This is a module of ESP32-C3-MINI-1U based on the manufacturer's recommendations. On board we have an ESP module, USB C for firmware, 2 connectors with IOs and RGB LED #ESP32 #WiFi #LED #IoT #BLE #ARM #reusable #module #simple-embedded #espressif #sublayout

40A BLDC ESC for quadcopters, compatible with BLHeli_S firmware. Built around TPN2R703NL MOSFETs (45A continuous / 90A peak) driven by an MP1907 half-bridge gate driver. Flight-tested on a real quadcopter with brushless motors.

BNO086 - Accelerometer, Gyroscope, Magnetometer, Temperature, 9 Axis Sensor IC, SPI Output BNO086 is a 28-pin LGA 9-axis smart IMU SiP integrating a 3-axis accelerometer, 3-axis gyroscope, 3-axis magnetometer, temperature sensor, and CEVA SH-2 sensor-fusion firmware, with I²C, SPI, and UART host interfaces.

STN1110-IMM General Description The STN1110-IMM is a multiprotocol OBD-II to UART interpreter integrated circuit designed for automotive diagnostic, telematics, and vehicle communication applications. The device translates OBD-II network traffic into a UART serial data stream for communication with external microcontrollers, embedded processors, and host systems. It supports all legislated OBD-II protocols and provides compatibility with ELM327-based software while offering enhanced processing performance, expanded memory resources, advanced message filtering, firmware upgrade capability, and low-power operation. The device is intended for use in automotive diagnostic tools, fleet management systems, vehicle monitoring equipment, data acquisition systems, and embedded automotive communication products. Engineering Specification Part Number: STN1110-IMM Component Type: OBD-II to UART Interpreter Integrated Circuit Device Category: Automotive Communication Interface IC Package Type: QFN Mounting Type: Surface Mount Device (SMD) Interface Type: * UART * OBD-II Supported Protocols: * ISO 15765-4 CAN * ISO 14230-4 KWP2000 * ISO 9141-2 * SAE J1850 PWM * SAE J1850 VPW Key Features: * Multiprotocol OBD-II support * ELM327 command compatibility * Enhanced ST command extensions * High-speed UART communication * Advanced message filtering * Firmware upgrade capability * Large message buffering * Low-power operation * Automotive diagnostic interface functionality Applications: * OBD-II Scan Tools * Vehicle Diagnostics * Automotive Telematics * Fleet Management Systems * Data Logging Equipment * Embedded Automotive Controllers * Emissions Monitoring Systems * Vehicle Communication Gateways Tags #commonpartslibrary #integratedcircuit #ic #automotive #automotiveelectronics #automotivediagnostics #obdii #obd #uart #vehiclecommunication #telematics #embeddedsystems #communicationinterface #diagnosticinterface #scantool #canbus #kwp2000 #saej1850 #iso9141 #surfaceMount #smd #qfn #electroniccomponent #semiconductor #vehicleelectronics #microcontrollerinterface #datalogging #fleetmanagement #embeddedhardware #hardwaredesign

This project is a WiFi-enabled door and window sensor using the ESP8684-WROOM-02C module from Espressif Systems. It includes a triple-color LED indicator, Reed switch for detection, a 3.3V Regulatory mechanism, and USB C for firmware flashing. It's powered by a regular non-rechargeable AAA battery. #WiFi #MCU #ReferenceDesign #module #ESP8684 #reusable #module #simple-embedded #espressif #sublayout

This is a ESP8684-MINI-1U Module for easy and fast design. The minimum necessary for development is stored on the board. There is USB C with CH340 for firmware, EN, and BOOT buttons #IoT #WiFi #MCU #RF #ESP32 #reusable #module #simple-embedded #espressif #sublayout

The ESP32-C3FH4 is a highly integrated wireless microcontroller designed for Internet of Things, smart devices, industrial automation, consumer electronics, and embedded connectivity applications. It combines a low-power RISC-V processor with integrated Wi-Fi and Bluetooth Low Energy connectivity, providing a cost-effective and secure platform for wireless communication and edge computing. The device incorporates embedded flash memory, advanced security features, low-power operating modes, and a rich set of peripheral interfaces, making it suitable for battery-powered and always-connected systems. Its compact design and comprehensive software ecosystem enable rapid development of connected products while maintaining high reliability and energy efficiency. The ESP32-C3FH4 is widely used in smart sensors, home automation devices, wearable electronics, industrial monitoring systems, wireless control modules, and cloud-connected embedded products. Features Integrated RISC-V microcontroller core Built-in Wi-Fi connectivity Integrated Bluetooth Low Energy support Embedded flash memory Low-power operation for battery-powered applications Hardware cryptographic acceleration Secure boot capability Flash encryption support Multiple GPIO interfaces Integrated UART, SPI, I²C, I²S, PWM, and ADC peripherals Real-time processing capability Wireless networking and cloud connectivity support OTA firmware update support Compact surface-mount package Industrial-grade reliability Electrical Characteristics Wireless microcontroller architecture Integrated RF subsystem Low-power operating modes High-performance embedded processing Secure communication support Multi-protocol wireless connectivity Flexible peripheral expansion capability Optimized power consumption for IoT devices Applications Internet of Things devices Smart home automation Wireless sensor networks Industrial monitoring systems Asset tracking devices Wearable electronics Smart appliances Remote control systems Data acquisition platforms Edge computing applications Connected consumer products Embedded wireless gateways Package Information Surface-mount package Compact footprint for embedded applications Suitable for automated assembly processes Optimized thermal and electrical performance PCB-friendly package design #commonpartslibrary #integratedcircuit #microcontroller #wirelessconnectivity #wifi #bluetoothlowenergy #iot #embeddedsystems #espressif #smartdevices #industrialautomation #edgecomputing #wirelessmodule #internetofthings #electronicsdesign #riscv #embeddedelectronics #lowpowerdesign

IC RF TxRx + MCU Bluetooth Bluetooth v5.0 2.4GHz 32-VFQFN Exposed Pad nRF52810-QCAA-R is a multiprotocol ultra-low-power wireless System-on-Chip from Nordic Semiconductor designed for Bluetooth Low Energy and proprietary wireless communication applications. The device integrates a high-performance ARM Cortex-M processor, radio transceiver, memory resources, and peripheral interfaces into a compact package optimized for low-power embedded systems and IoT devices. This SoC supports reliable wireless connectivity with low energy consumption, making it suitable for wearable electronics, wireless sensors, smart home devices, industrial monitoring systems, and battery-powered portable applications. The integrated radio architecture provides stable RF performance with support for advanced wireless features, secure communication, and efficient coexistence in crowded RF environments. The nRF52810-QCAA-R includes multiple GPIOs, serial communication peripherals, timers, PWM functionality, analog interfaces, and low-power operating modes that simplify embedded hardware design and firmware development. Its compact package and optimized power profile make it ideal for space-constrained and energy-sensitive wireless applications. #commonpartslibrary #nordicsemiconductor #bluetoothlowenergy #wirelesssoc #iotdevices #embeddedhardware #rfdesign #lowpowerdesign #wearableelectronics #wirelesscommunication

2.4GHz -98dBm SMD,19.2x18mm RF Transceiver Modules and Modems RoHS The ESP32-WROOM-32UE-N16 is a 2.4 GHz wireless MCU module built around the ESP32 SoC. It combines a dual-core processor, integrated Wi-Fi (802.11 b/g/n) and Bluetooth 4.2 (Classic + BLE), along with rich peripherals. The “UE” variant specifically uses a U.FL / IPEX connector for an external antenna, making it ideal for applications that require better RF performance or flexible antenna placement (e.g., enclosed products or long-range communication). The “N16” indicates 16 MB external flash memory, suitable for large firmware, OTA updates, and data-heavy applications. Processing Dual-core Xtensa LX6 32-bit CPU Clock speed up to 240 MHz Memory 16 MB Flash (N16 variant) ~520 KB SRAM + 448 KB ROM Connectivity Wi-Fi: 802.11 b/g/n (up to 150 Mbps) Bluetooth: v4.2 (BR/EDR + BLE) Frequency: 2.4 GHz band Antenna External antenna via U.FL connector Better range and flexibility vs PCB antenna Interfaces / Peripherals GPIO (≈26 usable pins) UART, SPI, I2C, I2S, SDIO ADC, DAC PWM (LED & motor control) Capacitive touch sensing Security Hardware encryption: AES, SHA, RSA Secure boot & flash encryption support Power Operating voltage: 3.0V – 3.6V (typ. 3.3V) Multiple low-power modes for battery applications Environmental Operating temperature: -40°C to +85°C Physical Surface-mount module (~38 pins / 52 pads depending on reference) Compact and RF-shielded design Typical Applications Smart home devices (IoT) Industrial automation Wireless sensors and data loggers Wearables and consumer electronics Remote monitoring systems #Module #ESP32

Bluetooth, WiFi 802.11b/g/n, Bluetooth v5.0 Transceiver Module 2.402GHz ~ 2.48GHz Antenna Not Included Surface Mount The ESP32-C3 is a low-power, highly integrated 32-bit microcontroller (MCU) from Espressif Systems that combines 2.4 GHz Wi-Fi and Bluetooth® 5 Low Energy (BLE) connectivity in a single chip. Built around a single-core RISC-V processor running at up to 160 MHz, it is designed for secure, cost-effective IoT and embedded applications. The ESP32-C3 offers excellent wireless performance, low power consumption, robust security features, and a rich set of peripherals, making it ideal for smart home devices, industrial automation, wearable electronics, wireless sensors, and consumer IoT products. Key Features 32-bit RISC-V single-core CPU running up to 160 MHz Integrated 2.4 GHz Wi-Fi (802.11 b/g/n) and Bluetooth® 5 LE Low-power architecture with multiple sleep modes for battery-powered devices Advanced security features including Secure Boot, Flash Encryption, AES, SHA, RSA, HMAC, and hardware random number generator (RNG) Rich peripheral set including GPIO, UART, SPI, I²C, I²S, PWM, ADC, TWAI (CAN), USB Serial/JTAG, and timers Supports external QSPI flash memory and OTA (Over-the-Air) firmware updates Compact package options suitable for space-constrained embedded designs Fully supported by the ESP-IDF, Arduino, and MicroPython development ecosystems #ESP32C3 #Espressif #RISCV #WiFi #BluetoothLE #IoT #EmbeddedSystems #Microcontroller #WirelessMCU #LowPower #SmartHome #IndustrialIoT #SecureMCU #EdgeComputing #FirmwareDevelopment

ARM® Cortex®-A7 Microprocessor IC STM32MP1 2 Core, 32-Bit 209MHz, 650MHz 361-TFBGA (12x12) # Engineering Specification ## Product Name STM32MP157CAC3 ## General Description STM32MP157CAC3 is a high-performance microprocessor unit that combines application processing and real-time control capabilities within a single integrated circuit. The device is designed to support advanced embedded systems requiring a balance of computing performance, deterministic control, multimedia processing, connectivity, and security functionality. The component integrates multi-core processing resources, memory interfaces, graphics capabilities, peripheral controllers, and communication subsystems to enable the development of sophisticated embedded platforms. Its heterogeneous architecture allows high-level operating systems and real-time firmware to operate simultaneously, supporting applications that require both user-interface functionality and low-latency control. The device is intended for industrial automation, human-machine interface systems, edge computing platforms, communication equipment, medical devices, smart infrastructure, and Internet of Things applications. Its architecture enables consolidation of system functions, reducing component count and simplifying overall hardware design. The design emphasizes processing efficiency, system scalability, power management, security, and long-term reliability. It supports advanced software ecosystems and facilitates the development of connected embedded products with graphical interfaces, networking capabilities, and real-time operational control. ## Functional Requirements ### Application Processing The device shall provide application-level processing capabilities suitable for operating systems, middleware, and user applications. ### Real-Time Processing The device shall support deterministic control functions for time-critical embedded operations. ### Multimedia Support The component shall support graphical and multimedia processing functions for display and user-interface applications. ### System Integration The device shall integrate processing, communication, and peripheral functions within a unified embedded computing platform. ## Electrical Requirements ### Power Management The device shall support efficient power operation and multiple power management modes to optimize energy consumption. ### Memory Interface Support The component shall support external memory devices for program execution, data storage, and system operation. ### Peripheral Connectivity The device shall provide interfaces for communication, control, monitoring, and external subsystem integration. ### Signal Integrity The design shall support reliable operation across supported interface standards and operating conditions. ## Processing Architecture Requirements ### Multi-Core Operation The device shall support concurrent execution of application and real-time workloads through integrated processing resources. ### Operating System Support The architecture shall support embedded operating systems and software frameworks suitable for advanced application development. ### Security Features The device shall support hardware-based mechanisms intended to protect system integrity, software assets, and sensitive data. ### Resource Management The component shall support efficient allocation of processing, memory, and peripheral resources. ## Mechanical Requirements ### Surface Mount Construction The device shall be supplied in a high-density surface mount package suitable for automated manufacturing processes. ### PCB Integration The package shall support integration into multilayer printed circuit boards designed for high-performance embedded systems. ### Structural Integrity The device shall maintain electrical and mechanical reliability during assembly and operational service life. ## Environmental Requirements ### Operating Conditions The component shall operate reliably within environmental conditions commonly encountered in industrial and embedded applications. ### Thermal Performance The device shall support stable operation under sustained processing workloads and associated thermal conditions. ### Storage and Handling The component shall maintain physical and electrical integrity during transportation, storage, and manufacturing processes. ## Quality Requirements ### Reliability The device shall provide dependable long-term operation in embedded and industrial computing environments. ### Verification Processing, peripheral, communication, and system functions shall be validated through applicable testing and qualification procedures. ### Compliance The product shall conform to relevant semiconductor, quality, and embedded computing standards applicable to its intended use. ## Documentation Requirements Technical documentation shall include processor architecture information, hardware integration guidelines, memory interface recommendations, power management considerations, software development support, security features, and application design guidance. ## Classification Tags #STM32MP157CAC3 #STM32MP1 #Microprocessor #MPU #EmbeddedProcessor #ARMProcessor #EmbeddedLinux #RealTimeControl #IndustrialAutomation #HumanMachineInterface #EdgeComputing #IoTGateway #EmbeddedSystems #SystemOnChip #SoC #ApplicationProcessor #GraphicsProcessor #ConnectivityPlatform #IndustrialElectronics #PCBDesign #HardwareDevelopment #ElectricalEngineering #CommonPartsLibrary #ComponentLibrary #EngineeringSpecification #TechnicalDocumentation #SystemIntegration #SecureEmbeddedSystems #MulticoreProcessing

USB-to-UART Bridge CP2102N-A02-GQFN24 is a highly integrated USB-to-UART bridge controller from Silicon Labs. It provides a simple and cost-effective way to add USB connectivity to embedded systems by converting USB 2.0 Full-Speed communication into a standard UART interface. The device integrates the USB transceiver, oscillator, voltage regulator, and UART controller, minimizing external components and eliminating the need for USB firmware development. It is commonly used in microcontroller programming interfaces, industrial equipment, POS terminals, data loggers, and USB-to-serial adapters. Key Features USB 2.0 Full-Speed compliant (12 Mbps) interface. USB-to-UART bridge with data rates up to 3 Mbaud. Integrated USB transceiver; no external USB resistors required. Integrated oscillator; no external crystal required. On-chip 3.3 V voltage regulator. USB Battery Charger Detection (BC 1.2) support. Remote wakeup capability from USB suspend state. Low operating current of approximately 9.5 mA. Hardware and software flow control support. Internal configurable ROM for Vendor ID, Product ID, serial number, and USB descriptors. Royalty-free Virtual COM Port (VCP) drivers available for major operating systems. Operating temperature range: −40°C to +85°C. Compact 24-pin QFN (4 mm × 4 mm) package. Typical Applications USB-to-Serial adapters Microcontroller programming and debugging interfaces Industrial automation equipment Point-of-sale (POS) terminals Medical instruments Data acquisition and logging systems Embedded systems requiring USB connectivity #commonpartslibrary #integratedcircuit

ESP32-S3-WROOM-1-N8 is a high-performance Wi-Fi and Bluetooth Low Energy (BLE) module from Espressif Systems. It is built around the ESP32-S3 SoC, featuring a dual-core Xtensa LX7 processor, integrated 2.4 GHz Wi-Fi and Bluetooth 5 LE connectivity, 8 MB SPI flash memory, and a PCB antenna. The module is optimized for AIoT, edge computing, human-machine interfaces, smart devices, and industrial IoT applications. Key Features Dual-core Xtensa® LX7 CPU running up to 240 MHz for high-performance embedded applications. 8 MB onboard SPI Flash (N8 variant) for firmware and data storage. 2.4 GHz Wi-Fi (802.11 b/g/n) with data rates up to 150 Mbps. Bluetooth 5 LE support including: Long Range mode 2 Mbps PHY Bluetooth Mesh Extended Advertising AI acceleration support through ESP32-S3 vector instructions for machine learning and signal-processing workloads. USB 1.1 OTG and USB Serial/JTAG integrated, simplifying debugging and USB device applications. Up to 45 GPIOs with extensive peripheral support: SPI I²C I²S UART PWM ADC Touch Sensors TWAI® (CAN-compatible) Camera Interface LCD Interface SDIO Host MCPWM Integrated 40 MHz crystal oscillator, RF matching circuitry, and PCB antenna for reduced external component count. Operating voltage range: 3.0 V to 3.6 V. Compact surface-mount module suitable for space-constrained designs. Typical Applications Smart home and home automation devices HMI displays and touchscreen products Voice recognition and audio processing Edge AI and machine learning applications Industrial IoT gateways and sensors Video streaming and camera systems USB-connected embedded devices Smart agriculture and healthcare equipment N8 specifically indicates 8 MB Flash and no PSRAM, making it a good choice for applications requiring substantial program storage but not large external RAM. #RF-transceiver #Module #ESP32

SPI Flash Serial Flash Memory with Dual/Quad SPI The W25Q16JVUXIQ is a 16-Mbit (2-MByte) Serial NOR Flash memory device from Winbond. It is designed for embedded systems that require non-volatile code and data storage with minimal pin count, low power consumption, and high-speed access. The device supports standard SPI, Dual SPI, and Quad SPI interfaces, making it suitable for firmware storage, boot memory, IoT devices, microcontrollers, consumer electronics, and execute-in-place (XIP) applications. Key Features 16-Mbit (2-MByte) Flash Memory Capacity Operating Voltage: 2.7 V to 3.6 V Standard SPI, Dual SPI, and Quad SPI Interface Support Maximum SPI Clock Frequency: 133 MHz Equivalent Data Transfer Rates: 266 MHz (Dual SPI) 532 MHz (Quad SPI) Continuous Read and XIP (Execute-In-Place) Capability 4 KB Sector Erase, 32 KB Block Erase, 64 KB Block Erase, and Chip Erase 256-Byte Programmable Page Size Minimum 100,000 Program/Erase Cycles per Sector More Than 20 Years Data Retention Ultra-Low Power Consumption Typical power-down current below 1 µA 64-Bit Unique Serial Number Three 256-Byte Security Registers with OTP Protection JEDEC ID and SFDP Support Software and Hardware Write Protection Operating Temperature Options up to +85°C and +105°C Compact 8-Pad USON Package (2 mm × 3 mm) suitable for space-constrained designs #CommonPartsLibrary #IntegratedCircuit #Memory

Authentication Chip 8-UDFN (2x3) The ATECC608B-MAHDA-S is a secure authentication and cryptographic co-processor designed for hardware-based security, device authentication, encrypted communication, and secure key storage in embedded systems and IoT applications. The device integrates advanced cryptographic functionality with protected non-volatile memory to provide a secure root of trust for connected devices. The integrated security engine supports public key cryptography, secure boot validation, message authentication, key generation, digital signatures, and encrypted data exchange. The device is optimized for low-power embedded applications requiring protection against counterfeiting, unauthorized access, firmware tampering, and network-based attacks. The ATECC608B-MAHDA-S supports industry-standard cryptographic algorithms and secure provisioning workflows, enabling secure authentication in cloud-connected systems, industrial automation, consumer electronics, and automotive embedded platforms. The compact surface-mount package and low-power operation make the device suitable for highly integrated embedded designs where hardware security and identity protection are critical requirements. Key Features Hardware-based cryptographic security device Secure key storage and management Integrated authentication engine Public key cryptography support Secure boot and firmware validation capability Digital signature generation and verification Hardware random number generator Encrypted communication support Tamper-resistant key protection Secure provisioning and device identity management Low-power operation for embedded systems I2C serial communication interface Compact surface-mount package IoT and cloud authentication support Electrical Characteristics Secure non-volatile key storage architecture Low operating power consumption Hardware cryptographic acceleration Secure internal key isolation Fast authentication processing capability Wide operating voltage support Industrial temperature operation compatibility High-reliability embedded security implementation Applications IoT device authentication Secure embedded systems Cloud-connected devices Secure boot implementations Firmware integrity verification Industrial automation systems Smart home products Medical electronics Automotive embedded security Asset tracking and identification Anti-counterfeiting systems Encrypted communication platforms Package Information Package Type: SOIC Mounting Type: Surface Mount Compact embedded security package RoHS compliant configuration available #commonpartslibrary #integratedcircuit #securityic #cryptography #iotsecurity #embeddedhardware #authentication #secureboot #hardwaresecurity #encryptedcommunication

USB-to-UART Bridge CP2102N CP2102N-A02-GQFN28R is a highly integrated USB-to-UART bridge controller from Silicon Labs that provides a simple and reliable interface between a USB host and an embedded system using a UART serial port. It eliminates the need for complex USB firmware development by handling all USB protocol functions internally and presenting a standard UART interface to the target device. The device is commonly used in microcontroller programming, debugging, industrial equipment, IoT devices, and USB-to-serial adapters. logging equipment Consumer and portable electronics Function: USB-to-UART Bridge Controller

Multi-Band CAT-M and NB-loT Module The SIM7080G is Multi-Band CAT-M and NB-IoT module solution in a SMT type . It has strong extension capability with rich interfaces including UART, GPIO, PCM, SPI, I2C etc. The module provides much flexibility and ease of integration for customer's application. It is designed for applications that need low latency, Low throughput data communication in a variety of radio propagation conditions. Due to the unique combination of performance, security and flexibility, this module is ideally suited for M2M applications, such as metering, asset tracking, remote monitoring , E-health etc.. LTE Cat-M1 and NB-IoT Dual Mode Supports both LTE Cat-M1 (eMTC) and NB-IoT communication technologies. Complies with 3GPP Release 14 standards. Global Multi-Band Support Covers a wide range of global LTE frequency bands for worldwide deployment. Ultra-Low Power Operation Supports Power Saving Mode (PSM) and Extended Discontinuous Reception (eDRX). Enables battery lifetimes of up to 10 years in low-duty-cycle applications. Integrated GNSS Positioning Supports GNSS navigation capabilities including GPS and other satellite systems for location-based applications. Rich Peripheral Interfaces UART USB GPIO SPI I²C ADC PCM/I²S SIM card interface Comprehensive Internet Protocol Support TCP/IP UDP HTTP/HTTPS FTP MQTT CoAP LwM2M TLS/DTLS security protocols Firmware Update Support FOTA (Firmware Over-The-Air) USB firmware upgrade capability. Compact SMT Package 77-pin LCC+LGA package Dimensions: 17.6 mm × 15.7 mm × 2.3 mm Compatible footprint with the SIM868 module family. Industrial Operating Temperature Operating range: −40°C to +85°C. #Module #RF-Transceiver