal integrity and durability Board guide and solder retention features for easier assembly and improved mechanical stability Supports high-density PCB layouts Designed for industrial and embedded applications RoHS and REACH compliant Housing material: LCP (Liquid Crystal Polymer) Rated up to 1 A current and 500 V voltage Typical Applications Embedded computing modules Industrial control systems Networking equipment Portable electronics Compact PCB stacking designs

Shielded RJ45 Connector with Integrated Magnetics (PoE) – Single-port RJ45 Ethernet connector with integrated 10/100Base-T magnetics for industrial Ethernet, embedded networking, IoT gateways, automation equipment, IP cameras, networking devices, and Power over Ethernet (PoE) applications. Features a through-hole, right-angle PCB mount, CAT5e-compliant interface, and supports 10/100Base-T Ethernet, Auto-MDIX, and PoE operation. Includes integrated isolation transformers, common-mode chokes, yellow and green status LEDs, shielded metal housing, board guide for secure mounting, and gold-plated contacts (30 µin / 0.76 µm) for reliable long-term performance. Designed with a tab-down RJ45 orientation, 90° entry, and operates over a −40°C to +85°C temperature range, making it suitable for rugged industrial and embedded networking applications. #WurthElektronik #7499210121A #RJ45Connector #EthernetConnector #IntegratedMagnetics #MagJack #CAT5e #PoE #10100BaseT #IndustrialEthernet #EmbeddedNetworking #IoT #EmbeddedSystems

Automotive 8 A Synchronous Buck Converter IC – High-efficiency synchronous step-down (buck) DC-DC converter optimized for automotive power supplies, industrial automation, networking equipment, point-of-load regulation, and embedded power applications. Operates from a 4.5 V to 28 V input voltage and provides an adjustable output voltage from 0.6 V to 13 V with up to 8 A continuous output current. Features integrated high-side (20.4 mΩ) and low-side (9.5 mΩ) MOSFETs, D-CAP3™ control architecture for fast transient response, 45 µA typical quiescent current, selectable switching frequencies of 500 kHz, 800 kHz, or 1.2 MHz, pre-biased startup, power-good (PG) output, soft-start, frequency synchronization, and light-load Eco-mode™ operation for improved efficiency. Includes comprehensive protection with cycle-by-cycle current limiting, undervoltage lockout (UVLO), overvoltage protection (OVP), thermal shutdown, and hiccup-mode short-circuit protection. Specified for operation over a −40°C to +150°C junction temperature and housed in a compact 10-pin VQFN-HR (3 × 3 mm) package. #TexasInstruments #TPS56837RPAR #TPS56837 #BuckConverter #SynchronousBuck #DCDCConverter #PowerManagement #PointOfLoad #IndustrialElectronics #AutomotiveElectronics #VQFN10 #EmbeddedSystems

7-Port Gigabit Managed Ethernet Switch IC – High-performance Layer 2 managed Ethernet switch designed for industrial automation, IoT gateways, embedded networking, automotive networking, IP cameras, networked audio/video systems, and communication equipment. Integrates 7 Gigabit Ethernet ports with 5 integrated 10/100/1000BASE-T PHYs, 1 SGMII interface, and 1 configurable RGMII/MII/RMII interface, enabling flexible network architectures. Supports IEEE 802.3 Ethernet standards, QoS, VLAN (802.1Q), Rapid Spanning Tree Protocol (RSTP), IGMP snooping, LinkMD® cable diagnostics, Energy Efficient Ethernet (EEE), Wake-on-LAN (WoL), port mirroring, rate limiting, and advanced packet filtering for robust managed networking. Features I²C and SPI management interfaces, operates from 1.8 V, 2.5 V, and 3.3 V supplies, and is specified for the −40°C to +85°C industrial temperature range. Packaged in a 128-pin TQFP-EP (14 × 14 mm) for high-density embedded networking designs. #Microchip #KSZ9897STXITR #KSZ9897 #GigabitEthernetSwitch #ManagedSwitch #Layer2Switch #IndustrialEthernet #SGMII #RGMII #IoTGateway #NetworkController #EmbeddedSystems

Isolated IEEE 802.3af PoE Powered Device (PD) DC-DC Converter Module – High-efficiency isolated Power over Ethernet (PoE) DC-DC converter module designed for IP cameras, VoIP phones, wireless access points, industrial Ethernet devices, IoT gateways, embedded networking equipment, and PoE-powered systems. Delivers a regulated 5 V output at up to 5.1 A (25.5 W) from a 37 V to 57 V PoE input, compliant with IEEE 802.3af PoE Powered Device (PD) requirements. Features 2.25 kVDC input-to-output isolation, up to 90.5% efficiency, low ripple and noise (150 mVp-p max), integrated PoE interface, overcurrent, overvoltage, and short-circuit protection, and support for T2P and adapter OR-ing. Designed for surface-mount assembly in a compact 35.5 × 22.4 × 10.6 mm module, it operates over a −40°C to +85°C temperature range, making it ideal for commercial and industrial embedded power applications. #MurataPowerSolutions #MYBSP0055AABFT #PoEConverter #DCDCConverter #PowerOverEthernet #IEEE8023af #IsolatedPowerModule #IndustrialEthernet #EmbeddedPower #IoT #SurfaceMount #EmbeddedSystems

Single-port RJ45 MagJack Ethernet connector with integrated magnetics, supporting 10GBASE-T and up to 120 W PoE, designed for PCB mounting in networking equipment.

IC RF TxRx + MCU 802.15.4, Bluetooth Bluetooth v5.0, Thread, Zigbee® 2.4GHz 48-VFQFN Exposed Pad The NRF52840-QFAA-F-R belongs to Nordic’s nRF52 series and supports multiple wireless standards including Bluetooth 5, Bluetooth Low Energy (BLE), Thread, Zigbee, ANT, and proprietary 2.4 GHz protocols. It features a 64 MHz ARM Cortex-M4F CPU with floating-point unit (FPU), making it suitable for both wireless communication and real-time embedded processing. The device integrates large memory resources, rich peripherals, USB support, NFC capability, and advanced security features, reducing the need for external components in wireless embedded designs. Key Features 32-bit ARM Cortex-M4F processor running at 64 MHz 1 MB Flash memory and 256 KB RAM Supports Bluetooth 5 / BLE, Thread, Zigbee, ANT, and proprietary 2.4 GHz protocols IEEE 802.15.4 compliant radio Up to +8 dBm TX output power High receiver sensitivity down to −103 dBm Data rates up to 2 Mbps Ultra-low power consumption for battery-powered applications USB 2.0 Full-Speed controller NFC-A tag support Multiple communication interfaces: SPI UART I2C (TWI) I2S PWM PDM ADC Up to 48 GPIOs Integrated ARM CryptoCell-310 security engine Operating voltage range: 1.7 V to 5.5 V Operating temperature: −40°C to +85°C Compact 48-QFN (6×6 mm) package Typical Applications BLE devices Smart home products Wearables Wireless sensors Industrial IoT HID devices (keyboard/mouse) Asset tracking Mesh networking devices USB dongles and gateways PCB Design Notes Community PCB reviews commonly recommend: Proper RF grounding and 50-ohm antenna routing Using ESD/TVS protection on USB lines Keeping RF matching components close to the antenna Using solid ground planes for 2.4 GHz performance #CommonPartsLibrary #IntegratedCircuit #RF

64 Position Female Connector PCI Express™ Gold 0.039" (1.00mm) Black The PCIE-064-02-X-D-TH is a high-density PCI Express edge connector designed for reliable board-to-board and card-to-host connections in high-speed data communication applications. Manufactured by Samtec, this connector supports PCI Express signaling standards while providing robust mechanical and electrical performance for high-frequency, high-bandwidth systems. Its through-hole mounting and dual-row design ensure secure attachment to the PCB, high mating retention, and long operational life. The connector is ideal for computer peripherals, server systems, embedded computing platforms, networking devices, and industrial electronic equipment where signal integrity, mechanical reliability, and high-density interconnects are critical. Engineering Specifications Manufacturer: Samtec Part Number: PCIE-064-02-X-D-TH Series: PCI Express Edge Connector Connector Type: Board-to-Board / Card Edge Connector Contact Configuration: Dual-Row High-Density Contacts Mounting Style: Through-Hole Contact Material: Copper Alloy Contact Finish: Gold-Plated Contact Surface Housing Material: High-Temperature Thermoplastic Signal Performance: PCI Express Standard Compliant Electrical Performance: High-Speed Data Transmission Mechanical Durability: High Mating Cycle Life Orientation: Right Angle / Standard Edge Mount Operating Temperature Range: Industrial Grade RoHS Compliant: Yes Applications: PCI Express Expansion Cards, High-Speed Computing Systems, Server and Data Center Hardware, Embedded Platforms, Networking Equipment, Industrial Computing, High-Bandwidth Digital Interfaces, Board-Level Interconnects Key Features High-density dual-row PCIe edge contacts Through-hole mounting for robust PCB attachment Gold-plated contact interface for reliable signal transmission Supports high-speed PCI Express signaling Compact, high-density design for space-constrained PCBs Long mechanical life with repeated mating cycles Compatible with standard PCI Express cards and connectors Reliable operation in industrial and commercial environments Ideal for embedded computing, server, and networking applications Ensures signal integrity for high-bandwidth data communication #PCIE06402XDTH #Samtec #PCIeConnector #EdgeConnector #BoardToBoard #HighSpeedInterconnect #HighDensityConnector #ThroughHole #IndustrialElectronics #EmbeddedSystems #ServerHardware #NetworkingEquipment #ElectronicComponents #PCBDesign #HighBandwidth #DataCommunication #PCIExpress #ExpansionCardConnector #MechanicalReliability #ElectronicInterconnect

FLASH - NOR Memory IC 128Mb (16M x 8) SPI - Quad I/O, QPI, DTR 133 MHz 8-SOIC 128M-bit Serial Flash Memory with uniform 4KB sectors and Dual/Quad SPI Winbond W25Q128JV is a 128-Mbit (16 MB) serial NOR Flash memory device designed for code and data storage in embedded systems. It supports standard SPI, Dual SPI, Quad SPI (QSPI), and Dual/Quad Peripheral Interface (DPI/QPI) modes, enabling high-speed data transfer rates up to 133 MHz clock operation and up to 532 MB/s equivalent throughput in Quad I/O DTR mode. The device supports Execute-In-Place (XIP), allowing processors and microcontrollers to run code directly from external flash memory without copying it to RAM. Features include 4 KB sector erase, 32 KB and 64 KB block erase, page programming, hardware/software write protection, security registers, JEDEC identification, SFDP support, suspend/resume operations, and low-power standby modes. Suitable for microcontrollers, FPGA configuration storage, IoT devices, industrial controllers, networking equipment, consumer electronics, and embedded systems requiring reliable non-volatile memory. Search Keywords: W25Q128JV, Winbond flash memory, SPI NOR Flash, QSPI Flash, Quad SPI memory, Serial Flash memory, 128Mbit Flash, 16MB Flash memory, Execute In Place XIP, external MCU flash, ESP32 flash memory, FPGA configuration memory, NOR flash storage, W25Q128, Dual SPI Flash, Quad I/O Flash, embedded nonvolatile memory, serial flash IC Hashtags: #W25Q128JV #Winbond #NORFlash #SPIMemory #QSPI #SerialFlash #FlashMemory #EmbeddedSystems #Microcontroller #ESP32 #FPGA #NonVolatileMemory #XIP #IoT #ElectronicsDesign #MemoryIC #FirmwareStorage #QuadSPI #EmbeddedHardware #ElectronicComponents