2-Position Vertical Through-Hole Male Pin Header – Single-row unshrouded PCB header designed for board-to-board interconnects, wire-to-board connections, industrial controls, embedded systems, instrumentation, development boards, prototyping, and general-purpose electronic applications. The Würth Elektronik 61300211121 is part of the WR-PHD Series, featuring 2 male pins on a 2.54 mm (0.100") pitch with a vertical through-hole mounting configuration. It utilizes square copper alloy contacts with gold-plated mating surfaces, providing excellent conductivity, corrosion resistance, and long-term reliability. The connector features a 6.00 mm mating pin length, 3.00 mm PCB post length, 11.54 mm overall contact length, push-pull mating, and a UL94 V-0 rated PA6T (Nylon 6T) black insulator. Rated for 3 A and 250 V, it operates over a −40°C to +105°C temperature range, making it ideal for reliable embedded, industrial, and prototyping applications. #WurthElektronik #61300211121 #WRPHD #MaleHeader #PinHeader #ThroughHoleConnector #BoardToBoard #254mmPitch #IndustrialElectronics #EmbeddedSystems #PCBConnector

USB-C (USB TYPE-C) Receptacle Connector 24 Position Panel Mount, Through Hole, Right Angle The MUSBRM1C1M0 is a ruggedized USB Type-C receptacle connector designed for high-reliability data and power connectivity in industrial, embedded, transportation, and harsh-environment applications. The connector features a reversible USB Type-C interface that supports modern high-speed communication protocols while providing robust mechanical durability and secure board-level attachment. Its reinforced construction helps withstand vibration, shock, and repeated mating cycles, making it suitable for demanding applications where reliability and long service life are critical. The device is commonly used in industrial controllers, communication equipment, medical devices, consumer electronics, and next-generation embedded systems requiring compact and versatile connectivity. Engineering Specifications Manufacturer: Amphenol Communications Solutions Part Number: MUSBRM1C1M0 Connector Type: USB Type-C Receptacle Interface Standard: Universal Serial Bus Type-C Connector Gender: Receptacle Mounting Style: Surface Mount Orientation: Right Angle Contact Configuration: USB Type-C Multi-Function Interface Data Support: High-Speed Data Transmission Power Delivery Support: Compatible with USB Power Delivery Architectures Shielding: Integrated EMI Shielding Contact Material: Copper Alloy Contact Finish: Gold-Plated Contact Interface Housing Material: High-Strength Metal Shield Construction Durability: High Mating Cycle Life Environmental Performance: Designed for Industrial Applications Operating Temperature Range: Industrial Grade RoHS Compliant: Yes Applications: Embedded Systems, Industrial Automation, Consumer Electronics, Communication Equipment, Medical Devices, IoT Products, Portable Electronics, Data Acquisition Systems Key Features Reversible USB Type-C connection interface Ruggedized mechanical construction High-speed data communication capability Secure PCB mounting design Enhanced resistance to vibration and mechanical stress Integrated shielding for improved electromagnetic compatibility Compact footprint for space-constrained designs Supports modern USB power and data architectures Long operational lifespan with high insertion cycle durability Suitable for industrial and commercial electronic systems #MUSBRM1C1M0 #Amphenol #USBTypeC #USBConnector #TypeCReceptacle #HighSpeedConnectivity #PowerDelivery #IndustrialElectronics #EmbeddedSystems #CommunicationEquipment #IoTDevices #ConsumerElectronics #PCBDesign #ElectronicComponents #SurfaceMount #DataTransmission #USBPD #IndustrialAutomation #MedicalElectronics #ConnectorTechnology

Phase Lock Loop (PLL) IC 2.4MHz 1 16-DIP (0.300", 7.62mm) CD4046BE is a CMOS Micropower Phase-Locked Loop (PLL) integrated circuit that combines a linear Voltage-Controlled Oscillator (VCO), two phase comparators, a source follower, and a Zener diode in a single package. It is designed for frequency synthesis, frequency detection, FM demodulation, clock recovery, motor speed control, and other synchronization applications. The device operates over a wide supply voltage range and offers low power consumption, high noise immunity, and excellent VCO linearity. Key Features Wide operating supply voltage range: 3 V to 18 V Integrated Voltage-Controlled Oscillator (VCO) Two selectable phase comparators for flexible PLL design Operating frequency range up to approximately 1.4 MHz Very low power consumption High VCO linearity (typically <1%) Low frequency drift with temperature VCO inhibit control for ON/OFF keying applications Built-in source follower output for demodulation applications High noise immunity characteristic of CMOS technology Available in 16-pin PDIP (CD4046BE) package Typical Applications Frequency synthesis and multiplication FM modulation and demodulation Frequency discrimination Clock recovery and data synchronization Tone decoding Voltage-to-frequency conversion FSK modulation/demodulation Motor speed control systems Signal tracking and phase synchronization circuits Hashtags #CD4046BE #PLL #PhaseLockedLoop #VCO #ClockRecovery #FrequencySynthesizer #FMDemodulator #FSKModulation #CMOS #TexasInstruments #AnalogIC #TimingIC #SignalProcessing #EmbeddedSystems #ElectronicsDesign

Audio D/A Converter ICs 2VRMS DirectPath Aud io Stereo DAC 20-TSSOP The PCM5102AQPWRQ1 specification defines the engineering requirements for an automotive-grade digital-to-analog audio converter integrated circuit intended for high-performance digital audio applications. The specification establishes the functional, electrical, mechanical, thermal, and quality requirements necessary to ensure reliable conversion of digital audio signals into high-fidelity analog outputs. It serves as the governing technical reference for component selection, system integration, manufacturing, verification, and quality assurance throughout the product lifecycle. The device is designed to provide high-resolution audio performance with low distortion, low noise, and stable operation under automotive environmental conditions. It is suitable for use in infotainment systems, digital audio processing equipment, communication systems, and other embedded electronic applications requiring reliable digital-to-analog signal conversion. Engineering Requirements The component shall be manufactured using qualified semiconductor fabrication processes and approved materials to ensure consistent electrical performance, mechanical integrity, and long-term reliability. The device shall comply with applicable automotive qualification requirements and maintain stable operation within its specified voltage, temperature, and environmental operating ranges. Electrical performance shall meet the specified requirements for signal integrity, dynamic range, total harmonic distortion, noise performance, and output accuracy. The package shall be compatible with standard surface-mount assembly processes and shall withstand soldering and handling conditions without degradation. Workmanship shall be free from physical defects, contamination, package damage, or manufacturing irregularities that could affect functionality or reliability. Inspection, testing, and validation shall be performed using calibrated equipment and controlled procedures to verify compliance with all applicable engineering and quality requirements. Any deviation from this specification shall require formal engineering evaluation, documented technical justification, and approved change authorization prior to implementation. Documentation Supporting documentation shall include engineering drawings, electrical specifications, qualification reports, material declarations, inspection records, manufacturing documentation, and revision-controlled technical files. All documentation shall be maintained in accordance with established engineering configuration management and quality control procedures. Revision Control Changes to this specification shall be managed through the formal engineering change control process. All revisions shall undergo technical review, validation, and approval to ensure continued compliance with design intent, automotive quality standards, and applicable regulatory requirements. #EngineeringSpecification #AutomotiveElectronics #DigitalToAnalogConverter #AudioEngineering #EmbeddedSystems #QualityAssurance #Semiconductor #EngineeringDocumentation #Compliance #CommonPartsLibrary #IntegratedCircuit #Data-Acquisition #ADCs #DACs #PCM5102

Touchscreen Controller 2 Wire Capacitive I2C Interface 20-VQFN (3x3) The MTCH2120-V/REB specification defines the engineering requirements for a capacitive touch sensing controller integrated circuit designed for human-machine interface applications in embedded electronic systems. This specification establishes the functional, electrical, mechanical, environmental, and quality requirements necessary to ensure accurate touch detection, stable system performance, and reliable operation across consumer, industrial, and embedded environments. The device is intended for use in applications requiring touch-based user input such as control panels, interface buttons, and capacitive sensing surfaces. It provides robust sensing performance with immunity to noise and environmental variation, enabling reliable detection of touch events in compact and low-power electronic designs. Engineering Requirements The integrated circuit shall be manufactured using qualified semiconductor fabrication processes to ensure consistent sensing performance, low power consumption, and long-term operational stability. The device shall support reliable capacitive touch detection under defined electrical and environmental conditions without degradation of sensitivity or accuracy. The sensing architecture shall provide stable touch event detection with immunity to electrical noise, environmental interference, and parasitic capacitance variations. The system shall maintain consistent performance across intended operating conditions including temperature variation and supply voltage fluctuation. Electrical characteristics shall ensure stable digital communication, accurate sensing response, and reliable operation during startup, normal operation, and power transitions. The device shall maintain functional integrity during dynamic system conditions without false triggering or loss of sensitivity. Mechanical and package construction shall be suitable for surface-mount assembly and shall ensure robustness during soldering, handling, and long-term operation. Workmanship shall be free from defects such as contamination, cracks, bonding issues, or structural inconsistencies that could impact electrical or mechanical reliability. Inspection, validation, and testing shall be performed using controlled procedures and calibrated equipment to ensure compliance with all applicable engineering and quality requirements. Any deviation from this specification shall require formal engineering review, documented justification, and approval through established change control processes. Documentation Supporting documentation shall include official datasheets, reference design materials, electrical characterization reports, qualification data, inspection records, and revision-controlled manufacturing documentation. All documentation shall be maintained under formal configuration management and quality assurance systems to ensure traceability and consistency. Revision Control All modifications to this specification shall be managed through formal engineering change control procedures. Each revision shall undergo technical evaluation, validation, and approval prior to implementation to ensure continued compliance with design intent and applicable standards. #EngineeringSpecification #CapacitiveTouch #HMI #MicrochipTechnology #EmbeddedSystems #UserInterface #SensorIC #LowPowerDesign #ElectronicsDesign #QualityAssurance #EngineeringDocumentation

6-Position Vertical Through-Hole Male Pin Header – Single-row unshrouded PCB header designed for board-to-board interconnects, wire-to-board connections, industrial controls, embedded systems, instrumentation, development boards, and general-purpose electronic applications. The Samtec TSW-106-07-G-S is part of the TSW Series, featuring 6 male pins on a 2.54 mm (0.100") pitch with a vertical through-hole mounting configuration. It utilizes square phosphor bronze contacts with 10 µin (0.25 µm) gold plating on the mating area and 3 µin (0.076 µm) gold plating on the posts, providing excellent conductivity, corrosion resistance, and long-term reliability. The connector features a 5.84 mm mating pin length, 2.54 mm post length, 10.92 mm overall contact length, push-pull mating, and a UL94 V-0 rated black PBT insulator. It operates over a −55°C to +125°C temperature range, making it ideal for reliable embedded, industrial, and prototyping applications. #Samtec #TSW10607GS #TSWSeries #MaleHeader #PinHeader #ThroughHoleConnector #BoardToBoard #254mmPitch #IndustrialElectronics #EmbeddedSystems #PCBConnector

QFN-68-EP(7x7) Power Management - Specialized RoHS The RK809-5 is a highly integrated Power Management Integrated Circuit (PMIC) from Rockchip designed for multi-core processor systems and embedded applications. It provides a complete power management solution by integrating multiple high-efficiency DC-DC buck converters, LDO regulators, power sequencing logic, battery fuel gauging, RTC functionality, and audio codec capabilities into a single device. The RK809-5 is commonly used alongside Rockchip SoCs in single-board computers, tablets, AIoT devices, and industrial embedded systems. Key Features Five high-efficiency synchronous buck converters with fast transient response. Nine low-dropout (LDO) voltage regulators for powering sensitive analog and digital circuits. Integrated battery fuel gauge for battery capacity monitoring. Configurable power-up and power-down sequencing (OTP programmable). Dynamic Voltage Scaling (DVS/DVFS) support via I²C interface. Integrated Real-Time Clock (RTC) with 32.768 kHz crystal oscillator support. Two integrated load switches for peripheral power control. Over-current, over-voltage, and thermal protection features. Built-in audio CODEC with headphone driver and Class-D amplifier support. Designed to minimize external component count and simplify power system design. QFN-68-EP (7 mm × 7 mm) package. #RK8095 #RK809 #Rockchip #PMIC #PowerManagementIC #BatteryManagement #AudioCodec #RTC #DVFS #EmbeddedSystems #SingleBoardComputer #IoT #IndustrialElectronics #PowerSupplyDesign #ElectronicsEngineering

Bluetooth, WiFi 802.11b/g/n/ax, Bluetooth v5.4 Transceiver Module 2.4GHz Integrated, Chip Surface Mount Silicon Labs SiWG917 module is our lowest power Wi-Fi 6 plus Bluetooth LE 5.4, ideal for ultra-low power IoT wireless devices using Wi-Fi®, Bluetooth, Matter, and IP networking for secure cloud connectivity. It is optimal for developing battery operated devices that need long battery life. SiWG917 module includes an ultra-low power Wi-Fi 6 plus Bluetooth Low Energy (LE) 5.4 wireless CPU subsystem, and an integrated micro-controller (MCU) application subsystem, security, peripherals and power management subsystem all in a single 16 x 21.1 x 2.3 mm package. The wireless subsystem consists of a multi-threaded Network Wireless Processor (NWP) running up to 160 MHz, baseband digital signal processing, analog front end, 2.4 GHz RF transceiver and integrated power amplifier. The application subsystem consists of an ARM® Cortex®-M4 running up to 180 MHz, embedded SRAM, flash, ultra-low power sensor hub, and matrix vector processor. The ARM® Cortex®-M4 is dedicated for peripheral and application-related processing, while the NWP runs the wireless and networking stacks on independent threads, thus providing a fully integrated solution that is ready for a wide range of embedded wireless IoT applications. The modules come with modular radio type approvals for various countries, including USA (FCC), Canada (IC/ISED) and Japan (MIC), and are in compliance with the relevant EN standards (including EN 300 328 v2.2.2) for the conformity with the directives and regulations in EU and UK. KEY FEATURES • Wi-Fi 6 Single Band 2.4 GHz 20 MHz 1x1 stream IEEE 802.11 b/g/n/ax • Bluetooth LE 5.4 • Single chip Matter Over Wi-Fi Solution • ARM® Cortex® M4 Processor with FPU subsystem up to 180 MHz with rich set of Digital and Analog Peripherals. • Wi-Fi 6 Benefits: TWT for improved efficiency and longer battery life, MUMIMO/OFDMA for Higher Throughput, network capacity and low latency • Best in Class Device and Wireless Security • WLAN Tx power up to +17.5 dBm with integrated PA • Bluetooth LE Tx power up to +17 dBm with integrated PA • WLAN Rx sensitivity as low as -95.5 dBm • Wi-Fi 4 Standby Associated mode current: 71 μA @ 1-second listen interval • Embedded Flash option up to 8 MB/ optional external Flash up to 16 MB • Embedded PSRAM option up to 2 MB/ optional external PSRAM option up to 16 MB • Ultra-low power sensor hub peripherals • Matrix Vector Processor (MVP) • Embedded Wi-Fi, Bluetooth LE, Matter, and networking stacks supporting wireless coexistence • Three software-configurable MCU application memory options for sharing the RAM between the wireless, system, and application (192/256/320 KB) • Operating temperature: -40 to +85 ºC • Operating supply range: 3.0 to 3.63 V • Supply voltage for GPIOs: 1.71 to 3.63 V #WiFi6 #BluetoothLE54 #IoTModule #WirelessSoC #SiliconLabs #EmbeddedSystems #SmartHome #IndustrialIoT #LowPowerDesign #RFModule #ConnectedDevices #EdgeComputing #MatterReady #PCBDesign #ElectronicsEngineering